MP02HB260-10 [DYNEX]
Rectifier Diode, 1 Phase, 2 Element, 267A, 1000V V(RRM), Silicon, MP02, 3 PIN;
| 型号： | MP02HB260-10 |
| 厂家： | 
Dynex Semiconductor |
| 描述： | Rectifier Diode, 1 Phase, 2 Element, 267A, 1000V V(RRM), Silicon, MP02, 3 PIN 局域网 二极管 |
| 文件： | 总9页 (文件大小：90K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MP02 XX 260 Series
Dual Diode Modules
Replaces December 1998 version, DS5102-3.0
DS5102-4.0 January 2000
FEATURES
KEY PARAMETERS
VRRM
IFSM
IF(AV) (per arm)
Visol
1600V
8100A
267A
■ Dual Device Module
■ Electrically Isolated Package
■ Pressure Contact Construction
■ International Standard Footprint
■ Alumina (non-toxic) Isolation Medium
2500V
CIRCUIT OPTIONS
Code
Circuit
APPLICATIONS
HB
■ Rectifier Bridges
■ DC Power Bridges
■ Plating Rectifiers
■ Traction Systems
G
GN
VOLTAGE RATINGS
Conditions
Type
Number
Repetitive
Peak
PACKAGE OUTLINE
Voltages
VRRM
MP02/260-16
MP02/260-14
MP02/260-12
MP02/260-10
1600
1400
1200
1000
Tvj = 150oC
IRM = 30mA
1
2
3
VRSM = VRRM + 100V
Lower voltage grades available. For full description of part
numbers see "Ordering instructions" on page 3.
Module outline type code: MP02.
See Package Details for further information.
CURRENT RATINGS - PER ARM
Max.
267
240
216
Parameter
Conditions
Units
Symbol
Tcase = 75oC
case = 85oC
A
T
A
A
IF(AV)
Mean forward current
Halfwave, resistive load
Tcase = 75oC
Theatsink = 75oC
Theatsink = 85oC
192
420
A
A
IF(RMS)
RMS value
1/9
MP02 XX 260 Series
SURGE RATINGS - PER ARM
Symbol
Parameter
Units
A
Conditions
Max.
VR = 0
8100
10ms half sine;
IFSM
Surge (non-repetitive) forward current
I2t for fusing
Tj = 150˚C
A
VR = 50% VRRM
VR = 0
6500
A2s
328000
10ms half sine;
Tj = 150˚C
I2t
VR = 50% VRRM
A2s
211000
THERMAL & MECHANICAL RATINGS
Parameter
Max.
0.21
0.22
0.23
Symbol
Conditions
Units
oC/W
dc
Thermal resistance - junction to case
per Diode
Rth(j-c)
halfwave
3 phase
oC/W
oC/W
Thermal resistance - case to heatsink
per Diode
Mounting torque = 6Nm
with mounting compound
oC/W
oC
Rth(c-hs)
0.07
150
Tvj
Virtual junction temperature
Storage temperature range
-40 to 150 oC
Tsto
Commoned terminals to base plate
AC RMS, 1min, 50Hz
Isolation voltage
2.5
Visol
kV
CHARACTERISTICS
Symbol
Max.
1.3
Parameter
Conditions
Units
At 600A, Tcase = 25oC
V
VFM
IRM
VTO
rT
Forward voltage
Peak reverse current
At VRRM, Tj = 150oC
At Tvj = 150oC
mA
V
30
Threshold voltage
0.84
0.667
On-state slope resistance
At Tvj = 150oC
mΩ
2/9
MP02 XX 260 Series
ORDERING INSTRUCTIONS
Part number is made up as follows:
MP02 HB 260 - 12
MP = Pressure contact module
02
= Outline type
HB = Circuit configuration code (see "circuit options" - front page)
260 = Nominal average current rating at Tcase = 75oC
12
Examples:
MP02 HB260-12
= VRRM/100
MP02 G260-16
MP02 GN260-10
Note: Prefered type is HB configuration. G & GN types are available for specific applications, only when requested.
MOUNTING RECOMMENDATIONS
Adequate heatsinking is required to maintain the base An even coating of thermal compound (eg. Unial) should be
temperature at 75oC if full rated current is to be achieved. appliedtoboth theheatsinkandmodulemountingsurfaces.
Power dissipation may be calculated by use of VTO and rT This should ideally be 0.05mm (0.002") per surface to
informationinaccordancewithstandardformulae.Wecan ensure optimum thermal performance.
provide assistance with calculations or choice of heatsink
if required.
After application of thermal compound, place the module
squarely over the mounting holes, (or 'T' slots) in the
The heatsink surface must be smooth and flat; a surface heatsink. Using a torque wrench, slowly tighten the
finish of N6 (32µin) and a flatness within 0.05mm (0.002") recommended fixing bolts at each end, rotating each in turn
are recommended.
no more than 1/4 of a revolution at a time. Continue until the
required torque of 6Nm (55lb.ins) is reached at both ends.
Immediatelypriortomounting,theheatsinksurfaceshould
be lightly scrubbed with fine emery, Scotch Brite or a mild It is not acceptable to fully tighten one fixing bolt before
chemical etchant and then cleaned with a solvent to startingtotightentheothers.SuchactionmayDAMAGEthe
remove oxide build up and foreign material. Care should module.
be taken to ensure no foreign particles remain.
3/9
MP02 XX 260 Series
CURVES
2500
2000
1500
1000
500
Tj = 150˚C
0
0.5
1.0
1.5
2.0
Instantaneous forward voltage IF - (V)
Fig. 1 Maximum (limit) forward characteristics (Per diode)
0.3
0.2
0.1
Rth(j-hs)
Rth(j-c)
0
0.001
0.010
0.100
1.0
10
100
Time - (s)
Fig. 2 Transient thermal impedance (DC) - (Per diode)
4/9
MP02 XX 260 Series
15000
12500
10000
7500
5000
2500
0
22
20
18
16
14
12
10
I2t
1
10
1
2 3
cycles at 50Hz
Duration
Fig. 3 Surge (non-repetitive) forward current vs time (with 0% VRRM, Tcase = 150˚C)
5
10 20 30 50
ms
5/9
MP02 XX 260 Series
450
400
350
300
250
200
150
100
50
180˚ Rectangular
180˚ Sine
120˚ Rectangular
d.c.
60˚ Rectangular
0
0
50
100
150
200
250
300
Mean forward current - (A)
Fig. 4 On-state power loss per arm vs forward current at various conduction angles, 50/60Hz
160
140
120
100
d.c.
80
60
40
20
0
325
0
25
50
75 100 125 150 175 200 225 250 275 300
Forward current - (A)
Fig. 5 Maximum permissible case temperature vs forward current per arm at various conduction angles, 50/60Hz
6/9
MP02 XX 260 Series
1400
1200
1000
800
600
400
200
0
Rth(hs-a) ˚C/W
0.02
R- Load
L- Load
0.04
0.08
0.10
0.12
0.15
0.20
0.30
0.40
0
20
40
60
80 100 120 140
0
200
400
600
D.C. output current - (A)
Maximum ambient temperature - (˚C)
Fig. 6 50/60Hz single phase bridge dc output current vs power loss and maximum permissible ambient temperature for
various values of heatsink thermal resistance.
(Note: Rth(hs-a) values given above are true heatsink thermal resistances to ambient and already account for Rth(c-hs) module contact thermal).
1400
1200
Rth(hs-a) ˚C/W
R & L - Load
0.02
0.04
1000
800
600
400
200
0
0.08
0.10
0.12
0.15
0.20
0.30
0.40
0
20
40
60
80 100 120 140 160
Maximum ambient temperature - (˚C)
0
200
400 500
D.C. output current - (A)
Fig. 7 50/60Hz 3- phase bridge dc output current vs power loss and maximum permissible ambient temperature for various
values of heatsink thermal resistance.
(Note: Rth(hs-a) values given above are true heatsink thermal resistances to ambient and already account for Rth(c-hs) module contact thermal).
7/9
MP02 XX 260 Series
PACKAGE DETAILS
For further package information, please contact your local Customer Service Centre. All dimensions in mm, unless stated otherwise.
DO NOT SCALE.
23
23
24
Ø6.5
13
80
2x M6
1
2
3
94
Nominal weight: 350g
Recommended fixings for mounting: M6 socket head cap screws
Recommended mounting torque: 6Nm (55lb.ins)
Recommended torque for electrical connections: 5Nm (44lb.ins)
Maximum torque for electrical connections: 8Nm (70lb.ins)
Module outline type code: MP02
CIRCUIT CONFIGURATIONS
1
1
2
3
3
HB
2
G
1
2
3
GN
8/9
MP02 XX 260 Series
http://www.dynexsemi.com
e-mail: power_solutions@dynexsemi.com
HEADQUARTERS OPERATIONS
CUSTOMER SERVICE CENTRES
France, Benelux, Italy and Spain Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 64 46 54 50
North America Tel: 011-800-5554-5554. Fax: 011-800-5444-5444
DYNEX SEMICONDUCTOR LTD
Doddington Road, Lincoln.
UK, Germany, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020
Lincolnshire. LN6 3LF. United Kingdom.
Tel: 00-44-(0)1522-500500
SALES OFFICES
Fax: 00-44-(0)1522-500550
France, Benelux, Italy and Spain Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 64 46 54 50
Germany Tel: 07351 827723
DYNEX POWER INC.
Unit 7 - 58 Antares Drive,
Nepean, Ontario, Canada K2E 7W6.
Tel: 613.723.7035
Fax: 613.723.1518
Toll Free: 1.888.33.DYNEX (39639)
North America Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) /
Tel: (831) 440-1988. Fax: (831) 440-1989 / Tel: (949) 733-3005. Fax: (949) 733-2986.
UK, Germany, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020
These offices are supported by Representatives and Distributors in many countries world-wide.
© Dynex Semiconductor 2000 Publication No. DS5102-4 Issue No. 4.0 January 2000
TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRINTED IN UNITED KINGDOM
Datasheet Annotations:
Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:-
Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started.
Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change.
Advance Information: The product design is complete and final characterisation for volume production is well in hand.
No Annotation: The product parameters are fixed and the product is available to datasheet specification.
This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as
a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves
the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such
methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication
or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury
or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request.
All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners.
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