MAS1916CC [DYNEX]

Logic Circuit;


型号：	MAS1916CC
厂家：	Dynex Semiconductor
描述：	Logic Circuit
文件：	总11页 (文件大小：94K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

MA1916

Radiation Hard Reed-Solomon

& Convolution Encoder

Replaces June 1999 version, DS3590-4.0

DS3590-5.0 January 2000

The purpose of the MA1916 is to encode serial data to

allow error correction when the data is transmitted over a noisy

communication link. As the name suggests, the unit contains

two encoding elements. The Reed-Solomon encoder appends

a checksum to a block of data, guarding against burst errors in

a message. The convolution encoder continuously creates two

code bits for each data bit it receives, increasing the noise

immunity by doubling the band width of the message. The unit

also contains a test pattern generator which can be connected

to check the functionality of the RS encoder and to provide a

message timing signal (SMC_OUT).

FEATURES

■ Radiation Hard CMOS-SOS Technology

■ Low Power Consumption

■ Latch-up Free

■ High SEU Immunity

■ CCSDS Standard RS (255, 223)

■ Selectable Interleave Depths of 1, 4 or 5

■ 5MBit/sec Input Data Rate

Protection against a long error-burst can be increased by

interleaving a number of message packets passing through

the RS encoder. The MA1916 provides pin selectable

interleave depths of 1, 4 or 5. Interleave depths of greater than

5 do not significantly improve performance.

The MA1916 is designed to conform to the CCSDS

standard for telemetry 101.0.B.2. It is manufactured in a

radiation hard low power CMOS technology. This makes it

ideal for use in satellite communications systems. The encoder

reduces the risk of data corruption and allows the designer to

minimize the transmitter power needed to establish an

effective communications link.

Figure 1: Block Diagram

1/11

MA1916

OPERATION

While SMC is high the data on MSG is buffered and appears

on RSE_OUT as well as being clocked into the encoder. As

soon as SMC goes low the checksum is clocked out of the

encoder onto RSE_OUT.

While SMC is high the RSE_OUT signal follows the input

MSG. When SMC is low RSE_OUT is produced from the

exclusive-OR of MSG and the checksum signal. For this

reason MSG must be held low while the encoder outputs the

checksum.

A gap can be left between successive data packets by

holding SMC and MSG low after the checksum has been sent.

Alternatively, synchronisation code can be inserted before a

data block by holding SMC low and placing the code on MSG.

As soon as SMC goes high any further data on MSG is

assumed to form part of a message and will be encoded

accordingly.

Note: External logic must guarantee the SMC is high for

the correct period, ie only while 223 x I bytes (I = interleave

depth) of data are clocked through. Otherwise when SMC falls

an invalid checksum will be produced.

REED-SOLOMON ENCODER

The function of the Reed-Solomon (RS) encoder is to take

a block of 223 bytes of serial data and to append a checksum

of 32 bytes. The purpose of the checksum is to allow error

correction within the data block. One important feature of the

Reed-Solomon algorithm is that it allows correction of a burst

error which corrupts upto 16 consecutive bytes. If a number of

messages are interleaved this length can be increased. The

MA1916 provides pin selectable interleave depths of 1, 4 or 5

blocks (see Table 1), each of 223 bytes. An interleave depth of

5 is the maximum recommended by the CCSDS standard.

This will allow correction of up to 80 sequencial bytes in a data

packet.

The RS encoder operates from a clock input CLK which

must be driven at twice the input data rate. Internally CLK is

divided to give a clock CLKS which runs at half the frequency.

This signal is available as an output and is used to time data

into the RS encoder.

A high input on SMC is used to tell the RS encoder that

data to be encoded is present on the MSG pin (see Figure 2).

SEL_A SEL_B Interleave

SMC_OUT Period (Bytes)

I = Depth SMC_OUT = 1 SMC_OUT = 0

5 x 223

4 x 223

1 x 223

5 x 223

5 x 32

4 x 32

1 x 32

5 x 32

Table 1: Interleave Length Defined by SEL_A and SEL_B

I = Interleave depths of 1, 4 or 5

SYNC:

If SMC is low and no checksum is being output any data on MSG will appear on RSE_OUT.

This feature can be used to insert a synchronisation sequence before a data block.

Data block 223 x I bytes in length.

DATA:

CHECKSUM: The checksum is 32 x I bytes long and appended to the data by the RS encoder.

Figure 2: Reed-Solomon Encoder Operation

2/11

MA1916

CONVOLUTION ENCODER

The convolution encoder generates 2 serial bits of output

data for each bit it reads in. The coding operates cyclically over

a length of 7 bits. It increases the bandwidth of the signal but

establishes a correlation between succesive bits in the output

signal.

The convolution encoder operates continuously using

CE_CLK to read data in on CE_IN and to write the encoded

data to CE_OUT.

If required the output of the Reed-Solomon encoder can be

fed directly into the convolution encoder by connecting

RSE_OUT to CE_ IN and CLKS to CE_CLK.

TEST GENERATOR

The MA1916 contains its own built-in test pattern

generator, this can be connected to the RS encoder for in

service testing. The test generator supplies test patterns and

the SMC signal according to the inputs on T0-2 (see Table 2)

and the interleave depth selected using SEL_A and SEL_B.

Figure 3 shows the necessary connections for feeding test

patterns through both the RS and the convolution encoder.

Figure 3: Test Configuration

Interleave Depth

Test

I = 5 (1115 bytes)

I = 4 (892 bytes)

I = 1 (223 bytes)

N/A

(1, 2, 3, 4, 5) x 223

(0) x 222 x 5, (0) x 4, (7B)

(0) x 222 x 5, (7B, AF, 99, FA, B7)

(0) x 221 x 5, (7B) x 5, (47) x 5

(1, 2, 3, 4) x 223

(1) x 223

(0) x 222 x 4, (0) x 3, (7B)

(0) x 222 x4, (7B, AF, 99, FA)

(0) x 221 x 4, (7B) x 4, (47) x 4

(0) x 222, 7B

Other

N/A

Table 2: Test Pattern on MSG_OUT Defined by T0-2

PIN DESCRIPTION

V_DDand GND (Power and Ground)

SEL_A and SEL_B (Interleave Depth Select)

The MA1916 uses a single power supply of 5V ±10%.

These inputs define the interleave depth of a message

passing through the RS encoder They also specify the

message length to be produced by the test generator (see

Table 1). The inputs are connected to internal pulldown

resistors.

CLK (Clock)

This input supplies a clock signal to the RS encoder and

the Test generator. It requires a signal with a nominal 50%

duty cycle running at twice the input data rate for the RS

encoder. The rising edge of CLK is used to generate the

internal CLKS signal which clocks data through the RS

encoder.

_0-2(Test Pattern Select)

These inputs select the pattern to be produced by the test

generator (see Table 2). Each input is connected to an internal

pull-down resistor.

n_RST (Reset)

T₃(Production Test Input)

This input is used for production testing only It has an

internal pull-down resistor and should be left unconnected .

This active low signal is a reset supplied to the RS encoder,

the test generator and the convolution encoder. It should be

noted that the reset does not clear the check sum in the RS

encoder and a complete dummy data packet should be run

through before valid data is sent.

MSG_OUT (Test Message Output)

This output pin carries the test patterns defined by the

inputs To-2 and produced by the test generator. This signal

can be connected directly to MSG for testing purposes.

3/11

MA1916

SMC_OUT (Select Message or Checksum)

This output signal is held high while the test generator clocks

out a data packet on the MSG_OUT pin. When the packet is

complete this signal goes low. It is held low for a period equal to

the time required by the RS encoder to send the corresponding

checksum. When this is complete the signal goes high and the

test generator begins a new data packet. This signal can be

connected directly to SMC for testing purposes.

READY (Test Data Valid)

This output is held low during reset and remains low for the

first complete cycle of SMC_OUT. READY rises on the second

rising edge of SMC_OUT and remains high to indicate the

presence of valid data on MSG_OUT.

Figure 4: Reed-Solomon Encoder

ST1 (RS Encoder Output Valid)

This output is set low during a reset and goes high when

sufficient dummy data has been clocked through the RS

encoder to clear it (see Figure 5).

CLKS (Synchronisation Clock)

This output clock runs at half the speed of the input clock

CLK. CLKS remains low after n_RST is raised until SMC is

raised, SMC being captured on the falling edge of CLK (timing

4). CLKS then changes state on the rising edge of each CLK

cycle regardless of the state of SMC. The signal is used to

clock data into and out of the RS encoder.

SYZ (Byte Rate Clock)

SYZ is a byte rate clock output derived from CLKS. It is

high during every eighth period of CLKS and low at other

times.

MSG (Message)

SZY (Byte Rate Clock)

MSG is the data input to the RS encoder. Each bit is read in

on the rising edge of CLKS. While the SMC signal is high data

on the input passes directly to the output RSE_OUT. While

SMC is low RSE_OUT is the logical XOR of the MSG input and

the output of the check-sum generator. Therefore MSG must

be held low while the RS encoder is clocking out the check

sum (see Figure 4).

SZY is a byte rate clock output derived from CLKS. It is low

during every eighth period of CLKS and high at other times. It

is the inverse of SYZ.

ST2 (Production Test Output)

The output is used for production testing and should be left

unconnected.

SMC (Select Message or Checksum)

TEST_POINT (Production Test Output)

This output is used for production testing and should be left

unconnected.

While the SMC input is high, data on the MSG pin is

clocked into the RS encoder. SMC is held high for a period

dictated by the interleave depth being used (see Table 1).

When SMC falls the RS encoder begins to clock out the

checksum for the preceeding data. SMC should be held low

until the complete checksum has been output. The rising edge

of SMC indicates the start of a new data block to be encoded.

CE_IN (Convolution Encoder Data In)

This input is used to read data into the convolution

encoder. The state of CE_IN is read on the rising edge of

CE_CLK.

RSE_OUT (Reed-Solomon Encoder Output)

This signal outputs the completed data packet comprised

of the message followed by its associated checksum block.

The data is valid on the rising edge of CLKS.

n_RST

SMC

MSG

CLKS

ST1

Output Valid

Note: ST1 rises on the second rising edge of SMC following n_RST high.

CLKS starts toggling on the first rising edge of SMC following n_RST high.

Figure 5: Reed-Solomon Encoder Operation

4/11

MA1916

CE_CLK (Convolution Encoder Clock)

CE_OUT (Convolution Encoder Output)

The CE_CLK input drives the timing of the convolution

encoder. Data is read in on CE_IN on the rising edge of

CE_CLK and output on CE_OUT on both the rising and falling

edge of CE_CLK.

This signal carries the output data from the convolution

encoder. The data rate on CE_OUT is twice that of CE_IN.

CLK_OUT (Clock Out)

Note: The output data rate is twice the input data rate.

A 50% duty cycle clock is required. If this is provided by the

CLKS output, data can be read directly from RSE_OUT to the

CE_IN input (see figure 3).

CLK_OUT is a buffered output of the CLK input signal. If

CLKS is connected to CE_CLK to drive the convolution

encoder, CE_OUT can be captured on the falling edge of

CLK_OUT.

DC CHARACTERISTICS AND RATINGS

Note: Stresses above those listed may cause permanent

damage to the device. This is a stress rating only and

functional operation of the device at these conditions, or at

any other condition above those indicated in the operations

section of this specification, is not implied. Exposure to

absolute maximum rating conditions for extended periods

may affect device reliability.

Parameter

Min

-0.5

-0.3

-20

-55

-65

Max

Units

Supply Voltage

Input Voltage

_DD+0.3

+20

125

150

Current Through Any Pin

Operating Temperature

Storage Temperature

°C

Table 3: Absolute Maximum Ratings

Symbol Parameter

Conditions

Min

Typ

Max

Units

V_DD

V_IH

V_IL

Supply Voltage

4.5

5.0

5.5

V_DD

0.2 V_DD

CMOS Input High Voltage

CMOS Input Low Voltage

CMOS Output High Voltage

CMOS Output Low Voltage

Input Leakage Current

Input Pull-Down Current

Static Power Supply Current

Dynamic Power Supply Current

V_DD= 5.5V

0.8 V_DD

V_SS

V_OH

V_OL

I_IL

I_PDL

I_DD1

I_DD2

V_DD= 5V, I_OH= -1.0mA

V_DD= 5V, I_OL= 4.0mA

V_DD= 5.5V, V_IN= V_SSor V_DD

V_DD= 5.5V

V_DD-0.5

-10

-20

0.4

150

2.5

µA

0.1

CLK = 10MHz, V_DD= 5.5V

Notes: 1. V_DD= 5V±10%, over full operating temperature range. 2. Total dose radiation not exceeding 1x10⁵Rads(Si)

3. Mil-Std-883, method 5005, subgroups 1, 2, 3

Table 4: DC Electrical Characteristics

AC CHARACTERISTICS

No.

Parameter

Min.

Max. Units

CLK hlgh to CLKS

CLK high to SYZ or SZY

SMC hold after CLK low

SMC setup to CLK low

MSG set up to CLKS high

MSG hold after CLKS high

MSG to RSE_OUT propagation delay

CLKS to RSE_OUT (SMC low)

CLK to CLK_OUT propagation delay

CE_IN setup to CE_CLK hlgh

CE_IN hold after CE_CLK high

CE_CLK to CE_OUT

Note: Mil-Std-883, method 5005,

subgroups 9, 10, 11

CLK CYCLE TIME

100

Table 5: AC Electrical Characteristics

5/11

MA1916

Symbol

Parameter

Conditions

Min.

Typ.

Max.

Units

C_IN

Input Capacitance

Output Capacitance

V_l= 0V

C_OUT

V_I/O= 0V

Note: T_A= 25°C and f = 1MHz. Data obtained by characterisation or analysis; not routinely measured.

Table 6: Capacitance

Symbol

Parameter

Conditions

F_T

Functionality

V_DD= 4.5V - 5.5V, Frequency = 1MHz

V_IL= V_SS, V_IH= V_DD, V_OL= V_OH= V_DD/2

Temperature = -55°C to +125°C, Radiation to 1MRad Total Dose

Mil-Std-883, method 5005, subgroups 7, 8A, 8B

Table 7: Functionality

Subgroup

Definition

Static characteristics specified in Table 4 at +25°C

Static characteristics specified in Table 4 at +125°C

Static characteristics specified in Table 4 at -55°C

Functional characteristics specified in Table 7 at +25°C

Functional characteristics specified in Table 7 at +125°C

Functional characteristics specified in Table 7 at -55°C

Switching characteristics specified in Table 5 at +25°C

Switching characteristics specified in Table 5 at +125°C

Switching characteristics specified in Table 5 at -55°C

Table 8: Definition of Subgroups

6/11

MA1916

TIMING DIAGRAMS

Note: Bytes of MSG labelled 0 to 222 x I

Bytes of RSE_OUT labelled 0 to 254 x I

Bits labelled 0 to 7

I = Interleave depth of 1, 4 or 5

* User can capture RSE_OUT on rising edge of CLKS

Figure 6: RS Encoder Timings

See Note 2

Notes: 1. If CE_CLK is driven by CLKS, the user can capture CE_OUT on the falling edge of CLK_OUT.

2. Arrows show which O/P bits correspond to which I/P bit.

Figure 7: Convolution Encoder Timings

7/11

MA1916

OUTLINES AND PIN ASSIGNMENTS

Millimetres

Ref

Inches

Min.

Nom.

Max.

5.715

1.53

0.59

0.36

36.02

Min.

Nom.

Max.

0.225

0.060

0.023

0.014

1.418

0.38

0.015

0.35

0.014

0.20

0.008

2.54 Typ.

0.100 Typ.

15.24 Typ.

0.600 Typ.

4.71

5.38

15.90

1.27

1.53

0.185

0.212

0.626

0.050

0.060

XG404

M_E

Seating Plane

A₁

e₁

15°

Figure 8: 28-Lead Ceramic DIL (Solder Seal) - Package Style C

8/11

MA1916

Millimetres

Inches

Ref

Min.

Nom.

Max.

3.18

Min.

Nom.

Max.

0.125

0.66

0.38

0.10

18.08

0.026

0.015

0.004

0.712

0.48

0.18

18.49

0.019

0.007

0.728

1.27

0.050

7.62

12.50

9.91

12.09

0.300

0.492

0.390

0.508

XG530

M_E

Pin 1

Figure 9: 28-Lead Ceramic Flatpack (Solder Seal) - Package Style F

9/11

MA1916

MSG_OUT

CLK_OUT

SMC

CE_CLKS

CE_IN

CE_OUT

TEST_POINT

N/C

RSE_OUT

SYZ

Bottom

View

CLKS

VDD

ST1

N/C

GND

10 SEL_A

11 STZ

MSG

CLK

12 SEL_B

13 SZY

READY

SMC_OUT

14 n_RST

Figure 10: Flatpack Pinout

RADIATION TOLERANCE

Total Dose (Function to specification)*

Transient Upset (Stored data loss)

Transient Upset (Survivability)

Neutron Hardness (Function to specification)

Single Event Upset**

1x10⁵Rad(Si)

5x10¹⁰Rad(Si)/sec

>1x10¹²Rad(Si)/sec

>1x10¹⁵n/cm²

Total Dose Radiation Testing

For product procured to guaranteed total dose radiation

levels, each wafer lot will be approved when all sample

devices from each lot pass the total dose radiation test.

The sample devices will be subjected to the total dose

radiation level (Cobalt-60 Source), defined by the ordering

code, and must continue to meet the electrical parameters

specified in the data sheet. Electrical tests, pre and post

irradiation, will be read and recorded.

<1x10^-10Errors/bit day

Not possible

Latch Up

* Other total dose radiation levels available on request

** Worst case galactic cosmic ray upset - interplanetary/high altitude orbit

Dynex Semiconductor can provide radiation testing

compliant with Mil-Std-883 test method 1019, Ionizing

Radiation (Total Dose).

Table 9: Radiation Hardness Parameters

10/11

MA1916

ORDERING INFORMATION

Unique Circuit Designator

MAx1916xxxxx

Radiation Tolerance

Radiation Hard Processing

100 kRads (Si) Guaranteed

300 kRads (Si) Guaranteed

1000 kRads (Si) Guaranteed

QA/QCI Process

(See Section 9 Part 4)

Test Process

(See Section 9 Part 3)

Package Type

Ceramic DIL (Solder Seal)

Flatpack (Solder Seal)

Leadless Chip Carrier

Assembly Process

(See Section 9 Part 2)

Reliability Level

Rel 0

Rel 1

Rel 2

Rel 3/4/5/STACK

Class B

Class S

For details of reliability, QA/QC, test and assembly

options, see ‘Manufacturing Capability and Quality

Assurance Standards’ Section 9.

http://www.dynexsemi.com

e-mail: power_solutions@dynexsemi.com

HEADQUARTERS OPERATIONS

DYNEX SEMICONDUCTOR LTD

Doddington Road, Lincoln.

Lincolnshire. LN6 3LF. United Kingdom.

Tel: 00-44-(0)1522-500500

CUSTOMER SERVICE CENTRES

France, Benelux, Italy and Spain Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 64 46 54 50

North America Tel: 011-800-5554-5554. Fax: 011-800-5444-5444

UK, Germany, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020

SALES OFFICES

Fax: 00-44-(0)1522-500550

France, Benelux, Italy and Spain Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 64 46 54 50

Germany Tel: 07351 827723

DYNEX POWER INC.

Unit 7 - 58 Antares Drive,

Nepean, Ontario, Canada K2E 7W6.

Tel: 613.723.7035

Fax: 613.723.1518

Toll Free: 1.888.33.DYNEX (39639)

North America Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) /

Tel: (831) 440-1988. Fax: (831) 440-1989 / Tel: (949) 733-3005. Fax: (949) 733-2986.

UK, Germany, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020

These offices are supported by Representatives and Distributors in many countries world-wide.

TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRINTED IN UNITED KINGDOM

Datasheet Annotations:

Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:-

Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started.

Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change.

Advance Information: The product design is complete and final characterisation for volume production is well in hand.

No Annotation: The product parameters are fixed and the product is available to datasheet specification.

This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded

as a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company

reserves the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any

guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and

to ensure that any publication or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury

or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request.

All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners.

11/11

MAS1916CC [DYNEX]

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