DMN65D8LDW [DIODES]

Dual N-Channel MOSFET;
DMN65D8LDW
型号: DMN65D8LDW
厂家: DIODES INCORPORATED    DIODES INCORPORATED
描述:

Dual N-Channel MOSFET

文件: 总6页 (文件大小:535K)
中文:  中文翻译
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DMN65D8LDW  
DUAL N-CHANNEL ENHANCEMENT MODE MOSFET  
Product Summary  
Features  
Dual N-Channel MOSFET  
ID  
V(BR)DSS  
RDS(ON)  
Package  
TA = +25°C  
170mA  
200mA  
Low On-Resistance  
8Ω @ VGS = 5V  
6Ω @ VGS = 10V  
Low Gate Threshold Voltage  
60V  
SOT363  
Low Input Capacitance  
Fast Switching Speed  
Small Surface Mount Package  
Description  
ESD Protected Gate, 1KV (HBM)  
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)  
Halogen and Antimony Free. “Green” Device (Note 3)  
Qualified to AEC-Q101 Standards for High Reliability  
This new generation MOSFET is designed to minimize the on-state  
resistance (RDS(ON) and yet maintain superior switching  
)
performance, making it ideal for high efficiency power management  
applications.  
Mechanical Data  
Applications  
Case: SOT363  
DC-DC Converters  
Case Material: Molded Plastic; UL Flammability Classification  
Rating 94V-0  
Power Management Functions  
Battery Operated Systems and Solid-State Relays  
Drivers: Relays, Solenoids, Lamps, Hammers, Displays,  
Memories, Transistors, etc.  
Moisture Sensitivity: Level 1 per J-STD-020  
Terminals: Solderable per MIL-STD-202, Method 208  
e3  
Lead Free Plating (Matte Tin Finish Annealed over Alloy 42  
Leadframe).  
Terminal Connections: See Diagram  
Weight: 0.006 grams (Approximate)  
D2  
G1  
S1  
SOT363  
S2  
G2  
D1  
ESD PROTECTED TO 1kV  
Top View  
Internal Schematic  
Top View  
Ordering Information (Note 4)  
Part Number  
DMN65D8LDW-7  
Case  
SOT363  
Packaging  
3,000/Tape & Reel  
Notes:  
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.  
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"  
and Lead-free.  
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and  
<1000ppm antimony compounds.  
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html  
Marking Information  
MM1= Product Type Marking Code  
MM1 YM  
M Y 1 M M  
MM1 YM  
M Y 1 M M  
YM = Date Code Marking for SAT (Shanghai Assembly/ Test site)  
YM = Date Code Marking for CAT (Chengdu Assembly/ Test site)  
Y or Y = Year (ex: A = 2013)  
M = Month (ex: 9 = September)  
Date Code Key  
Year  
2007  
2008  
2009  
2010  
2011  
2012  
2013  
2014  
2015  
2016  
2017  
2018  
Code  
U
V
W
X
Y
Z
A
B
C
D
E
F
Month  
Code  
Jan  
1
Feb  
2
Mar  
3
Apr  
4
May  
5
Jun  
6
Jul  
7
Aug  
8
Sep  
9
Oct  
O
Nov  
N
Dec  
D
1 of 6  
www.diodes.com  
February 2015  
© Diodes Incorporated  
DMN65D8LDW  
Document number: DS35500 Rev. 8 - 2  
DMN65D8LDW  
Maximum Ratings (@TA = +25°C, unless otherwise specified.)  
Characteristic  
Symbol  
VDSS  
Value  
Units  
Drain-Source Voltage  
Gate-Source Voltage  
Steady  
60  
V
V
±20  
VGSS  
TA = +25°C  
TA = +70°C  
TA = +25°C  
TA = +70°C  
TA = +25°C  
TA = +70°C  
TA = +25°C  
TA = +70°C  
180  
140  
mA  
mA  
mA  
Continuous Drain Current (Note 5)  
Continuous Drain Current (Note 5)  
Continuous Drain Current (Note 6)  
Continuous Drain Current (Note 6)  
VGS = 10V  
VGS = 5V  
VGS = 10V  
VGS = 5V  
ID  
ID  
ID  
State  
Steady  
State  
150  
120  
Steady  
State  
200  
160  
Steady  
State  
170  
140  
mA  
mA  
ID  
Pulsed Drain Current (10µs pulse, duty cycle = 1%)  
800  
IDM  
Thermal Characteristics  
Characteristic  
Total Power Dissipation (Note 5)  
Symbol  
PD  
Value  
Units  
300  
435  
mW  
°C/W  
mW  
Thermal Resistance, Junction to Ambient (Note 5)  
Total Power Dissipation (Note 6)  
RθJA  
400  
PD  
Thermal Resistance, Junction to Ambient (Note 6)  
Thermal Resistance, Junction to Case (Note 6)  
Operating and Storage Temperature Range  
330  
°C/W  
°C/W  
°C  
RθJA  
139  
RθJC  
TJ, TSTG  
-55 to +150  
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)  
Characteristic  
OFF CHARACTERISTICS (Note 7)  
Drain-Source Breakdown Voltage  
Zero Gate Voltage Drain Current  
Symbol  
Min  
Typ  
Max  
Unit  
Test Condition  
VGS = 0V, ID = 250µA  
60  
V
BVDSS  
IDSS  
1.0  
5.0  
TJ = +25°C  
µA  
µA  
VDS = 60V, VGS = 0V  
VGS = ±20V, VDS = 0V  
TJ = +125°C (Note 8)  
Gate-Body Leakage  
±5.0  
IGSS  
ON CHARACTERISTICS (Note 7)  
Gate Threshold Voltage  
1.0  
2.0  
8
V
VGS(th)  
VDS = VGS, ID = 250µA  
VGS = 5.0V, ID = 0.115A  
VGS = 10.0V, ID = 0.115A  
VDS = 10V, ID = 0.115A  
VGS = 0V, IS = 115mA  
Static Drain-Source On-Resistance  
RDS (ON)  
6
 
mS  
V
  
80  
Forward Transconductance  
Diode Forward Voltage  
gFS  
0.8  
1.2  
VSD  
DYNAMIC CHARACTERISTICS (Note 8)  
Input Capacitance  
22.0  
3.2  
Ciss  
Coss  
Crss  
RG  
  
  
  
  
  
  
  
  
Output Capacitance  
pF  
VDS = 25V, VGS = 0V, f = 1.0MHz  
VDS = 0V, VGS = 0V, f = 1.0MHz  
Reverse Transfer Capacitance  
Gate Resistance  
2.0  
79.9  
0.87  
0.43  
0.11  
0.11  
3.3  
Total Gate Charge VGS = 10V  
Total Gate Charge VGS = 4.5V  
Gate-Source Charge  
Qg  
Qg  
VGS = 10V, VDS = 30V,  
ID = 150mA  
nC  
nS  
Qgs  
Qgd  
tD(on)  
tr  
Gate-Drain Charge  
Turn-On Delay Time  
Turn-On Rise Time  
3.2  
VDD = 30V, ID = 0.115A, VGEN = 10V,  
RGEN = 25Ω  
Turn-Off Delay Time  
12.0  
6.3  
tD(off)  
tf  
Turn-Off Fall Time  
Notes:  
5. Device mounted on FR-4 PC board, with minimum recommended pad layout, single sided.  
6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1-inch square copper pad layout  
7 .Short duration pulse test used to minimize self-heating effect.  
8. Guaranteed by design. Not subject to production testing.  
2 of 6  
www.diodes.com  
February 2015  
© Diodes Incorporated  
DMN65D8LDW  
Document number: DS35500 Rev. 8 - 2  
DMN65D8LDW  
1
0.6  
0.5  
0.4  
V
= 5.0V  
DS  
0.1  
0.3  
0.2  
T
= 150°C  
A
T
= 125°C  
A
T
= 85°C  
A
T
= 25°C  
A
0.1  
0
T
= -55°C  
A
0.01  
0
1
2
3
4
5
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0  
VGS, GATE-SOURCE VOLTAGE  
Fig.2 Typical Transfer Characteristics  
VDS, DRAIN-SOURCE VOLTAGE (V)  
Fig.1 Typical Output Characteristic  
5.0  
4.5  
2.4  
2.2  
2.0  
4.0  
V
= 10V  
GS  
= 115mA  
I
D
3.5  
3.0  
2.5  
1.8  
1.6  
1.4  
1.2  
V
= 5V  
GS  
V
= 5V  
GS  
= 115mA  
I
D
V
= 10V  
2.0  
1.5  
1.0  
GS  
1.0  
0.8  
0.5  
0
0.6  
0.4  
0
0.1  
0.2  
0.3  
0.4  
0.5  
0.6  
50 -25  
0
25  
50  
75 100 125 150  
ID, DRAIN CURRENT  
TJ, JUNCTION TEMPERATURE (C)  
Fig. 3 Typical On-Resistance vs.  
Drain Current and Temperature  
Fig. 4 On-Resistance Variation with Temperature  
5
4
2.0  
1.8  
1.6  
1.4  
1.2  
I
= 1mA  
D
V
= 5V  
GS  
= 115mA  
3
2
I
= 250µA  
I
D
D
1.0  
0.8  
0.6  
0.4  
V
= 10V  
= 115mA  
GS  
I
D
1
0
0.2  
0
-50 -25  
TJ, JUNCTION TEMPERATURE (C)  
Fig. 6 Gate Threshold Variation vs. Ambient Temperature  
0
25  
50 75 100 125 150  
- 50 -25  
0
25  
50  
75 100 125 150  
TJ, JUNCTION TEMPERATURE (C)  
Fig. 5 On-Resistance Variation with Temperature  
3 of 6  
www.diodes.com  
February 2015  
© Diodes Incorporated  
DMN65D8LDW  
Document number: DS35500 Rev. 8 - 2  
DMN65D8LDW  
1,000  
100  
1
0.1  
T
= 150°C  
A
T
= 150°C  
A
T
= 85°C  
T
= 125°C  
A
A
T
= 125°C  
A
T
= 25°C  
10  
0.01  
A
T
= 85°C  
A
T
= -55°C  
T
= 25°C  
A
T
= -55°C  
A
A
1
0.001  
0
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
0
10  
20  
30  
40  
50  
VSD, SOURCE-DRAIN VOLTAGE (V)  
VDS, DRAIN-SOURCE VOLTAGE (V)  
Fig. 7 Diode Forward Voltage vs. Current  
Fig. 8 Typical Drain-Source Leakage Current vs. Voltage  
50  
45  
f = 1MHz  
40  
35  
30  
25  
20  
15  
C
iss  
10  
C
oss  
5
0
C
rss  
0
5
10  
15  
20  
25  
VDS, DRAIN-SOURCE VOLTAGE (V)  
Fig. 9 Typical Junction Capacitance  
1
D = 0.7  
D = 0.5  
D = 0.3  
0.1  
D = 0.9  
D = 0.1  
D = 0.05  
D = 0.02  
0.01  
D = 0.01  
R
R
= r * R  
(t)  
= 318C/W  
JA(t)  
JA  
JA  
D = 0.005  
Duty Cycle, D = t1/t2  
D = Single Pulse  
0.001  
0.000001 0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
1,000  
t1, PULSE DURATION TIME (sec)  
Fig. 10 Transient Thermal Resistance  
4 of 6  
www.diodes.com  
February 2015  
© Diodes Incorporated  
DMN65D8LDW  
Document number: DS35500 Rev. 8 - 2  
DMN65D8LDW  
Package Outline Dimensions  
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for the latest version.  
A
SOT363  
Dim Min Max Typ  
A
B
C
D
F
H
J
K
L
0.10 0.30 0.25  
1.15 1.35 1.30  
2.00 2.20 2.10  
0.65 Typ  
0.40 0.45 0.425  
1.80 2.20 2.15  
B C  
H
0
0.10 0.05  
K
M
0.90 1.00 1.00  
0.25 0.40 0.30  
0.10 0.22 0.11  
J
M
L
D
F
0°  
8°  
-
  
All Dimensions in mm  
Suggested Pad Layout  
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.  
C2  
C2  
Dimensions Value (in mm)  
Z
G
2.5  
1.3  
X
Y
C1  
C2  
0.42  
0.6  
1.9  
C1  
G
Y
Z
0.65  
X
5 of 6  
www.diodes.com  
February 2015  
© Diodes Incorporated  
DMN65D8LDW  
Document number: DS35500 Rev. 8 - 2  
DMN65D8LDW  
IMPORTANT NOTICE  
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,  
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE  
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).  
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes  
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the  
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or  
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume  
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated  
website, harmless against all damages.  
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.  
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and  
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or  
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.  
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings  
noted herein may also be covered by one or more United States, international or foreign trademarks.  
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the  
final and determinative format released by Diodes Incorporated.  
LIFE SUPPORT  
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express  
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:  
A. Life support devices or systems are devices or systems which:  
1. are intended to implant into the body, or  
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the  
labeling can be reasonably expected to result in significant injury to the user.  
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the  
failure of the life support device or to affect its safety or effectiveness.  
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and  
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any  
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related  
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its  
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.  
Copyright © 2015, Diodes Incorporated  
www.diodes.com  
6 of 6  
www.diodes.com  
February 2015  
© Diodes Incorporated  
DMN65D8LDW  
Document number: DS35500 Rev. 8 - 2  

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