ES3xB-13-F [DIODES]
3.0A SURFACE MOUNT SUPER-FAST RECTIFIER; 3.0A表面装载超快速整流器
| 型号： | ES3xB-13-F |
| 厂家： | 
DIODES INCORPORATED |
| 描述： | 3.0A SURFACE MOUNT SUPER-FAST RECTIFIER |
| 文件： | 总4页 (文件大小：122K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ES3A/AB - ES3D/DB
Green
3.0A SURFACE MOUNT SUPER-FAST RECTIFIER
Features
Mechanical Data
•
•
•
•
•
•
Glass Passivated Die Construction
Super-Fast Recovery Time For High Efficiency
Surge Overload Rating to 100A Peak
Ideally Suited for Automated Assembly
Lead Free Finish/RoHS Compliant (Note 1)
Green Molding Compound (No Halogen and Antimony)
(Note 2)
•
•
Case: SMB/SMC
Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Lead Free Plating (Matte Tin Finish). Solderable per
MIL-STD-202, Method 208
Polarity: Cathode Band or Cathode Notch
SMB Weight: 0.093 grams (approximate)
SMC Weight: 0.21 grams (approximate)
•
•
•
•
•
Top View
Bottom View
Ordering Information (Note 3)
Part Number
ES3x-13-F
ES3xB-13-F
Case
SMC
SMB
Packaging
3000/Tape & Reel
3000/Tape & Reel
* x = Device type, e.g. ES3A-13-F (SMC package); ES3AB-13-F (SMB package).
Notes:
1. EU Directive 2002/95/EC (RoHS). All applicable RoHS exemptions applied, see EU Directive 2002/95/EC Annex Notes.
2. Product manufactured with Data Code 0924 (week 24, 2009) and newer are built with Green Molding Compound.
3. For packaging details, go to our website at http://www.diodes.com.
Marking Information
ES3x = Product type marking code, ex: ES3A (SMC package)
ES3xB = Product type marking code, ex: ES3AB (SMB package)
= Manufacturers’ code marking
YWW
YWW = Date code marking
Y = Last digit of year (ex: 2 for 2002)
ES3x(B)
WW = Week code (01 to 53)
1 of 4
www.diodes.com
November 2010
© Diodes Incorporated
ES3A/AB - ES3D/DB
Document number: DS14003 Rev. 15 - 2
ES3A/AB - ES3D/DB
Maximum Ratings @T = 25°C unless otherwise specified
A
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitance load, derate current by 20%.
Characteristic
Symbol
VRRM
VRWM
VR
ES3A/AB
ES3B/BB
100
ES3C/CB
150
ES3D/DB
200
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage (Note 4)
50
35
V
RMS Reverse Voltage
70
105
140
V
A
VR(RMS)
IO
3.0
Average Rectified Output Current
@ TT = 100°C
Non-Repetitive Peak Forward Surge Current 8.3ms
Single Half Sine-Wave Superimposed on Rated Load
100
A
IFSM
Thermal Characteristics
Characteristic
Symbol
Value
Unit
Typical Thermal Resistance, Junction to Terminal
10
°C/W
Rθ
Rθ
JT
Typical Thermal Resistance, Junction to Ambient (Note 5)
Operating and Storage Temperature Range
50
°C
°C
JA
-55 to +150
TJ, TSTG
Electrical Characteristics @T = 25°C unless otherwise specified
A
Characteristic
Maximum Forward Voltage
Symbol
Value
Unit
0.9
V
@ IF = 3.0A
@ TA 25°C
@ TA = 125°C
VFM
Peak Reverse Current
at Rated DC Blocking Voltage (Note 4)
=
10
500
IRM
trr
μA
ns
pF
Maximum Reverse Recovery Time (Note 6)
Typical Total Capacitance (Note 7)
25
45
CT
Notes:
4. Short duration pulse test used to minimize self-heating effect.
5. Unit mounted on PC board with 5.0 mm2 (0.013 mm thick) copper pads as heat sink.
6. Measured with IF = 0.5A, IR = 1.0A, Irr = 0.25A. See Figure 5.
7. Measured at 1.0MHz and applied reverse voltage of 4.0V DC.
10
4
3
Note 3
1.0
2
0.1
1
0
0.01
0
0.4
0.8
1.2
1.6
100
TT, TERMINAL TEMPERATURE (
Fig. 1 Forward Current Derating Curve
25
50
75
125
150
C)
175
°
VF, INSTANTANEOUS FORWARD VOLTAGE (V)
Fig. 2 Typical Forward Characteristics
2 of 4
www.diodes.com
November 2010
© Diodes Incorporated
ES3A/AB - ES3D/DB
Document number: DS14003 Rev. 15 - 2
ES3A/AB - ES3D/DB
1,000
100
120
100
Single Half-Sine-Wave
T
= 125°C
J
80
60
10
40
20
0
T
= 25°C
J
1.0
0
40
80
120
1
10
100
NUMBER OF CYCLES AT 60Hz
Fig. 3 Surge Current Derating Curve
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
Fig. 4 Typical Reverse Characteristics
Fig. 5 Reverse Recovery Time Characteristic and Test Circuit
Package Outline Dimensions
B
SMC
Min
SMB
Dim
A
B
C
D
E
G
H
Max
6.22
7.11
3.18
0.31
8.13
0.20
1.52
2.50
Dim
A
B
C
D
E
G
H
Min
3.30
4.06
1.96
0.15
5.00
0.05
0.76
2.00
Max
3.94
4.57
2.21
0.31
5.59
0.20
1.52
2.50
5.59
6.60
2.75
0.15
7.75
0.10
0.76
2.00
A
J
C
D
J
J
All Dimensions in mm
All Dimensions in mm
G
E
H
3 of 4
www.diodes.com
November 2010
© Diodes Incorporated
ES3A/AB - ES3D/DB
Document number: DS14003 Rev. 15 - 2
ES3A/AB - ES3D/DB
Suggested Pad Layout
SMB
Dimensions
SMC
Dimensions
Value (in mm)
Value (in mm)
Z
G
X
Y
C
6.7
1.8
2.3
2.5
4.3
Z
G
X
Y
C
9.3
4.4
3.3
2.5
6.8
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2010, Diodes Incorporated
www.diodes.com
4 of 4
www.diodes.com
November 2010
© Diodes Incorporated
ES3A/AB - ES3D/DB
Document number: DS14003 Rev. 15 - 2
相关型号：
©2020 ICPDF网 联系我们和版权申明