ES2G [DIODES]

2.0A SURFACE MOUNT SUPER-FAST RECTIFIER; 2.0A表面装载超快速整流器
ES2G
型号: ES2G
厂家: DIODES INCORPORATED    DIODES INCORPORATED
描述:

2.0A SURFACE MOUNT SUPER-FAST RECTIFIER
2.0A表面装载超快速整流器

二极管 光电二极管 功效 IOT
文件: 总2页 (文件大小:60K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
ES2G  
2.0A SURFACE MOUNT SUPER-FAST RECTIFIER  
Features  
·
·
·
Glass Passivated Die Construction  
Super-Fast Recovery Time For High Efficiency  
SMB  
Low Forward Voltage Drop and High Current  
Capability  
B
Dim  
A
Min  
3.30  
4.06  
1.96  
0.15  
5.00  
0.10  
0.76  
2.00  
Max  
3.94  
4.57  
2.21  
0.31  
5.59  
0.20  
1.52  
2.62  
·
·
·
Surge Overload Rating to 50A Peak  
Ideally Suited for Automated Assembly  
B
A
J
C
D
C
Plastic Material: UL Flammability  
Classification Rating 94V-0  
D
E
G
H
Mechanical Data  
·
·
Case: Molded Plastic  
J
Terminals: Solder Plated Terminal -  
Solderable per MIL-STD-202, Method 208  
G
H
All Dimensions in mm  
E
·
·
·
Polarity: Cathode Band or Cathode Notch  
Weight: 0.093 grams (approx.)  
Marking: Type Number  
@ TA = 25°C unless otherwise specified  
Maximum Ratings and Electrical Characteristics  
Single phase, half wave, 60Hz, resistive or inductive load.  
For capacitive load, derate current by 20%.  
Characteristic  
Symbol  
ES2G  
Unit  
VRRM  
VRWM  
VR  
Peak Repetitive Reverse Voltage  
Working Peak Reverse Voltage  
DC Blocking Voltage  
400  
V
VR(RMS)  
IO  
RMS Reverse Voltage  
280  
2.0  
V
A
Average Rectified Output Current  
@ TT = 110°C  
Non-Repetitive Peak Forward Surge Current  
8.3ms Single half sine-wave Superimposed on Rated Load  
(JEDEC Method)  
IFSM  
50  
A
Forward Voltage  
@ IF = 2.0A  
VFM  
IRM  
1.25  
V
5.0  
350  
Peak Reverse Current  
at Rated DC Blocking Voltage  
@ TA = 25°C  
@ TA = 125°C  
mA  
trr  
Cj  
Reverse Recovery Time (Note 3)  
25  
25  
ns  
pF  
Typical Junction Capacitance (Note 2)  
RqJT  
Tj, TSTG  
Typical Thermal Resistance, Junction to Terminal (Note 1)  
Operating and Storage Temperature Range  
20  
°C/W  
°C  
-55 to +150  
2
Notes:  
1. Unit mounted on PC board with 5.0 mm (0.013 mm thick) copper pads as heat sink.  
2. Measured at 1.0MHz and applied reverse voltage of 4.0V DC.  
3. Measured with IF = 0.5A, IR = 1.0A, Irr = 0.25A. See Figure 5.  
DS30212 Rev. A-2  
1 of 2  
ES2G  
10  
0.75  
2.0  
Tj = 25°C  
Pulse width = 300µs  
1.6  
1.0  
1.2  
0.8  
0.4  
0.1  
0
0.01  
25  
50  
75  
100  
125  
150  
175  
0
0.4  
0.8  
1.2  
1.6  
TT, TERMINAL TEMPERATURE (°C)  
Fig. 1 Forward Current Derating Curve  
VF, INSTANTANEOUS FORWARD VOLTAGE (V)  
Fig. 2 Typical Forward Characteristics  
1000  
60  
50  
40  
30  
20  
Single Half-Sine-Wave  
(JEDEC Method)  
Tj = 125°C  
100  
10  
Tj = 25°C  
1.0  
0.1  
10  
0
0
40  
80  
120  
1
10  
100  
NUMBER OF CYCLES AT 60Hz  
Fig. 3 Surge Current Derating Curve  
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)  
Fig. 4 Typical Reverse Characteristics  
trr  
+0.5A  
50NI (Non-inductive)  
10NI  
Device  
Under  
Test  
(-)  
0A  
(+)  
(-)  
Pulse  
Generator  
(Note 2)  
50V DC  
Approx  
-0.25A  
1.0Ω  
NI  
(+)  
Oscilloscope  
(Note 1)  
Notes:  
1. Rise Time = 7.0ns max. Input Impedance = 1.0M, 22pF.  
2. Rise Time = 10ns max. Input Impedance = 50.  
-1.0A  
Set time base for 50/100 ns/cm  
Fig. 5 Reverse Recovery Time Characteristic and Test Circuit  
DS30212 Rev. A-2  
2 of 2  
ES2G  

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