DS402ST09 [DYNEX]

Rectifier Diode; 整流器器二极管


型号：	DS402ST09
厂家：	Dynex Semiconductor
描述：	Rectifier Diode 整流器器二极管整流二极管
文件：	总7页 (文件大小：58K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

DS402ST

Rectifier Diode

Replaces March 1998 version, DS4183-2.3

DS4183-3.0 January 2000

APPLICATIONS

■ Rectification

KEY PARAMETERS

V_RRM

I_F(AV)

I_FSM

1400V

505A

5600A

■ Freewheel Diode

■ DC Motor Control

■ Power Supplies

■ Welding

■ Battery Chargers

FEATURES

■ Double Side Cooling

■ High Surge Capability

VOLTAGE RATINGS

Type Number

Repetitive Peak

Conditions

Reverse Voltage

V_RRM

DS402ST14

DS402ST13

DS402ST12

DS402ST11

DS402ST10

DS402ST09

_RSM= V_RRM+ 100V

1400

1300

1200

1100

1000

900

Lower voltage grades available.

Outline type code: T.

See Package Details for further information.

CURRENT RATINGS

Max.

Units

Symbol

Parameter

Conditions

Double Side Cooled

I_F(AV)

Half wave resistive load, T_case= 100^oC

T_case= 100^oC

505

793

640

Mean forward current

RMS value

Continuous (direct) forward current

Single Side Cooled (Anode side)

I_F(RMS)

I_F

_case= 100^oC

I_F(AV)

I_F(RMS)

I_F

Mean forward current

RMS value

Half wave resistive load, T_case= 100^oC

_case= 100^oC

T_case= 100^oC

365

573

390

Continuous (direct) forward current

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DS402ST

SURGE RATINGS

Parameter

Conditions

10ms half sine; T_case= 175^oC

V_R= 50% V_RRM- 1/4 sine

10ms half sine; T_case= 175^oC

V_R= 0

Max.

4.5

Units

Symbol

I_FSM

I²t

Surge (non-repetitive) forward current

I²t for fusing

101 x 10³

5.6

A²s

I_FSM

I²t

Surge (non-repetitive) forward current

I²t for fusing

155 x 10³

A²s

THERMAL AND MECHANICAL DATA

Conditions

Min.

Max. Units

Parameter

Symbol

0.08

0.16

^oC/W

Double side cooled

R_th(j-c)

Anode dc

Thermal resistance - junction to case

Single side cooled

Cathode dc

Double side

0.16

0.02

0.04

185

175

200

^oC/W

^oC

Clamping force 4.5kN

with mounting compound

Thermal resistance - case to heatsink

Virtual junction temperature

R_th(c-h)

Single side

On-state (conducting)

Reverse (blocking)

T_vj

^oC

T_stg

Storage temperature range

Clamping force

-55

^oC

3.5

5.0

CHARACTERISTICS

Symbol

Parameter

Forward voltage

Peak reverse current

Conditions

Min.

Max. Units

V_FM

I_RRM

V_TO

r_T

At 450A peak, T_case= 25^oC

At V_RRM, T_case= 175^oC

At T_vj= 175˚C

1.25

Threshold voltage

Slope resistance

0.81

0.84

At T_vj= 175˚C

mΩ

2/7

DS402ST

CURVES

2000

1500

1000

500

Measured under pulse conditions

T_j= 25˚C

T_j= 175˚C

2.50

0.50

1.00

1.50

2.00

Instantaneous forward voltage V_F- (V)

Fig. 1 Maximum (limit) forward characteristics

3/7

DS402ST

1200

1000

800

600

400

200

Half wave

3 phase

6 phase

200

400

600

800

Mean forward current I_F(AV)- (A)

Fig. 2 Dissipation curves

4/7

DS402ST

I²t = Î²x t

100

I²t

2 3 5 10 20 50

Cycles at 50Hz

Duration

Fig. 3 Surge (non-repetitive) forward current vs time (with 50% V_RRM, T_case= 175˚C)

1.0

0.1

Conduction Effective thermal resistance

Junction to case ˚C/W

Double side Single side

d.c.

Halfwave

3 phase 120˚

6 phase 60˚

0.08

0.09

0.12

0.16

0.17

0.20

Anode side cooled

Double side cooled

0.01

0.001

0.01

0.1

Time - (s)

Fig. 4 Transient thermal impedance - junction to case - (˚C/W)

5/7

DS402ST

PACKAGE DETAILS

For further package information, please contact your local Customer Service Centre. All dimensions in mm, unless stated otherwise.

DO NOT SCALE.

2 holes Ø3.6 x 2.0 deep

(One in each electrode)

Cathode

Ø42 max

Ø19 nom

Anode

Ø37.5 max

Nominal weight: 50g

Clamping force: 4.5kN ±10%

Package outine type code: T

ASSOCIATED PUBLICATIONS

Title

Application Note

Number

Calculating the junction temperature or power semiconductors

Recommendations for clamping power semiconductors

Thyristor and diode measurement with a multi-meter

Use of V_TO, r_Ton-state characteristic

AN4506

AN4839

AN4853

AN5001

6/7

DS402ST

POWER ASSEMBLY CAPABILITY

The Power Assembly group was set up to provide a support service for those customers requiring more than the basic semiconduc-

tor, and has developed a flexible range of heatsink / clamping systems in line with advances in device types and the voltage and

current capability of our semiconductors.

We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The

Assembly group continues to offer high quality engineering support dedicated to designing new units to satisfy the growing needs of

our customers.

Using the up to date CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete

solution (PACs).

DEVICE CLAMPS

Disc devices require the correct clamping force to ensure their safe operation. The PACs range offers a varied selection of pre-

loaded clamps to suit all of our manufactured devices. This include cube clamps for single side cooling of ‘T’ 22mm

Clamps are available for single or double side cooling, with high insulation versions for high voltage assemblies.

Please refer to our application note on device clamping, AN4839

HEATSINKS

Power Assembly has it’s own proprietary range of extruded aluminium heatsinks. They have been designed to optimise the

performance or our semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on

request.

For further information on device clamps, heatsinks and assemblies, please contact your nearest Sales Representative or the

factory.

http://www.dynexsemi.com

e-mail: power_solutions@dynexsemi.com

HEADQUARTERS OPERATIONS

CUSTOMER SERVICE CENTRES

France, Benelux, Italy and Spain Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 64 46 54 50

North America Tel: 011-800-5554-5554. Fax: 011-800-5444-5444

UK, Germany, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020

DYNEX SEMICONDUCTOR LTD

Doddington Road, Lincoln.

Lincolnshire. LN6 3LF. United Kingdom.

Tel: 00-44-(0)1522-500500

SALES OFFICES

Fax: 00-44-(0)1522-500550

France, Benelux, Italy and Spain Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 64 46 54 50

Germany Tel: 07351 827723

DYNEX POWER INC.

Unit 7 - 58 Antares Drive,

Nepean, Ontario, Canada K2E 7W6.

Tel: 613.723.7035

Fax: 613.723.1518

Toll Free: 1.888.33.DYNEX (39639)

North America Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) /

Tel: (831) 440-1988. Fax: (831) 440-1989 / Tel: (949) 733-3005. Fax: (949) 733-2986.

UK, Germany, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020

These offices are supported by Representatives and Distributors in many countries world-wide.

TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRINTED IN UNITED KINGDOM

Datasheet Annotations:

Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:-

Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started.

Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change.

Advance Information: The product design is complete and final characterisation for volume production is well in hand.

No Annotation: The product parameters are fixed and the product is available to datasheet specification.

This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as

a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves

the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such

methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication

or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury

or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request.

All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners.

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