SA156 [DIOTEC]
Fast Switching Surface Mount Si-Rectifiers; 快速开关表面贴装硅整流器型号: | SA156 |
厂家: | DIOTEC SEMICONDUCTOR |
描述: | Fast Switching Surface Mount Si-Rectifiers |
文件: | 总2页 (文件大小:165K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
SA 154 … SA 160
Fast Switching
Schnelle Si-Gleichrichter
Surface Mount Si-Rectifiers
für die Oberflächenmontage
Nominal current – Nennstrom
1 A
Repetitive peak reverse voltage
Periodische Spitzensperrspannung
50…1000 V
DO-213AB
0.12 g
Plastic case MELF
Kunststoffgehäuse MELF
Weight approx. – Gewicht ca.
Plastic material has UL classification 94V-0
Gehäusematerial UL94V-0 klassifiziert
Standard packaging taped and reeled
Standard Lieferform gegurtet auf Rolle
see page 18
siehe Seite 18
Dimensions / Maße in mm
Maximum ratings
Grenzwerte
Type
Typ
Repetitive peak reverse voltage
Periodische Spitzensperrspannung
Surge peak reverse voltage
Stoßspitzensperrspannung
VRSM [V]
VRRM [V]
SA 154
SA 155
SA 156
SA 157
SA 158
SA 159
SA 160
50
50
100
200
400
600
800
1000
100
200
400
600
800
1000
Max. average forward rectified current, R-load
Dauergrenzstrom in Einwegschaltung mit R-Last
TT = 100ꢀC
f > 15 Hz
TA = 25ꢀC
TA = 25ꢀC
IFAV
IFRM
IFSM
i2t
1 A
10 A 1)
35 A
Repetitive peak forward current
Periodischer Spitzenstrom
Peak forward surge current, 50 Hz half sine-wave
Stoßstrom für eine 50 Hz Sinus-Halbwelle
Rating for fusing, t < 10 ms
Grenzlastintegral, t < 10 ms
6 A2s
1
)
Max. temperature of the terminals TT = 100ꢀC – Max. Temperatur der Anschlüsse TT = 100ꢀC
98
28.02.2002
SA 154 … SA 160
Operating junction temperature – Sperrschichttemperatur
Storage temperature – Lagerungstemperatur
Tj
TS
– 50...+175ꢀC
– 50...+175ꢀC
Characteristics
Kennwerte
Forward voltage – Durchlaßspannung
Leakage current – Sperrstrom
Tj = 25ꢀC
IF = 1 A
VF
< 1.3 V
Tj = 25ꢀC
Tj = 100ꢀC
VR = VRRM
VR = VRRM
IR
IR
< 5 ꢀA
< 100 ꢀA
Reverse recovery time
Sperrverzug
IF = 0.5 A through/über
IR = 1 A to/auf IR = 0.25A
trr
< 300 ns
< 45 K/W 1)
< 15 K/W
Thermal resistance junction to ambient air
Wärmewiderstand Sperrschicht – umgebende Luft
RthA
RthT
Thermal resistance junction to terminal
Wärmewiderstand Sperrschicht – Kontaktfläche
1
)
Mounted on P.C. board with 25 mm2 copper pads at each terminal
Montage auf Leiterplatte mit 25 mm2 Kupferbelag (Lötpad) an jedem Anschluß
99
28.02.2002
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