DMP2035UVTQ-13 [DIODES]

Power Field-Effect Transistor,;
DMP2035UVTQ-13
型号: DMP2035UVTQ-13
厂家: DIODES INCORPORATED    DIODES INCORPORATED
描述:

Power Field-Effect Transistor,

开关 脉冲 光电二极管 晶体管
文件: 总6页 (文件大小:470K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
DMP2035UVTQ  
20V P-CHANNEL ENHANCEMENT MODE MOSFET  
Product Summary  
Features and Benefits  
Low Input Capacitance  
ID  
TA = +25°C  
-6.0A  
V(BR)DSS  
RDS(on) max  
Low On-Resistance  
35m@ VGS = -4.5V  
45m@ VGS = -2.5V  
Fast Switching Speed  
-20V  
-5.2A  
ESD protected Up To 3KV  
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)  
Halogen and Antimony Free. “Green” Device (Note 3)  
Qualified to AEC-Q101 Standards for High Reliability  
PPAP Capable (Note 4)  
Description  
This new generation MOSFET is designed to minimize the on-state  
resistance (RDS(ON)) and yet maintain superior switching performance,  
making it ideal for high-efficiency power management applications.  
Mechanical Data  
Applications  
Case: TSOT26  
Case Material: Molded Plastic, “Green” Molding Compound.  
UL Flammability Classification Rating 94V-0  
Moisture Sensitivity: Level 1 per J-STD-020  
Terminal Connections: See Diagram  
Terminals: Finish Matte Tin Annealed over Copper Leadframe.  
Solderable per MIL-STD-202, Method 208  
Weight: 0.013 grams (Approximate)  
Drain  
DC-DC Converters  
Motor Control  
Power management functions  
Analog Switch  
TSOT26  
D
D
G
1
2
3
6
5
4
D
D
S
Gate  
Gate  
Protection  
Diode  
Source  
ESD PROTECTED TO 3kV  
Top View  
Pin-Out  
Top View  
Equivalent Circuit  
Ordering Information (Note 5)  
Part Number  
DMP2035UVTQ-7  
DMP2035UVTQ-13  
Case  
TSOT26  
TSOT26  
Packaging  
3,000/Tape & Reel  
10,000/Tape & Reel  
Notes:  
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.  
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"  
and Lead-free.  
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and  
<1000ppm antimony compounds.  
4. Automotive products are AEC-Q10x qualified and are PPAP capable. Automotive, AEC-Q10x and standard products are electrically and thermally  
the same, except where specified. For more information, please refer to http://www.diodes.com/quality/product_compliance_definitions/.  
5. For packaging details, go to our website at http://www.diodes.com/products/packages.html.  
Marking Information  
20P = Product Type Marking Code  
YM = Date Code Marking  
Y = Year (ex: Y = 2011)  
20P  
M = Month (ex: 9 = September)  
Date Code Key  
Year  
2011  
2012  
2013  
2014  
2015  
2016  
2017  
Code  
Y
Z
A
B
C
D
E
Month  
Code  
Jan  
1
Feb  
2
Mar  
3
Apr  
4
May  
5
Jun  
6
Jul  
7
Aug  
8
Sep  
9
Oct  
O
Nov  
N
Dec  
D
1 of 6  
www.diodes.com  
September 2017  
© Diodes Incorporated  
DMP2035UVTQ  
Document number: DS37400 Rev. 2 - 2  
DMP2035UVTQ  
Maximum Ratings @TA = 25°C unless otherwise specified  
Characteristic  
Drain-Source Voltage  
Symbol  
VDSS  
Value  
-20  
Units  
V
V
Gate-Source Voltage  
±12  
VGSS  
Steady  
State  
TA = +25°C  
-6.0  
-4.8  
A
A
A
A
ID  
ID  
ID  
ID  
TA = +70°C  
TA = +25°C  
TA = +70°C  
TA = +25°C  
TA = +70°C  
TA = +25°C  
TA = +70°C  
Continuous Drain Current (Note 7) VGS = -4.5V  
Continuous Drain Current (Note 7) VGS = -2.5V  
-7.2  
-5.7  
t<10s  
Steady  
State  
-5.2  
-4.1  
-6.2  
-4.9  
t<10s  
Maximum Continuous Body Diode Forward Current (Note 7)  
Pulsed Drain Current (10µs pulse, duty cycle = 1%)  
-2.0  
-24  
A
A
IS  
IDM  
Thermal Characteristics @TA = 25°C unless otherwise specified  
Characteristic  
Symbol  
Value  
Units  
Total Power Dissipation (Note 6)  
1.2  
106  
74  
2.0  
65  
W
PD  
RθJA  
PD  
Steady State  
Thermal Resistance, Junction to Ambient (Note 6)  
t<10s  
Total Power Dissipation (Note 7)  
°C/W  
W
Steady State  
Thermal Resistance, Junction to Ambient (Note 7)  
RθJA  
t<10s  
46  
°C/W  
Steady State  
Thermal Resistance, Junction to Case (Note 7)  
Operating and Storage Temperature Range  
11.8  
RθJC  
-55 to 150  
°C  
TJ, TSTG  
Electrical Characteristics @TA = 25°C unless otherwise specified  
Characteristic  
OFF CHARACTERISTICS (Note 8)  
Drain-Source Breakdown Voltage  
Zero Gate Voltage Drain Current  
Gate-Source Leakage  
Symbol  
Min  
Typ  
Max  
Unit  
Test Condition  
-20  
  
V
  
-1  
BVDSS  
IDSS  
VGS = 0V, ID = -250µA  
VDS = -20V, VGS = 0V  
VGS = 8V, VDS = 0V  
µA  
µA  
10  
IGSS  
ON CHARACTERISTICS (Note 8)  
Gate Threshold Voltage  
-0.4  
-0.7  
2.5  
-1.5  
V
VGS(th)  
VDS = VGS, ID = -250µA  
ID = -250µA , Referenced to  
+25°C  
Gate Threshold Voltage Temperature Coefficient  
mV/°C  
VGS(th)  
/
TJ  
23  
30  
35  
45  
  
VGS = -4.5V, ID = -4.0A  
VGS = -2.5V, ID = -4.0A  
VGS = -1.8V, ID = -2.0A  
VDS = -5V, ID = -5.5A  
VGS = 0V, IS = -1A  
Static Drain-Source On-Resistance  
mΩ  
RDS(ON)  
41  
62  
Forward Transfer Admittance  
Diode Forward Voltage (Note 7)  
DYNAMIC CHARACTERISTICS (Note 9)  
Input Capacitance  
18  
S
V
-1.0  
|Yfs|  
VSD  
-0.7  
1610  
157  
145  
9.4  
15.4  
2.5  
3.3  
17  
2400  
210  
200  
14.1  
23.1  
  
  
  
  
  
  
  
  
  
  
  
  
  
  
Ciss  
Coss  
Crss  
RG  
VDS = -10V, VGS = 0V  
f = 1.0MHz  
Output Capacitance  
pF  
Ω
Reverse Transfer Capacitance  
Gate Resistance  
VDS = 0V, VGS = 0V, f = 1.0MHz  
Total Gate Charge  
Qg  
VDS = -10V, VGS = -4.5V  
ID = -4A  
Gate-Source Charge  
nC  
Qgs  
Qgd  
tD(on)  
tr  
Gate-Drain Charge  
  
33  
Turn-On Delay Time  
Turn-On Rise Time  
12  
19  
VGS = -4.5V, VDS = -10V, RG = 6Ω,  
ID = -1A, RL = 10Ω  
ns  
Turn-Off Delay Time  
94  
150  
64  
tD(off)  
tf  
Turn-Off Fall Time  
42  
Reverse Recovery Time  
Reverse Recovery Charge  
14  
25  
ns  
trr  
IF =-4.5A, di/dt=100A/µS  
4
8
nC  
Qrr  
Notes:  
6. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.  
7. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.  
8. Short duration pulse test used to minimize self-heating effect.  
9. Guaranteed by design. Not subject to product testing.  
2 of 6  
www.diodes.com  
September 2017  
© Diodes Incorporated  
DMP2035UVTQ  
Document number: DS37400 Rev. 2 - 2  
DMP2035UVTQ  
20  
15  
25  
20  
V
= 8.0V  
GS  
V
= -5.0V  
V
= 4.5V  
DS  
GS  
V
= 3.5V  
GS  
V
= 2.0V  
GS  
V
= 3.2V  
GS  
15  
10  
V
= 3.0V  
GS  
10  
V
= 2.5V  
GS  
T
= 150C  
A
5
0
5
0
V
= 1.5V  
T
= 125C  
T
= 85C  
GS  
A
A
T
= 25C  
A
T
= -55C  
A
0
1
2
3
4
5
0
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
-VDS, DRAIN -SOURCE VOLTAGE(V)  
-VGS, GATE-SOURCE VOLTAGE (V)  
Fig. 1 Typical Output Characteristics  
Fig. 2 Typical Transfer Characteristics  
0.07  
0.06  
0.05  
0.04  
V
= -4.5V  
GS  
T
T
= 150C  
A
= 125C  
= 85C  
A
0.05  
0.04  
T
A
0.03  
T
= 25C  
A
0.02  
0.01  
T
= -55C  
A
0.03  
0.02  
0
4
8
12  
16  
20  
0.1  
1
10  
100  
-ID, DRAIN SOURCE CURRENT (A)  
-ID, DRAIN SOURCE CURRENT  
Fig. 4 Typical On-Resistance vs.  
Drain Current and Temperature  
Fig. 3 Typical On-Resistance vs.  
Drain Current and Gate Voltage  
0.06  
0.05  
1.7  
1.5  
V
I
= -2.5V  
1.3  
1.1  
0.9  
GS  
= -5A  
D
0.04  
0.03  
V
I
= -4.5V  
GS  
= -10A  
D
0.02  
0.01  
0.7  
0.5  
-50 -25  
0
25  
50  
75 100 125 150  
-50 -25  
0
25  
50  
75 100 125 150  
TJ, JUNCTION TEMPERATURE (C)  
TJ, JUNCTION TEMPERATURE (C)  
Fig. 5 On-Resistance Variation with Temperature  
Fig. 6 On-Resistance Variation with Temperature  
3 of 6  
www.diodes.com  
September 2017  
© Diodes Incorporated  
DMP2035UVTQ  
Document number: DS37400 Rev. 2 - 2  
DMP2035UVTQ  
1.2  
1.0  
20  
18  
16  
14  
0.8  
12  
10  
8
0.6  
0.4  
6
4
0.2  
0
2
0
-50 -25  
TA, AMBIENT TEMPERATURE (°C)  
Fig. 7 Gate Threshold Variation vs. Ambient Temperature  
0
25  
50  
75 100 125 150  
0
0.3  
0.6  
0.9  
1.2  
1.5  
-VSD, SOURCE-DRAIN VOLTAGE (V)  
Fig. 8 Diode Forward Voltage vs. Current  
100,000  
10,000  
10,000  
T
= 150°C  
= 125°C  
A
T
= 150°C  
A
T
= 125°C  
A
T
A
1,000  
1,000  
100  
100  
T
= 85°C  
T
= 85°C  
A
A
T
= 25°C  
A
T
= -55°C  
A
10  
1
10  
1
T
= -55°C  
A
T
= 25°C  
A
2
4
6
8
10  
2
4
6
8
10 12 14 16 18 20  
-VGS, GATE-SOURCE VOLTAGE(V)  
-VDS, DRAIN-SOURCE VOLTAGE(V)  
Fig. 10 Typical Gate-Source Leakage Current vs. Voltage  
Fig. 9 Typical Drain-Source Leakage Current vs. Voltage  
10,000  
10  
f = 1MHz  
8
6
C
iss  
1,000  
4
2
0
C
oss  
C
rss  
100  
0
4
8
12 16 20 24 28 32 36 40  
0
2
4
6
8
10 12 14 16 18 20  
-VDS, DRAIN-SOURCE VOLTAGE (V)  
Qg, TOTAL GATE CHARGE (nC)  
Fig. 11 Typical Junction Capacitance  
Fig. 12 Gate-Charge Characteristics  
4 of 6  
www.diodes.com  
September 2017  
© Diodes Incorporated  
DMP2035UVTQ  
Document number: DS37400 Rev. 2 - 2  
DMP2035UVTQ  
1
D = 0.7  
D = 0.5  
D = 0.3  
0.1  
D = 0.1  
D = 0.9  
D = 0.05  
D = 0.02  
D = 0.01  
D = 0.005  
0.01  
R
R
(t) = r(t) * R  
= 88°C/W  
JA  
JA  
JA  
Duty Cycle, D = t1/ t2  
Single Pulse  
0.001  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
1,000  
t1, PULSE DURATION TIMES (sec)  
Fig. 13 Transient Thermal Resistance  
Package Outline Dimensions  
Please see http://www.diodes.com/package-outlines.html for the latest version.  
D
e1  
01( 4x)  
TSOT26  
Dim  
A
A1  
A2  
D
E
E1  
b
Min  
  
Max  
1.00  
Typ  
E1/2  
E/2  
0.010 0.100  
0.840 0.900  
2.800 3.000 2.900  
c
E1  
E
Gauge Plane  
Seating Plane  
2.800 BSC  
0
1.500 1.700 1.600  
0.300 0.450  
0.120 0.200  
L
L2  
c
e
e1  
L
0.950 BSC  
1.900 BSC  
0.50  
01( 4x)  
e
b
A2  
0.30  
L2  
θ
θ1  
0.250 BSC  
8°  
A1  
0°  
4°  
4°  
A
12°  
Seating Plane  
All Dimensions in mm  
Suggested Pad Layout  
Please see http://www.diodes.com/package-outlines.html for the latest version.  
C
Dimensions Value (in mm)  
C
X
Y
0.950  
0.700  
1.000  
3.199  
Y1  
Y1  
Y
X
5 of 6  
www.diodes.com  
September 2017  
© Diodes Incorporated  
DMP2035UVTQ  
Document number: DS37400 Rev. 2 - 2  
DMP2035UVTQ  
IMPORTANT NOTICE  
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,  
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE  
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).  
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes  
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the  
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or  
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume  
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated  
website, harmless against all damages.  
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.  
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and  
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or  
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.  
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings  
noted herein may also be covered by one or more United States, international or foreign trademarks.  
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the  
final and determinative format released by Diodes Incorporated.  
LIFE SUPPORT  
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express  
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:  
A. Life support devices or systems are devices or systems which:  
1. are intended to implant into the body, or  
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the  
labeling can be reasonably expected to result in significant injury to the user.  
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the  
failure of the life support device or to affect its safety or effectiveness.  
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and  
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any  
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related  
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its  
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.  
Copyright © 2017, Diodes Incorporated  
www.diodes.com  
6 of 6  
www.diodes.com  
September 2017  
© Diodes Incorporated  
DMP2035UVTQ  
Document number: DS37400 Rev. 2 - 2  

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