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MP02GN130-25 [DYNEX]

Rectifier Diode, 1 Phase, 2 Element, 130A, 2500V V(RRM), Silicon, MP02, 3 PIN;
MP02GN130-25
型号： MP02GN130-25
厂家： Dynex Semiconductor    Dynex Semiconductor
描述：

Rectifier Diode, 1 Phase, 2 Element, 130A, 2500V V(RRM), Silicon, MP02, 3 PIN
文件： 总9页 (文件大小：87K)
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MP02 XX 130 Series  
Dual Diode Modules  
Replaces December 1998 version, DS5100-3.0  
DS5100- January 2000  
FEATURES  
KEY PARAMETERS  
VRRM  
IFSM  
IF(AV)(per arm)  
Visol  
2500V  
2200A  
130A  
■ Dual Device Module  
■ Electrically Isolated Package  
■ Pressure Contact Construction  
■ International Standard Footprint  
■ Alumina (non-toxic) Isolation Medium  
2500V  
CIRCUIT OPTIONS  
Code  
Circuit  
HB  
APPLICATIONS  
■ Rectifier Bridges  
■ DC Power Supplies  
■ Plating Rectifiers  
■ Traction Systems  
G
GN  
VOLTAGE RATINGS  
PACKAGE OUTLINE  
Type  
Number  
Repetitive  
Peak  
Conditions  
Voltages  
VRRM  
MP02/130 - 25  
MP02/130 - 22  
MP02/130 - 20  
MP02/130 - 18  
2500  
2200  
2000  
1800  
Tvj = 150oC  
IRM = 30mA  
VRSM = VRRM + 100V  
Lower voltage grades available. For full description of  
part number see "Ordering Instructions" on page 3.  
Module outline type code: MP02.  
See Package Details for further information  
CURRENT RATINGS - PER ARM  
Parameter  
Symbol  
Conditions  
Max.  
130  
Units  
Tcase = 75oC  
Tcase = 85oC  
Theatsink = 75oC  
Theatsink = 85oC  
A
116  
A
A
IF(AV)  
Halfwave, resistive load  
Tcase = 75oC  
Mean forward current  
114  
101  
204  
A
A
IF(RMS)  
RMS value  
1/9  
MP02 XX 130 Series  
SURGE RATINGS - PER ARM  
Parameter  
Units  
Symbol  
Conditions  
Max.  
2200  
A
VR = 0  
10ms half sine;  
IFSM  
Surge (non-repetitive) on-state current  
I2t for fusing  
Tj = 150oC  
VR = 50% VRRM  
VR = 0  
1760  
A
24200  
A2s  
10ms half sine;  
Tj = 150oC  
I2t  
VR = 50% VRRM  
15490  
A2s  
THERMAL & MECHANICAL RATINGS  
Parameter  
Max.  
0.37  
0.38  
0.39  
Symbol  
Conditions  
Units  
oC/W  
dc  
Thermal resistance - junction to case  
per Diode  
Rth(j-c)  
halfwave  
oC/W  
oC/W  
3 phase  
Mounting torque = 6Nm  
with mounting compound  
Thermal resistance - case to heatsink  
per Diode  
oC/W  
Rth(c-hs)  
0.07  
Tvj  
150  
oC  
oC  
Virtual junction temperature  
Storage temperature range  
Tsto  
-40 to 150  
Commoned terminals to base plate  
AC RMS, 1min, 50Hz  
2.5  
kV  
Visol  
Isolation voltage  
CHARACTERISTICS  
Symbol  
Parameter  
Conditions  
Max.  
Units  
At 300A , Tcase = 25oC  
1.53  
V
VFM  
IRM  
VTO  
rT  
Forward voltage  
Peak reverse current  
At VRRM, Tj = 150oC  
At Tvj = 150oC  
mA  
V
30  
Threshold voltage  
1.10  
1.30  
On-state slope resistance  
At Tvj = 150oC  
mΩ  
2/9  
MP02 XX 130 Series  
ORDERING INSTRUCTIONS  
Part number is made up as follows:  
MP02 HB 130 - 22  
MP = Pressure contact module  
02  
= Outline type  
HB = Circuit configuration code (see "circuit options" - front page)  
130 = Nominal average current rating at Tcase = 75oC  
22  
Examples:  
MP02HB130 - 20  
= VRRM/100  
MP02G130 - 25  
MP02GN130 - 18  
Note: Prefered type is HB configuration. G and GN types are available for specific applications, only when  
requested.  
MOUNTING RECOMMENDATIONS  
Adequate heatsinking is required to maintain the base  
temperature at 75oC if full rated current is to be achieved.  
Power dissipation may be calculated by use of VTO and rT  
information in accordance with standard formulae. We can  
provide assistance with calculations or choice of heatsink  
if required.  
An even coating of thermal compound (eg. Unial) should be  
appliedtoboth theheatsinkandmodulemountingsurfaces.  
This should ideally be 0.05mm (0.002") per surface to  
ensure optimum thermal performance.  
After application of thermal compound, place the module  
squarely over the mounting holes, (or 'T' slots) in the  
heatsink. Using a torque wrench, slowly tighten the  
recommended fixing bolts at each end, rotating each in turn  
no more than 1/4 of a revolution at a time. Continue until the  
required torque of 6Nm (55lb.ins) is reached at both ends.  
The heatsink surface must be smooth and flat; a surface  
finish of N6 (32µin) and a flatness within 0.05mm (0.002")  
are recommended.  
Immediately prior to mounting, the heatsink surface should  
be lightly scrubbed with fine emery, Scotch Brite or a mild  
chemicaletchantandthencleanedwithasolventtoremove  
oxide build up and foreign material. Care should be taken  
to ensure no foreign particles remain.  
It is not acceptable to fully tighten one fixing bolt before  
starting to tighten the other. Such action may DAMAGE the  
module.  
3/9  
MP02 XX 130 Series  
CURVES  
1000  
800  
600  
400  
200  
0
Tj = 150˚C  
0
1.0  
2.0  
3.0  
4.0  
Instantaneous forward voltage VF - (V)  
Fig. 1 Maximum (limit) forward characteristics (Per diode)  
0.4  
0.3  
0.2  
0.1  
d.c.  
0
0.001  
0.01  
0.1  
1.0  
10  
100  
Time - (s)  
Fig. 2 Transient thermal impedance (DC) - (Per diode)  
4/9  
MP02 XX 130 Series  
6000  
5000  
4000  
3000  
2000  
1000  
0
24  
22  
20  
18  
16  
14  
12  
10  
I2t  
1
10  
1
2 3  
cycles at 50Hz  
Duration  
5
10 20 30 50  
ms  
Fig. 3 Surge (non-repetitive) forward current vs time (with 0% VRRM, Tcase = 150˚C)  
5/9  
MP02 XX 130 Series  
400  
350  
300  
250  
200  
150  
100  
50  
d.c.  
180˚ Rectangular  
180˚ sine  
120˚ Rectangular  
60˚ Rectangular  
0
0
50  
100  
150  
200  
250  
300  
Mean forward current - (A)  
Fig. 4 On-state power loss per arm vs forward current at various conduction angles, 50/60Hz  
140  
120  
100  
80  
60  
40  
20  
0
0
50  
100  
150  
200  
250  
300  
Mean forward current - (A)  
Fig. 5 Maximum permissible case temperature vs forward current per arm at various conduction angles, 50/60Hz  
6/9  
MP02 XX 130 Series  
800  
700  
600  
500  
0.08  
0.12  
0.04 0.02 Rth(hs-a) ˚C/W  
R - Load  
L - Load  
0.10  
0.15  
400 0.20  
300  
200  
100  
0
0.30  
0.40  
20  
Maximum ambient temperature - (˚C)  
0
40  
60  
80 100 120  
0
200  
D.C. output current - (A)  
300  
100  
Fig. 6 50/60Hz single phase bridge dc output current vs power loss and maximum permissible ambient temperature for  
various values of heatsink thermal resistance.  
(Note: Rth(hs-a) values given above are true heatsink thermal resistances to ambient and already account for Rth(c-hs) module contact thermal).  
1400  
0.04 0.02 Rth(hs-a) ˚C/W  
R & L- Load  
1200  
1000  
800  
600  
400  
200  
0
0.08  
0.10  
0.12  
0.15  
0.20  
0.30  
0.40  
20  
0
40  
60  
80 100 120 140  
0
100  
300  
400  
200  
Maximum ambient temperature - (˚C)  
D.C. output current - (A)  
Fig. 7 50/60Hz 3- phase bridge dc output current vs power loss and maximum permissible ambient temperature for various  
values of heatsink thermal resistance.  
(Note: Rth(hs-a) values given above are true heatsink thermal resistances to ambient and already account for Rth(c-hs) module contact thermal).  
7/9  
MP02 XX 130 Series  
PACKAGE DETAILS  
For further package information, please contact your local Customer Service Centre. All dimensions in mm, unless stated otherwise.  
DO NOT SCALE.  
23  
23  
24  
Ø6.5  
13  
80  
2x M6  
1
2
3
94  
Nominal weight: 350g  
Recommended fixings for mounting: M6 socket head cap screws  
Recommended mounting torque: 6Nm (55lb.ins)  
Recommended torque for electrical connections: 5Nm (44lb.ins)  
Maximum torque for electrical connections: 8Nm (70lb.ins)  
Module outline type code: MP02  
CIRCUIT CONFIGURATIONS  
1
1
2
3
3
HB  
2
G
1
2
3
GN  
8/9  
MP02 XX 130 Series  
http://www.dynexsemi.com  
e-mail: power_solutions@dynexsemi.com  
HEADQUARTERS OPERATIONS  
CUSTOMER SERVICE CENTRES  
France, Benelux, Italy and Spain Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 64 46 54 50  
North America Tel: 011-800-5554-5554. Fax: 011-800-5444-5444  
DYNEX SEMICONDUCTOR LTD  
Doddington Road, Lincoln.  
UK, Germany, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020  
Lincolnshire. LN6 3LF. United Kingdom.  
Tel: 00-44-(0)1522-500500  
SALES OFFICES  
Fax: 00-44-(0)1522-500550  
France, Benelux, Italy and Spain Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 64 46 54 50  
Germany Tel: 07351 827723  
DYNEX POWER INC.  
Unit 7 - 58 Antares Drive,  
Nepean, Ontario, Canada K2E 7W6.  
Tel: 613.723.7035  
Fax: 613.723.1518  
Toll Free: 1.888.33.DYNEX (39639)  
North America Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) /  
Tel: (831) 440-1988. Fax: (831) 440-1989 / Tel: (949) 733-3005. Fax: (949) 733-2986.  
UK, Germany, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020  
These offices are supported by Representatives and Distributors in many countries world-wide.  
© Dynex Semiconductor 2000 Publication No. DS5100-4 Issue No. 4.0 January 2000  
TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRINTED IN UNITED KINGDOM  
Datasheet Annotations:  
Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:-  
Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started.  
Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change.  
Advance Information: The product design is complete and final characterisation for volume production is well in hand.  
No Annotation: The product parameters are fixed and the product is available to datasheet specification.  
This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as  
a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves  
the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such  
methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication  
or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury  
or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request.  
All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners.  
9/9  

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