DMTH4005SPS [DIODES]

N-CHANNEL ENHANCEMENT MODE MOSFET;
DMTH4005SPS
型号: DMTH4005SPS
厂家: DIODES INCORPORATED    DIODES INCORPORATED
描述:

N-CHANNEL ENHANCEMENT MODE MOSFET

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中文:  中文翻译
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Green  
DMTH4005SPS  
40V +175°C N-CHANNEL ENHANCEMENT MODE MOSFET  
PowerDI5060-8  
Product Summary  
Features  
Rated to +175°C Ideal For High Ambient Temperature  
Environments  
ID  
BVDSS  
RDS(ON) Max  
TC = +25°C  
(Note 9)  
100% Unclamped Inductive Switching Ensures More Reliable  
And Robust End Application  
Low RDS(ON) Minimizes Power Losses  
40V  
100A  
3.7mΩ @ VGS = 10V  
Low Qg Minimizes Switching Losses  
Lead-Free Finish; RoHS Compliant (Notes 1 & 2)  
Halogen and Antimony Free. “Green” Device (Note 3)  
Qualified to AEC-Q101 Standards for High Reliability  
An Automotive-Compliant Part is Available Under Separate  
Datasheet (DMTH4005SPSQ)  
Description and Applications  
This MOSFET is designed to minimize the on-state resistance  
(RDS(ON)), yet maintain superior switching performance, making it  
ideal for high-efficiency power management applications.  
Mechanical Data  
Engine Management Systems  
Body Control Electronics  
DC-DC Converters  
®
Case: PowerDI 5060-8  
Case Material: Molded Plastic, ―Green‖ Molding Compound.  
UL Flammability Classification Rating 94V-0  
Moisture Sensitivity: Level 1 per J-STD-020  
Terminal Finish - Matte Tin Annealed over Copper Leadframe.  
Solderable per MIL-STD-202, Method 208  
Weight: 0.097 grams (Approximate)  
PowerDI5060-8  
S
S
D
D
D
D
Pin1  
S
G
Top View  
Pin Configuration  
Top View  
Internal Schematic  
Bottom View  
Ordering Information (Note 4)  
Part Number  
Case  
Packaging  
DMTH4005SPS-13  
PowerDI5060-8  
2,500 / Tape & Reel  
Notes:  
1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied.  
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"  
and Lead-free.  
3. Halogen- and Antimony-free "Green‖ products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and  
<1000ppm antimony compounds.  
4. For packaging details, go to our website at https://www.diodes.com/design/support/packaging/diodes-packaging/.  
Marking Information  
D
D
D
D
= Manufacturer’s Marking  
H4005SS = Product Type Marking Code  
YYWW = Date Code Marking  
YY = Year (ex: 17 = 2017)  
H4005SS  
YY WW  
WW = Week (01 to 53)  
S
S
S
G
POWERDI is a registered trademark of Diodes Incorporated.  
1 of 7  
www.diodes.com  
September 2017  
© Diodes Incorporated  
DMTH4005SPS  
Document number: DS38150 Rev. 3 - 2  
DMTH4005SPS  
Maximum Ratings (@TA = +25°C, unless otherwise specified.)  
Characteristic  
Drain-Source Voltage  
Symbol  
VDSS  
Value  
40  
Unit  
V
Gate-Source Voltage  
±20  
V
VGSS  
TA = +25°C  
TA = +70°C  
TC = +25°C  
TC = +100°C  
20.9  
17.5  
Continuous Drain Current (Note 5)  
A
A
ID  
ID  
100  
100  
Continuous Drain Current (Notes 6 & 9)  
Maximum Continuous Body Diode Forward Current (Note 6)  
Pulsed Drain Current (10µs Pulse, Duty Cycle = 1%)  
Avalanche Current, L=0.6mH  
100  
320  
21  
A
A
IS  
IDM  
IAS  
A
132.3  
Avalanche Energy, L=0.6mH  
mJ  
EAS  
Thermal Characteristics  
Characteristic  
Total Power Dissipation (Note 5)  
Symbol  
PD  
Value  
2.6  
Unit  
W
TA= +25°C  
TC = +25°C  
Thermal Resistance, Junction to Ambient (Note 5)  
Total Power Dissipation (Note 6)  
57  
°C/W  
W
RθJA  
150  
1
PD  
Thermal Resistance, Junction to Case (Note 6)  
Operating and Storage Temperature Range  
°C/W  
°C  
RθJC  
-55 to +175  
TJ, TSTG  
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)  
Characteristic  
OFF CHARACTERISTICS (Note 7)  
Drain-Source Breakdown Voltage  
Zero Gate Voltage Drain Current  
Gate-Source Leakage  
Symbol  
Min  
Typ  
Max  
Unit  
Test Condition  
40  
V
BVDSS  
IDSS  
VGS = 0V, ID = 1mA  
VDS = 32V, VGS = 0V  
1
μA  
nA  
±100  
IGSS  
VGS = ±20V, VDS = 0V  
ON CHARACTERISTICS (Note 7)  
Gate Threshold Voltage  
2
2.9  
4
V
mΩ  
V
VGS(TH)  
RDS(ON)  
VSD  
VDS = VGS, ID = 250μA  
VGS = 10V, ID = 50A  
VGS = 0V, IS = 50A  
Static Drain-Source On-Resistance  
Diode Forward Voltage  
3.7  
0.88  
DYNAMIC CHARACTERISTICS (Note 8)  
Input Capacitance  
3062  
902.2  
179.2  
0.67  
49.1  
10.3  
13  
Ciss  
Coss  
Crss  
Rg  
VDS = 20V, VGS = 0V,  
f = 1MHz  
Output Capacitance  
pF  
Reverse Transfer Capacitance  
Gate Resistance  
VDS = 0V, VGS = 0V, f = 1MHz  
Total Gate Charge  
Qg  
VDD = 20V, ID = 50A,  
VGS = 10V  
Gate-Source Charge  
nC  
Qgs  
Qgd  
tD(ON)  
tR  
Gate-Drain Charge  
Turn-On Delay Time  
8.7  
Turn-On Rise Time  
6.8  
VDD = 20V, VGS = 10V,  
ID = 50A, RG = 3Ω  
ns  
Turn-Off Delay Time  
18.6  
7.3  
tD(OFF)  
tF  
Turn-Off Fall Time  
 
  
  
  
Body Diode Reverse Recovery Time  
Body Diode Reverse Recovery Charge  
ns  
31.8  
26.5  
tRR  
IF = 50A, di/dt = 100A/μs  
nC  
QRR  
Notes:  
5. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal bias to bottom layer 1-inch square copper plate.  
6. Thermal resistance from junction to soldering point (on the exposed drain pad).  
7. Short duration pulse test used to minimize self-heating effect.  
8. Guaranteed by design. Not subject to product testing.  
9. Package limited.  
2 of 7  
www.diodes.com  
September 2017  
© Diodes Incorporated  
DMTH4005SPS  
Document number: DS38150 Rev. 3 - 2  
DMTH4005SPS  
30  
25  
20  
15  
10  
5
100.0  
90.0  
80.0  
70.0  
60.0  
50.0  
40.0  
30.0  
20.0  
10.0  
0.0  
VDS = 6.0V  
VGS = 10.0V  
VGS = 6.0V  
VGS = 5.0V  
125  
85℃  
VGS = 4.5V  
VGS = 4.0V  
150℃  
175℃  
25℃  
VGS = 3.8V  
-55℃  
0
2
2.5  
3
3.5  
4
4.5  
5
0
0.5  
1
1.5  
2
2.5  
3
VGS, GATE-SOURCE VOLTAGE (V)  
VDS, DRAIN-SOURCE VOLTAGE (V)  
Figure 2 Typical Transfer Characteristic  
Figure 1 Typical Output Characteristic  
5.00  
4.50  
4.00  
3.50  
3.00  
2.50  
2.00  
20  
16  
12  
8
VGS = 6.0V  
ID = 50A  
ID = 20A  
VGS = 10.0V  
4
0
0
5
10  
15  
20  
25  
30  
2
4
6
8
10  
12  
14  
16  
18  
20  
ID, DRAIN-SOURCE CURRENT (A)  
VGS, GATE-SOURCE VOLTAGE (V)  
Figure 4 Typical Transfer Characteristic  
Figure 3 Typical On-Resistance vs. Drain Current and  
Gate Voltage  
2
1.8  
1.6  
1.4  
1.2  
1
0.006  
0.005  
0.004  
0.003  
0.002  
0.001  
VGS = 10V  
175℃  
VGS = 10V, ID = 50A  
150℃  
125℃  
85℃  
25℃  
VGS = 6V, ID = 50A  
0.8  
0.6  
0.4  
-55℃  
0
10 20 30 40 50 60 70 80 90 100  
ID, DRAIN CURRENT (A)  
-50 -25  
0
25  
50  
75 100 125 150 175  
TJ, JUNCTION TEMPERATURE ()  
Figure 5 Typical On-Resistance vs. Drain Current and  
Temperature  
Figure 6 On-Resistance Variation with Temperature  
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September 2017  
© Diodes Incorporated  
DMTH4005SPS  
Document number: DS38150 Rev. 3 - 2  
DMTH4005SPS  
0.01  
0.008  
0.006  
0.004  
0.002  
0
3.4  
3.2  
3
ID = 1mA  
2.8  
2.6  
2.4  
2.2  
2
VGS = 6V, ID = 50A  
ID = 250μA  
1.8  
1.6  
1.4  
1.2  
1
VGS = 10V, ID = 50A  
-50 -25  
0
25  
50  
75 100 125 150 175  
-50 -25  
0
25  
50  
75 100 125 150 175  
TJ, JUNCTION TEMPERATURE ()  
TJ, JUNCTION TEMPERATURE ()  
Figure 7 On-Resistance Variation with Temperature  
Figure 8 Gate Threshold Variation vs. Temperature  
10000  
1000  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
f = 1MHz  
C
iss  
VGS = 0V  
C
oss  
C
rss  
TA = 125oC  
TA = 150oC  
TA = 85oC  
TA = 25oC  
100  
10  
TA = 175oC  
TA = -55oC  
0
5
10  
15  
20  
25  
30  
VDS, DRAIN-SOURCE VOLTAGE (V)  
35  
40  
0
0.3  
0.6  
0.9  
1.2  
1.5  
VSD, SOURCE-DRAIN VOLTAGE (V)  
Figure 10 Typical Junction Capacitance  
Figure 9 Diode Forward Voltage vs. Current  
1000  
100  
10  
10  
RDS(ON) LIMITED  
8
6
4
V
I
= 20V  
DS  
PW=1µs  
PW=10µs  
PW=100µs  
PW=1ms  
= 50A  
D
TJ(MAX)=175℃  
TC=25℃  
Single Pulse  
DUT on infinite  
heatsink  
PW=10ms  
PW=100ms  
PW=1s  
1
2
0
VGS=10V  
0.1  
0
10  
20  
30  
40  
50  
0.1  
1
10  
100  
Qg, TOTAL GATE CHARGE (nC)  
Figure 11 Gate Charge  
VDS, DRAIN-SOURCE VOLTAGE (V)  
Figure 12 SOA, Safe Operation Area  
4 of 7  
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September 2017  
© Diodes Incorporated  
DMTH4005SPS  
Document number: DS38150 Rev. 3 - 2  
DMTH4005SPS  
1
D=0.7  
D=0.5  
D=0.3  
D=0.9  
0.1  
D=0.1  
D=0.05  
D=0.02  
0.01  
0.001  
D=0.01  
D=0.005  
D=Single Pulse  
RθJC(t) = r(t) * RθJC  
RθJC = 1/W  
Duty Cycle, D = t1 / t2  
1E-06  
1E-05  
0.0001  
0.001  
0.01  
0.1  
1
10  
t1, PULSE DURATION TIME (sec)  
Figure 13. Transient Thermal Resistance  
5 of 7  
www.diodes.com  
September 2017  
© Diodes Incorporated  
DMTH4005SPS  
Document number: DS38150 Rev. 3 - 2  
DMTH4005SPS  
Package Outline Dimensions  
Please see http://www.diodes.com/package-outlines.html for the latest version.  
PowerDI5060-8  
PowerDI5060-8  
D
D1  
Dim  
A
A1  
b
b2  
b3  
c
Min  
0.90  
0.00  
0.33  
0.200  
0.40  
0.230  
Max  
1.10  
0.05  
0.51  
0.350 0.273  
0.80 0.60  
Typ  
1.00  
-
Detail A  
c
0( 4X)  
A1  
0.41  
0.330 0.277  
5.15 BSC  
E1 E  
D
e
D1  
D2  
D3  
E
E1  
E2  
E3  
e
G
K
L
L1  
M
4.70  
3.70  
3.90  
5.10  
4.10  
4.30  
4.90  
3.90  
4.10  
01 ( 4X)  
1
6.15 BSC  
6.00  
3.68  
5.60  
3.28  
3.99  
5.80  
3.48  
4.19  
b ( 8X)  
L
e/2  
4.39  
1
1.27 BSC  
0.71  
b2 ( 4X)  
0.51  
0.51  
0.51  
0.100  
3.235  
1.00  
10º  
0.61  
-
0.61  
D3  
K
-
0.71  
0.200 0.175  
4.035 3.635  
1.40  
12º  
8º  
A
D2  
b3 ( 4X)  
E3  
E2  
M
M1  
θ
θ1  
1.21  
11º  
7º  
M1  
Detail A  
6º  
G
L1  
All Dimensions in mm  
Suggested Pad Layout  
Please see http://www.diodes.com/package-outlines.html for the latest version.  
PowerDI5060-8  
X4  
Dimensions  
Value (in mm)  
1.270  
0.660  
0.820  
0.610  
4.100  
0.755  
4.420  
5.610  
1.270  
0.600  
1.020  
0.295  
1.825  
3.810  
0.180  
6.610  
Y2  
X3  
C
G
G1  
X
Y3  
Y1  
X1  
X2  
X3  
X4  
Y
Y1  
Y2  
Y3  
Y4  
Y5  
Y6  
Y7  
X2  
Y5  
Y4  
X1  
Y7  
G1  
C
Y6  
Y( 4x)  
X
G
6 of 7  
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September 2017  
© Diodes Incorporated  
DMTH4005SPS  
Document number: DS38150 Rev. 3 - 2  
DMTH4005SPS  
IMPORTANT NOTICE  
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,  
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE  
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).  
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes  
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the  
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or  
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume  
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated  
website, harmless against all damages.  
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.  
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and  
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or  
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.  
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings  
noted herein may also be covered by one or more United States, international or foreign trademarks.  
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the  
final and determinative format released by Diodes Incorporated.  
LIFE SUPPORT  
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express  
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:  
A. Life support devices or systems are devices or systems which:  
1. are intended to implant into the body, or  
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the  
labeling can be reasonably expected to result in significant injury to the user.  
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the  
failure of the life support device or to affect its safety or effectiveness.  
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and  
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any  
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related  
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its  
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.  
Copyright © 2017, Diodes Incorporated  
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© Diodes Incorporated  
DMTH4005SPS  
Document number: DS38150 Rev. 3 - 2  

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