DMP32D4SW [DIODES]

Low On-Resistance;
DMP32D4SW
型号: DMP32D4SW
厂家: DIODES INCORPORATED    DIODES INCORPORATED
描述:

Low On-Resistance

文件: 总6页 (文件大小:244K)
中文:  中文翻译
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DMP32D4SW  
30V P-CHANNEL ENHANCEMENT MODE MOSFET  
Product Summary  
Features  
ID Max  
@ TA = 25C  
-250mA  
Low On-Resistance  
V(BR)DSS  
RDS(on) Max  
ESD Protected Gate  
2.4@ VGS = -10V  
4@ VGS = -4.5V  
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)  
Halogen and Antimony Free. “Green” Device (Note 3)  
Qualified to AEC-Q101 Standards for High Reliability  
-30V  
-200mA  
Description  
Mechanical Data  
This MOSFET has been designed to minimize the on-state resistance  
(RDS(on)) and yet maintain superior switching performance, making it  
ideal for high efficiency power management applications.  
Case: SOT323  
Case Material: Molded Plastic, “Green” Molding Compound.  
UL Flammability Classification Rating 94V-0  
Moisture Sensitivity: Level 1 per J-STD-020  
Lead Free Plating (Matte Tin Finish annealed over Alloy 42  
leadframe).  
Applications  
Load Switch  
Portable Applications  
Power Management Functions  
Weight: 0.006 grams (approximate)  
Drain  
SOT323  
D
Gate  
Gate  
Protection  
S
G
Source  
ESD PROTECTED  
Diode  
Top View  
Top View  
Pin-out  
Equivalent Circuit  
Ordering Information (Note 4)  
Product  
Marking  
Reel size (inches)  
Quantity per reel  
DMP32D4SW-7  
DMP32D4SW-13  
P32D  
P32D  
7
13  
3,000  
10,000  
Notes:  
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.  
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"  
and Lead-free.  
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and  
<1000ppm antimony compounds.  
4. For packaging details, go to our website at http”//www.diodes.com/products/packages.html.  
Marking Information  
P32D = Product Type Marking Code  
YM = Date Code Marking  
Y = Year (ex: Z = 2012)  
P32D  
M = Month (ex: 9 = September)  
Date Code Key  
Year  
2012  
2013  
2014  
2015  
2016  
2017  
2018  
Code  
Z
A
B
C
D
E
F
Month  
Code  
Jan  
1
Feb  
2
Mar  
3
Apr  
4
May  
5
Jun  
6
Jul  
7
Aug  
8
Sep  
9
Oct  
O
Nov  
N
Dec  
D
1 of 6  
www.diodes.com  
March 2013  
© Diodes Incorporated  
DMP32D4SW  
Document number: DS35823 Rev. 3 - 2  
DMP32D4SW  
Maximum Ratings (@TA = +25°C, unless otherwise specified.)  
Characteristic  
Drain-Source Voltage  
Symbol  
VDSS  
Value  
-30  
Unit  
V
Gate-Source Voltage  
±20  
V
VGSS  
TA = +25°C  
TA = +70°C  
250  
200  
Continuous Drain Current (Note 6)  
Pulsed Drain Current (Note 6)  
mA  
A
V
GS = -10V  
ID  
-1  
IDM  
Thermal Characteristics (@TA = +25°C, unless otherwise specified.)  
Characteristic  
Symbol  
Value  
Units  
(Note 5)  
300  
432  
398  
290  
142  
Total Power Dissipation  
(Note 6)  
mW  
PD  
(Note 5)  
(Note 6)  
(Note 5)  
Thermal Resistance, Junction to Ambient  
RθJA  
°C/W  
°C  
Thermal Resistance, Junction to Case  
RθJC  
Operating and Storage Temperature Range  
-55 to 150  
TJ, TSTG  
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)  
Characteristic  
OFF CHARACTERISTICS (Note 7)  
Drain-Source Breakdown Voltage  
Symbol  
Min  
Typ  
Max  
Unit  
Test Condition  
-30  
-
-
-
-
V
BVDSS  
IDSS  
VGS = 0V, ID = -1mA  
-
-
-1  
µA  
µA  
Zero Gate Voltage Drain Current TJ = +25°C  
Gate-Source Leakage  
VDS = -30V, VGS = 0V  
VGS = ±16V, VDS = 0V  
±10  
IGSS  
ON CHARACTERISTICS (Note 7)  
Gate Threshold Voltage  
-1.4  
-
-
-
-2.4  
2.4  
4
V
VGS(th)  
VDS = VGS, ID = -250μA  
VGS = -10V, ID = -0.5A  
Static Drain-Source On-Resistance  
RDS (ON)  
V
GS = -4.5V, ID = -0.3A  
Forward Transfer Admittance  
Diode Forward Voltage  
DYNAMIC CHARACTERISTICS (Note 8)  
Input Capacitance  
-
-
6
-
S
V
|Yfs|  
VSD  
VDS = -10V, ID = -400mA  
VGS = 0V, IS = -300mA  
0.8  
1.2  
-
-
-
-
-
-
-
-
-
-
-
-
51.16  
10.85  
8.88  
275  
0.6  
-
-
-
-
-
-
-
-
-
-
-
-
pF  
pF  
pF  
Ω
Ciss  
Coss  
Crss  
Rg  
V
DS = -15V, VGS = 0V,  
Output Capacitance  
f = 1.0MHz  
Reverse Transfer Capacitance  
Gate Resistance  
VDS = 0V, VGS = 0V, f = 1MHz  
VGS = -4.5V  
Total Gate Charge  
nC  
nC  
nC  
nC  
ns  
ns  
ns  
ns  
Qg  
1.2  
Total Gate Charge  
Qg  
VDS = -10V,  
0.2  
Gate-Source Charge  
Gate-Drain Charge  
ID = -1A  
Qgs  
Qgd  
tD(on)  
tr  
VGS = -10V  
0.3  
9.86  
11.5  
31.8  
21.9  
Turn-On Delay Time  
Turn-On Rise Time  
VDS = -15V, ID = -1A  
VGS = -10V, RG = 6Ω  
Turn-Off Delay Time  
Turn-Off Fall Time  
tD(off)  
tf  
Notes:  
5. Device mounted on FR-4 PC board, with minimum recommended pad layout, single sided.  
6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper pad layout  
7 .Short duration pulse test used to minimize self-heating effect.  
8. Guaranteed by design. Not subject to production testing.  
2 of 6  
www.diodes.com  
March 2013  
© Diodes Incorporated  
DMP32D4SW  
Document number: DS35823 Rev. 3 - 2  
DMP32D4SW  
2.0  
1.5  
2.0  
1.8  
1.6  
V
= -10V  
GS  
V
= -5.0V  
DS  
V
= -5.0V  
GS  
V
= -4.5V  
GS  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
V
= -4.0V  
GS  
1.0  
V
V
= -3.5V  
= -3.0V  
GS  
GS  
0.5  
0
T
= 150C  
T
= 85  
C
A
A
T
= 125C  
A
T
= 25C  
0.2  
0
A
V
= -2.5V  
GS  
T
= -55C  
A
0
1
2
3
4
5
0
1
2
3
4
5
-VGS, GATE-SOURCE VOLTAGE (V)  
-VDS, DRAIN -SOURCE VOLTAGE (V)  
Figure 2 Typical Transfer Characteristics  
Figure 1 Typical Output Characteristics  
1.5  
1.2  
1.0  
0.9  
I
= -0.5A  
D
0.8  
0.7  
I
= -0.3A  
D
V
= -2.5V  
GS  
0.9  
0.6  
0.6  
0.5  
0.4  
V
= -4.5V  
GS  
0.3  
0.2  
0.3  
0
0.1  
0
0
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
0
2
4
6
8
10 12 14 16 18 20  
-VGS, GATE-SOURCE VOLTAGE (V)  
-ID, DRAIN SOURCE CURRENT (A)  
Figure 4 Typical Drain-Source On-Resistance  
vs. Gate-Source Voltage  
Figure 3 Typical On-Resistance vs.  
Drain Current and Gate Voltage  
1.6  
1.4  
1.4  
1.2  
V
I
= -10V  
GS  
= -1.0A  
D
V
= -4.5V  
GS  
T
= 150C  
A
1.0  
0.8  
0.6  
T
= 125C  
A
V
= -4.5V  
GS  
I
= -500mA  
1.2  
1.0  
D
T
= 85C  
A
T
= 25C  
A
T
= -55C  
A
0.4  
0.2  
0
0.8  
0.6  
0
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0  
-ID, DRAIN SOURCE CURRENT (A)  
-50 -25  
TJ, JUNCTION TEMPERATURE (  
Figure 6 On-Resistance Variation with Temperature  
0
25  
50  
75 100 125 150  
C)  
Figure 5 Typical On-Resistance vs.  
Drain Current and Temperature  
3 of 6  
www.diodes.com  
March 2013  
© Diodes Incorporated  
DMP32D4SW  
Document number: DS35823 Rev. 3 - 2  
DMP32D4SW  
1.5  
1.2  
2.6  
2.4  
2.2  
2.0  
1.8  
1.6  
-I = 1mA  
D
0.9  
0.6  
V
I
= -4.5V  
GS  
= -500mA  
D
-I = 250µA  
D
V
= -10V  
GS  
I
= -1.0A  
D
0.3  
0
1.4  
1.2  
-50 -25  
TJ, JUNCTION TEMPERATURE (  
Figure 7 On-Resistance Variation with Temperature  
0
25  
50  
75 100 125 150  
-50 -25  
0
25  
50  
75 100 125 150  
C)  
TA, AMBIENT TEMPERATURE (°C)  
Figure 8 Gate Threshold Variation vs. Ambient Temperature  
2.0  
1.8  
1.6  
f = 1MHz  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
100  
C
iss  
T = 150C  
A
C
oss  
10  
T = 125C  
A
C
rss  
T = 85C  
A
T = 25C  
A
0.2  
0
T = -55C  
A
1
0
5
10  
15  
20  
25  
30  
0
0.3  
0.6  
0.9  
1.2  
1.5  
-VDS, DRAIN-SOURCE VOLTAGE (V)  
-VSD, SOURCE-DRAIN VOLTAGE (V)  
Figure 10 Typical Junction Capacitance  
Figure 9 Diode Forward Voltage vs. Current  
10  
8
V
I
= -10V  
DS  
= -1A  
D
6
4
2
0
0
0.2  
0.4  
Qg, TOTAL GATE CHARGE (nC)  
Figure 11 Gate-Charge Characteristics  
0.6  
0.8  
1.0  
1.2 1.4  
4 of 6  
www.diodes.com  
March 2013  
© Diodes Incorporated  
DMP32D4SW  
Document number: DS35823 Rev. 3 - 2  
DMP32D4SW  
Package Outline Dimensions  
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.  
A
SOT323  
Dim  
A
B
C
D
G
H
J
K
L
Min  
Max  
0.40  
1.35  
2.20  
-
1.40  
2.20  
0.10  
1.00  
0.40  
0.18  
8°  
Typ  
0.30  
1.30  
2.10  
0.65  
1.30  
2.15  
0.05  
0.95  
0.30  
0.11  
-
0.25  
1.15  
2.00  
-
1.20  
1.80  
0.0  
0.90  
0.25  
0.10  
0°  
C
B
G
H
K
J
M
M
  
L
D
All Dimensions in mm  
Suggested Pad Layout  
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.  
Y
Dimensions Value (in mm)  
Z
Z
X
Y
C
E
2.8  
0.7  
0.9  
1.9  
1.0  
C
X
E
5 of 6  
www.diodes.com  
March 2013  
© Diodes Incorporated  
DMP32D4SW  
Document number: DS35823 Rev. 3 - 2  
DMP32D4SW  
IMPORTANT NOTICE  
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,  
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE  
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).  
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes  
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the  
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or  
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume  
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated  
website, harmless against all damages.  
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.  
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and  
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or  
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.  
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings  
noted herein may also be covered by one or more United States, international or foreign trademarks.  
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the  
final and determinative format released by Diodes Incorporated.  
LIFE SUPPORT  
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express  
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:  
A. Life support devices or systems are devices or systems which:  
1. are intended to implant into the body, or  
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the  
labeling can be reasonably expected to result in significant injury to the user.  
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the  
failure of the life support device or to affect its safety or effectiveness.  
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and  
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any  
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related  
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its  
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.  
Copyright © 2013, Diodes Incorporated  
www.diodes.com  
6 of 6  
www.diodes.com  
March 2013  
© Diodes Incorporated  
DMP32D4SW  
Document number: DS35823 Rev. 3 - 2  

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