DMP1022UFDF-7 [DIODES]

Small Signal Field-Effect Transistor, 9.5A I(D), 12V, 1-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET, U-DFN2020-6, 6 PIN;
DMP1022UFDF-7
型号: DMP1022UFDF-7
厂家: DIODES INCORPORATED    DIODES INCORPORATED
描述:

Small Signal Field-Effect Transistor, 9.5A I(D), 12V, 1-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET, U-DFN2020-6, 6 PIN

开关 光电二极管 晶体管
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中文:  中文翻译
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DMP1022UFDF  
12V P-CHANNEL ENHANCEMENT MODE MOSFET  
Product Summary  
Features  
0.6mm profile ideal for low profile applications  
PCB footprint of 4mm2  
ID max  
V(BR)DSS  
RDS(ON) max  
TA = +25°C  
Low Gate Threshold Voltage  
-9.5A  
-8.5A  
-7.2A  
-6.6A  
14.8m@ VGS = -4.5V  
19mΩ @ VGS = -2.5V  
26mΩ @ VGS = -1.8V  
32mΩ @ VGS = -1.5V  
Fast Switching Speed  
-12V  
ESD Protected Gate  
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)  
Halogen and Antimony Free. “Green” Device (Note 3)  
Qualified to AEC-Q101 Standards for High Reliability  
Description  
Mechanical Data  
This MOSFET is designed specifically for use in battery management  
applications.  
Case: U-DFN2020-6  
Case Material: Molded Plastic, “Green” Molding Compound.  
UL Flammability Classification Rating 94V-0  
Moisture Sensitivity: Level 1 per J-STD-020  
Terminals: Finish NiPdAu over Copper Leadframe.  
e4  
Solderable per MIL-STD-202, Method 208  
Weight: 0.0065 grams (Approximate)  
D
U-DFN2020-6  
G
ESD PROTECTED  
Gate Protection  
Diode  
S
Pin Out  
Internal Schematic  
Top View  
Bottom View  
Bottom View  
Ordering Information (Note 4)  
Part Number  
DMP1022UFDF-7  
DMP1022UFDF-13  
Case  
U-DFN2020-6  
U-DFN2020-6  
Packaging  
3,000/Tape & Reel  
10,000/Tape & Reel  
Notes:  
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.  
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"  
and Lead-free.  
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and  
<1000ppm antimony compounds.  
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.  
Marking Information  
PU = Product Type Marking Code  
YM = Date Code Marking  
Y = Year (ex: A = 2013)  
PU  
M = Month (ex: 9 = September)  
Date Code Key  
Year  
2013  
2014  
2015  
2016  
2017  
2018  
2019  
2020  
2021  
2022  
Code  
A
B
C
D
E
F
G
H
I
J
Month  
Code  
Jan  
1
Feb  
2
Mar  
3
Apr  
4
May  
5
Jun  
6
Jul  
7
Aug  
8
Sep  
9
Oct  
O
Nov  
N
Dec  
D
1 of 6  
www.diodes.com  
October 2015  
© Diodes Incorporated  
DMP1022UFDF  
Datasheet number: DS36624 Rev. 5 - 2  
DMP1022UFDF  
Maximum Ratings (@TA = +25°C, unless otherwise specified.)  
Characteristic  
Drain-Source Voltage  
Symbol  
VDSS  
Value  
-12  
Units  
V
V
Gate-Source Voltage  
±8  
VGSS  
Steady  
State  
TA = +25°C  
-9.5  
-7.6  
A
ID  
TA = +70°C  
TA = +25°C  
TA = +70°C  
Continuous Drain Current (Note 6) VGS = -4.5V  
-11.0  
-8.8  
t<5s  
A
A
A
A
ID  
IDM  
IS  
Pulsed Drain Current (10μs pulse, duty cycle = 1%)  
-90  
TA = +25°C  
TC = +25°C  
-2.5  
-7.1  
Continuous Source-Drain Diode Current  
Pulsed Source-Drain Diode Current (10μs pulse, duty cycle = 1%)  
-50  
ISM  
Thermal Characteristics  
Characteristic  
Symbol  
Value  
0.73  
Units  
TA = +25°C  
Total Power Dissipation (Note 5)  
W
PD  
RθJA  
PD  
0.47  
172  
128  
TA = +70°C  
Steady state  
t<5s  
Thermal Resistance, Junction to Ambient (Note 5)  
Total Power Dissipation (Note 6)  
°C/W  
W
2.1  
TA = +25°C  
TA = +70°C  
Steady state  
t<5s  
1.3  
59  
45  
5.1  
Thermal Resistance, Junction to Ambient (Note 6)  
RθJA  
°C/W  
°C  
Thermal Resistance, Junction to Case (Note 6)  
Operating and Storage Temperature Range  
Steady state  
RθJC  
-55 to +150  
TJ, TSTG  
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)  
Characteristic  
OFF CHARACTERISTICS (Note 7)  
Drain-Source Breakdown Voltage  
Symbol  
Min  
Typ  
Max  
Unit  
Test Condition  
-12  
-200  
-2  
V
BVDSS  
IDSS  
VGS = 0V, ID = -250μA  
VDS = -12V, VGS = 0V  
VDS = -12V, VGS = 0V  
VGS = ±8V, VDS = 0V  
nA  
µA  
µA  
Zero Gate Voltage Drain Current TJ = +25°C  
Zero Gate Voltage Drain Current TJ = +55°C (Note 8)  
Gate-Source Leakage  
IDSS  
±10  
IGSS  
ON CHARACTERISTICS (Note 7)  
Gate Threshold Voltage  
-0.35  
12  
-0.8  
14.8  
19  
V
mΩ  
V
VGS(th)  
RDS(ON)  
VSD  
VDS = VGS, ID = -250μA  
VGS = -4.5V, ID = -4A  
VGS = -2.5V, ID = -4A  
VGS = -1.8V, ID = -4A  
VGS = -1.5V, ID = -2A  
VGS = 0V, IS = -8A  
15  
Static Drain-Source On-Resistance  
20  
26  
23  
32  
Diode Forward Voltage  
DYNAMIC CHARACTERISTICS (Note 8)  
Input Capacitance  
-0.8  
-1.2  
2,712  
514  
467  
8.6  
18  
Ciss  
Coss  
Crss  
Rg  
VDS = -10V, VGS = 0V,  
f = 1.0MHz  
Output Capacitance  
Reverse Transfer Capacitance  
Gate Resistance  
pF  
VDS = 0V, VGS = 0V, f = 1MHz  
VGS = -8V, VDS = -6V, ID = -10A  
48.3  
28.6  
4.2  
Total Gate Charge  
Qg  
Total Gate Charge  
Qg  
nC  
ns  
VGS = -4.5V, VDS = -6V,  
ID = -10A  
Gate-Source Charge  
Gate-Drain Charge  
Qgs  
Qgd  
tD(on)  
tr  
7.0  
25.1  
39.8  
141  
147  
Turn-On Delay Time  
Turn-On Rise Time  
VDS = -6V, VGS = -4.5V,  
RG = , ID = -8A  
Turn-Off Delay Time  
Turn-Off Fall Time  
tD(off)  
tf  
Notes:  
5. Device mounted on FR-4 PC board, with minimum recommended pad layout, single sided.  
6. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal vias to bottom layer 1inch square copper plate.  
7. Short duration pulse test used to minimize self-heating effect.  
8. Guaranteed by design. Not subject to production testing.  
2 of 6  
www.diodes.com  
October 2015  
© Diodes Incorporated  
DMP1022UFDF  
Datasheet number: DS36624 Rev. 5 - 2  
DMP1022UFDF  
20  
16  
12  
8
30  
25  
20  
15  
10  
5
V
= -5.0V  
DS  
V
= -8.0V  
GS  
= -4.5V  
V
GS  
= -2.5V  
V
GS  
V
= -2.0V  
GS  
= -1.8V  
V
GS  
V
= -1.5V  
GS  
T
= 150C  
A
T
A
= 125C  
T
= 85C  
A
T
= 25C  
A
4
T
= -55C  
A
V
= -1.2V  
GS  
0
0
0
0.5  
1
1.5  
2
2.5  
3
3.5  
4
4.5  
5
0
0.5  
1
1.5  
2
2.5  
3
-VGS, GATE-SOURCE VOLTAGE (V)  
-VDS, DRAIN -SOURCE VOLTAGE (V)  
Figure 2 Typical Transfer Characteristics  
Figure 1 Typical Output Characteristics  
0.06  
0.05  
0.04  
0.03  
0.02  
0.01  
0
0.03  
0.025  
0.02  
0.015  
0.01  
0.005  
0
V
= -4.5V  
GS  
V
= -1.5V  
GS  
T
= 150C  
= 125C  
A
T
A
T
= 85C  
A
V
= -1.8V  
GS  
T
= 25C  
A
T
= -55C  
A
V
= -2.5V  
GS  
V
= -4.5V  
GS  
0
4
8
12  
16  
20  
0
5
10  
15  
20  
25  
30  
-ID, DRAIN SOURCE CURRENT (A)  
-ID, DRAIN SOURCE CURRENT (A)  
Figure 4 Typical On-Resistance vs.  
Drain Current and Temperature  
Figure 3 Typical On-Resistance vs.  
Drain Current and Gate Voltage  
1.7  
0.04  
0.03  
0.02  
0.01  
0
1.5  
1.3  
1.1  
0.9  
0.7  
0.5  
V
I
= -2.5V  
GS  
= -5A  
D
V
I
= -2.5V  
GS  
= -5A  
D
V
I
= -4.5V  
GS  
= -10A  
D
V
I
= -4.5V  
GS  
= -10A  
D
-50 -25  
0
25  
50  
75 100 125 150  
-50 -25  
0
25  
50  
75 100 125 150  
TJ, JUNCTION TEMPERATURE (C)  
TJ, JUNCTION TEMPERATURE (C)  
Figure 5 On-Resistance Variation with Temperature  
Figure 6 On-Resistance Variation with Temperature  
3 of 6  
www.diodes.com  
October 2015  
© Diodes Incorporated  
DMP1022UFDF  
Datasheet number: DS36624 Rev. 5 - 2  
DMP1022UFDF  
1.4  
1.2  
1
20  
16  
12  
8
0.8  
0.6  
0.4  
0.2  
0
T = 25C  
A
-I = 1mA  
D
-I = 250µA  
D
4
0
0.4  
0.6  
0.8  
1
1.2  
-50 -25  
0
25  
50  
75  
100 125 150  
-VSD, SOURCE-DRAIN VOLTAGE (V)  
TA, AMBIENT TEMPERATURE (°C)  
Figure 8 Diode Forward Voltage vs. Current  
Figure 7 Gate Threshold Variation vs. Ambient Temperature  
4000  
8
6
4
2
0
f = 1MHz  
3500  
3000  
C
iss  
2500  
2000  
1500  
1000  
V
I
= -6V  
DS  
= -10A  
D
C
oss  
500  
C
rss  
0
0
5
10 15 20 25 30 35 40 45 50  
Qg, TOTAL GATE CHARGE (nC)  
0
3
6
9
12  
15  
-VDS, DRAIN-SOURCE VOLTAGE (V)  
Figure 9 Typical Junction Capacitance  
Figure 10 Gate-Charge Characteristics  
1
D = 0.7  
D = 0.5  
D = 0.3  
0.1  
D = 0.1  
D = 0.9  
D = 0.05  
D = 0.02  
0.01  
D = 0.01  
D = 0.005  
RJA(t) = r(t) * RJA  
RJA = 172°C/W  
Single Pulse  
Duty Cycle, D = t1/ t2  
0.001  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
1000  
t1, PULSE DURATION TIMES (sec)  
Figure 11 Transient Thermal Resistance  
4 of 6  
www.diodes.com  
October 2015  
© Diodes Incorporated  
DMP1022UFDF  
Datasheet number: DS36624 Rev. 5 - 2  
DMP1022UFDF  
Package Outline Dimensions  
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for the latest version.  
U-DFN2020-6  
(Type F)  
A3  
A1  
A
Dim  
A
A1  
A3  
b
Min Max  
0.57 0.63  
0.00 0.05  
Typ  
0.60  
0.03  
0.15  
0.30  
2.00  
0.95  
0.38  
2.00  
1.15  
0.70  
Seating Plane  
-
-
D
0.25 0.35  
1.95 2.05  
0.85 1.05  
D
D2  
e3  
k2  
e4  
D2a 0.33 0.43  
E
E2  
E2a  
e
e2  
e3  
e4  
k
1.95 2.05  
1.05 1.25  
0.65 0.75  
D2a  
E2a  
z2  
0.65 BSC  
0.863 BSC  
0.70 BSC  
0.325 BSC  
0.37 BSC  
0.15 BSC  
D2  
E
E2  
k1  
e2  
k1  
k2  
L
L
k
z1  
0.36 BSC  
0.225 0.325 0.275  
0.20 BSC  
z
z1  
z2  
0.110 BSC  
0.20 BSC  
e
b
z( 4x)  
All Dimensions in mm  
Suggested Pad Layout  
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.  
X3  
Y
C
X
Value  
Dimensions  
(in mm)  
0.650  
0.400  
0.480  
0.950  
1.700  
0.425  
0.800  
1.150  
1.450  
2.300  
C
X
X1  
X2  
X3  
Y
Y1  
Y2  
Y3  
Y4  
Y3  
Y2  
Y1 Y4  
X1  
Pin1  
X2  
5 of 6  
www.diodes.com  
October 2015  
© Diodes Incorporated  
DMP1022UFDF  
Datasheet number: DS36624 Rev. 5 - 2  
DMP1022UFDF  
IMPORTANT NOTICE  
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,  
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE  
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).  
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes  
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the  
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or  
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume  
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated  
website, harmless against all damages.  
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.  
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and  
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or  
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.  
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings  
noted herein may also be covered by one or more United States, international or foreign trademarks.  
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the  
final and determinative format released by Diodes Incorporated.  
LIFE SUPPORT  
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express  
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:  
A. Life support devices or systems are devices or systems which:  
1. are intended to implant into the body, or  
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the  
labeling can be reasonably expected to result in significant injury to the user.  
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the  
failure of the life support device or to affect its safety or effectiveness.  
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and  
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any  
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related  
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representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.  
Copyright © 2015, Diodes Incorporated  
www.diodes.com  
6 of 6  
www.diodes.com  
October 2015  
© Diodes Incorporated  
DMP1022UFDF  
Datasheet number: DS36624 Rev. 5 - 2  

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