UZXTBM322TC [DIODES]
Small Signal Bipolar Transistor, 4.5A I(C), 20V V(BR)CEO, 1-Element, NPN, Silicon, 2 X 2 MM, MLP322, 5 PIN;![UZXTBM322TC](http://pdffile.icpdf.com/pdf2/p00244/img/icpdf/UZXTBM322TC_1478197_icpdf.jpg)
型号: | UZXTBM322TC |
厂家: | ![]() |
描述: | Small Signal Bipolar Transistor, 4.5A I(C), 20V V(BR)CEO, 1-Element, NPN, Silicon, 2 X 2 MM, MLP322, 5 PIN 开关 晶体管 |
文件: | 总6页 (文件大小:170K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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ZXTBM322
MPPS™ Miniature Package Power Solutions
20V NPN LOW SATURATION TRANSISTOR
SUMMARY
CEO
V
= 20V; R
= 47m ; I = 4.5A
SAT C
DESCRIPTION
Packaged in the innovative 2mm x 2mm MLP (Micro Leaded Package) outline,
this new 4th generation low saturation transistor offers extremely low on state
losses making it ideal for use in DC-DC circuits and various driving and power
management functions.
Additionally users will also gain several other key benefits:
Performance capability equivalent to much larger packages
Improved circuit efficiency & power levels
Lower package height (nom 0.9mm)
PCB area and device placement savings
Reduced component count
2mm x 2mm MLP
(single die)
C
FEATURES
•
•
•
•
•
Low Equivalent On Resistance
Extremely Low Saturation Voltage (150mV @1A)
hFE specified up to 6A
B
IC= 4.5A Continuous Collector Current
2mm x 2mm MLP
E
APPLICATIONS
•
•
•
•
DC - DC Converters (FET Drivers)
Power switches
Motor control
PINOUT
LED backlighting
ORDERING INFORMATION
DEVICE
REEL
TAPE
WIDTH PER REEL
QUANTITY
ZXTBM322TA
ZXTBM322TC
7’‘
8mm
8mm
3000 units
10000 units
13’‘
2mm x 2mm Single MLP
underside view
DEVICE MARKING
SB
ISSUE 2 - JUNE 2002
1
ZXTBM322
ABSOLUTE MAXIMUM RATINGS.
PARAMETER
SYMBOL
LIMIT
40
UNIT
V
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Peak Pulse Current (c)
Continuous Collector Current (a)
Continuous Collector Current (b)
Base Current
V
V
V
CBO
CEO
EBO
20
V
7.5
12
V
I
I
I
I
A
CM
4.5
5
A
C
C
B
A
1000
mA
Power Dissipation at TA=25°C (a)
Linear Derating Factor
P
P
P
P
1.5
12
W
D
D
D
D
mW/°C
Power Dissipation at TA=25°C (b)
Linear Derating Factor
2.45
19.6
W
mW/°C
Power Dissipation at TA=25°C (d)
Linear Derating Factor
1
8
W
mW/°C
Power Dissipation at TA=25°C (e)
Linear Derating Factor
3
24
W
mW/°C
Operating and Storage Temperature Range
T :T
-55 to +150
°C
j
stg
THERMAL RESISTANCE
PARAMETER
SYMBOL
VALUE
83
UNIT
°C/W
°C/W
°C/W
°C/W
Junction to Ambient (a)
Junction to Ambient (b)
Junction to Ambient (d)
Junction to Ambient (e)
NOTES
R
R
R
R
θJA
θJA
θJA
θJA
51
125
42
(a) For a single device surface mounted on 10sq cm1oz copper on FR4 PCB in still air conditions with all exposed pads attached.
(b) For a single device surface mounted on 10sq cm1oz copper on FR4 PCB in still air conditions measured at tр5 secs with all exposed pads
attached.
(c) Repetitive rating - pulse width limited by max junction temperature. refer to Transient Thermal Impedance graph.
(d) For a single device surface mounted on 10sq cm1oz copper on FR4 PCB in still air conditions with minimal lead connections only.
(e) For a single device surface mounted on 65sq cm2oz copper on FR4 PCB in still air conditions with all exposed pads attached.
(f) The minimum copper dimensions required for mounting are no smaller than the exposed metal pads on the base of the device, as shown in
the package dimensions data. The thermal resistance for a device mounted on 1.5mm thick FR4 board using minimum copper of 1oz weight is
Rth=300°C/W giving a power rating of Ptot=420mW.
ISSUE 2 - JUNE 2002
2
ZXTBM322
TYPICAL CHARACTERISTICS
3.5
3.0
V
CE(SAT)
10
1
Tamb=25°C
Limited
2.5
2.0
1.5
1.0
0.5
0.0
2oz Cu
Note: e
DC
1s
100ms
10ms
0.1
1oz Cu
Note: a
1ms
100us
Single Pulse, Tamb=25°C
1
0.01
0.1
10
0
25
50
75
100 125 150
V Collector-Emitter Voltage (V)
Temperature (°C)
CE
Derating Curve
Safe Operating Area
225
200
175
150
125
100
75
80
60
40
20
0
D=0.5
1oz copper
Single Pulse
D=0.05
D=0.1
D=0.2
50
25
2oz copper
10
0
100µ 1m 10m 100m
1
10 100 1k
0.1
1
100
Pulse Width(s)
BoardCuArea(sqcm)
Transient Thermal Impedance
Thermal Resistance v Board Area
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
T
=25°C
2oz copper
Tjammabx=150°C
Continuous
1oz copper
0.1
1
10
100
BoardCuArea(sqcm)
Power Dissipation v Board Area
ISSUE 2 - JUNE 2002
3
ZXTBM322
ELECTRICAL CHARACTERISTICS (at T
= 25°C unless otherwise stated).
amb
PARAMETER
SYMBOL
MIN.
40
TYP.
100
MAX. UNIT
V
CONDITIONS.
I =100A
Collector-Base Breakdown
Voltage
V
V
V
(BR)CBO
(BR)CEO
C
Collector-Emitter Breakdown
Voltage
20
27
V
V
I =10mA*
C
Emitter-Base Breakdown Voltage
Collector Cut-Off Current
7.5
8.2
I =100A
E
(BR)EBO
CBO
I
I
I
25
25
25
nA
nA
nA
V
V
V
=32V
CB
Emitter Cut-Off Current
=6V
EBO
EB
Collector Emitter Cut-Off Current
=16V
CES
CES
Collector-Emitter Saturation
Voltage
V
8
15
mV
mV
mV
mV
mV
I =0.1A, I =10mA*
C B
CE(sat)
90
150
135
250
270
I =1A, I =10mA*
C B
I =2A, I =50mA*
115
190
210
C
B
I =3A, I =100mA*
C
B
I =4.5A, I =125mA*
C
B
Base-Emitter Saturation Voltage
Base-Emitter Turn-On Voltage
V
V
h
0.98
0.88
1.05
0.95
V
V
I =4.5A, I =125mA*
C B
BE(sat)
BE(on)
FE
I =4.5A, V =2V*
CE
C
Static Forward Current Transfer
Ratio
200
300
200
100
400
450
360
180
I =10mA, V =2V*
CE
C
I =0.2A, V =2V*
C
C
CE
CE
I =2A, V =2V*
I =6A, V =2V*
CE
C
Transition Frequency
f
100
140
MHz
I =50mA, V =10V
T
C
CE
f=100MHz
Output Capacitance
Turn-On Time
C
23
30
pF
ns
ns
V
=10V, f=1MHz
obo
(on)
(off)
CB
t
t
170
400
V
=10V, I =3A
CC
C
I
=I =10mA
B1 B2
Turn-Off Time
*Measured under pulsed conditions. Pulse width=300µs. Duty cycle ≤ 2%
ISSUE 2 - JUNE 2002
4
ZXTBM322
TYPICAL CHARACTERISTICS
0.25
IC/IB=50
0.20
Tamb=25°C
100m
10m
1m
100°C
25°C
0.15
0.10
0.05
0.00
IC/IB=100
IC/IB=50
-55°C
IC/IB=10
IC10mCollector Current 1(A)
IC10mCollector Current 1(A)
1m
100m
10
1m
100m
10
VCE(SAT) vIC
VCE(SAT) vIC
630
540
450
360
270
180
90
V =2V
IC/IB=50
CE
1.0
1.2
1.0
0.8
0.6
0.4
0.2
0.0
100°C
25°C
0.8
0.6
0.4
-55°C
25°C
-55°C
100°C
100m
0
IC Collector Current (A) 10
IC10mCollector Current 1(A)
1m
10m
100m
1
1m
10
h vIC
VBE(SAT) vIC
FE
V =2V
1.0
0.8
0.6
0.4
CE
-55°C
25°C
100°C
1m
100m
10
IC10mCollector Current 1(A)
VBE(ON) vIC
ISSUE 2 - JUNE 2002
5
ZXTBM322
MLP322 PACKAGE OUTLINE (2mm x 2mm Micro Leaded Package)
CONTROLLING DIMENSIONS IN MILLIMETRES
APPROX. CONVERTED DIMENSIONS IN INCHES
PACKAGE DIMENSIONS
MILLIMETRES
MIN. MAX.
0.80 1.00
INCHES
MIN.
MILLIMETRES
MIN. MAX.
INCHES
MIN. MAX.
DIM
DIM
MAX.
0.0393
0.002
A
A1
A2
A3
b
0.0315
0.00
e
E
0.65 REF
2.00 BSC
0.0255 REF
0.0787 BSC
0.00
0.65
0.15
0.18
0.17
0.05
0.75
0.25
0.28
0.30
0.0255
0.0059
0.0070
0.0066
0.0295
0.0098
0.0110
0.0118
E2
E4
L
0.79
0.99
0.68
0.45
0.031
0.039
0.0267
0.0177
0.48
0.20
0.0188
0.0078
b1
D
L2
r
0.125 MAX.
0.075 BSC
0Њ 12Њ
0.005 REF
0.0029 BSC
0Њ 12Њ
2.00 BSC
0.0787 BSC
D2
D4
1.22
0.56
1.42
0.76
0.0480
0.0220
0.0559
0.0299
⍜
© Zetex plc 2002
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Zetex plc
Fields New Road
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Oldham, OL9 8NP
United Kingdom
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Fax: (44) 161 622 4420
uksales@zetex.com
Zetex GmbH
Streitfeldstraße 19
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Zetex Inc
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Hauppauge, NY11788
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Telefon: (49) 89 45 49 49 0
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europe.sales@zetex.com
Telephone: (631) 360 2222
Fax: (631) 360 8222
usa.sales@zetex.com
These offices are supported by agents and distributors in major countries world-wide.
This publication is issued to provide outline information only which (unless agreed by the Company in writing) may not be used, applied or reproduced
for any purpose or form part of any order or contract or be regarded as a representation relating to the products or services concerned. The Company
reserves the right to alter without notice the specification, design, price or conditions of supply of any product or service.
For the latest product information, log on to www.zetex.com
ISSUE 2 - JUNE 2002
6
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