MP02TT800-13 [DYNEX]
Dual Thyristor Water Cooled Welding Module Preliminary Information; 双晶闸管水冷焊接模块初步信息型号: | MP02TT800-13 |
厂家: | Dynex Semiconductor |
描述: | Dual Thyristor Water Cooled Welding Module Preliminary Information |
文件: | 总8页 (文件大小:124K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
MP02TT800
Dual Thyristor Water Cooled Welding Module
Preliminary Information
DS5435-1.1 June 2001
FEATURES
KEY PARAMETERS
VDRM
1600V
510A
805A
6800A
3000V
■ Dual Device Module
ILINE(cont.)
ILINE(20cy./50%)
ITSM(per arm)
Visol
■ Electrically Isolated Package
■ Pressure Contact Construction
■ International Standard Footprint
■ Alumina (Non Toxic) Isolation Medium
■ Integral Water Cooled Heatsink
G1 K1 K2 G2
2
3
1
APPLICATIONS
■ Welding
Fig. 1 Circuit diagram
VOLTAGE RATINGS
Type Number
Repetitive Peak
Voltages
VDRM VRRM
V
Conditions
K2
G2
MP02TT800-16
MP02TT800-15
MP02TT800-14
MP02TT800-13
1600
1500
1400
1300
Tvj = 0˚ to 125˚C,
IDRM = IRRM = 30mA
K1 G1
2
3
1
VDSM = VRSM
=
VDRM = VRRM + 100V
respectively
Lower voltage grades available
ORDERING INFORMATION
Order As:
MP02TT800-XX W12
MP02TT800-XX W13
1/4 - 18NPT
1/4 BSP connection
Outline type code: MP02 W12/W13
XX shown in the part number about represents VDRM/100
selection required, e.g. MP02TT800-14-W12
(See package details for further information)
Fig. 2 Electrical connections - (not to scale)
Note: When ordering, please use the whole part number.
Auxiliary gate and cathode leads can be ordered separately.
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MP02TT800
ABSOLUTE MAXIMUM CURRENT RATINGS
Stresses above those listed under 'Absolute Maximum Ratings' may cause permanent damage to the device. In extreme
conditions, as with all semiconductors, this may include potentially hazardous rupture of the package. Appropriate safety
precautions should always be followed. Exposure to Absolute Maximum Ratings may affect device reliability.
Symbol
Parameter
Max. controllable RMS line
current - single phase
Test Conditions
Max.
510
450
920
805
6.8
Units
A
ILINE
Continuous 50/60Hz
4.5 Ltr/min
Twater (in) = 25˚C
water (in) = 40˚C
T
A
20 cycles, 50% duty cycle
4.5 Ltr/min
Twater (in) = 25˚C
Twater (in) = 40˚C
A
A
ITSM
I2t
ITSM
I2t
Surge (non-repetitive) on-current
I2t for fusing
10ms half sine, Tj = 125˚C
kA
VR = 0
0.231 x 106 A2s
5.5 kA
0.15 x 106 A2s
Surge (non-repetitive) on-current
I2t for fusing
10ms half sine, Tj = 125˚C
VR = 50% VDRM
Visol
Isolation voltage
Commoned terminals to base plate.
AC RMS, 1 min, 50Hz
3000
V
THERMAL AND MECHANICAL RATINGS
Min.
Symbol
Parameter
Thermal resistance - junction to water
(per thyristor)
Test Conditions
dc, 4.5 Ltr/min
Max.
0.3
Units
˚C/kW
˚C/kW
˚C/kW
˚C
-
Rth(j-c)
-
Half wave, 4.5 Ltr/min
3 Phase, 4.5 Ltr/min
Reverse (blocking)
-
0.32
0.33
125
125
-
-
-
Tvj
Tstg
-
Virtual junction temperature
Storage temperature range
Screw torque
–40
˚C
5 (44)
Mounting - M6
Electrical connections - M6
-
Nm (lb.ins)
-
-
5 (44) Nm (lb.ins)
-
Weight (nominal)
1200
g
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MP02TT800
DYNAMIC CHARACTERISTICS
Min.
Symbol
IRRM/IDRM
dV/dt
Parameter
Test Conditions
At VRRM/VDRM, Tj = 125˚C
Max. Units
Peak reverse and off-state current
Linear rate of rise of off-state voltage
Rate of rise of on-state current
-
-
-
30
mA
To 67% VDRM, Tj = 125˚C
From 67% VDRM to 200A, gate source 10V, 5Ω
tr = 0.5µs, Tj = 125˚C
1000
500
V/µs
A/µs
dI/dt
-
-
0.98
0.75
V
VT(TO)
rT
Threshold voltage
At Tvj = 125˚C
On-state slope resistance
At Tvj = 125˚C
mΩ
Note 1: The data given in this datasheet with regard to forward voltage drop is for calculation of the power dissipation in the
semiconductor elements only. Forward voltage drops measured at the power terminals of the module will be in excess of these
figures due to the impedance of the busbar from the terminal to the semiconductor.
GATE TRIGGER CHARACTERISTICS AND RATINGS
Parameter
Gate trigger voltage
Test Conditions
VDRM = 5V, Tcase = 25oC
DRM = 5V, Tcase = 25oC
Max.
3
Units
V
Symbol
VGT
IGT
Gate trigger current
V
150
0.25
30
mA
V
VGD
Gate non-trigger voltage
Peak forward gate voltage
Peak forward gate voltage
Peak reverse gate voltage
Peak forward gate current
Peak gate power
At VDRM Tcase = 125oC
Anode positive with respect to cathode
V
VFGM
VFGN
VRGM
IFGM
Anode negative with respect to cathode
0.25
5
V
-
V
Anode positive with respect to cathode
10
A
See table fig. 5
100
5
W
W
PGM
PG(AV)
Mean gate power
-
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MP02TT800
2000
20
Measured under pulse conditions
1500
1000
500
0
180
140
100
15
10
I2t
Tj = 125˚C
5
0
60
10
1
2
3 4 5
50
20 30
10
1
0.5
1.0
1.5
2.0
2.5
Instantaneous on-state voltage, VT - (V)
ms
cycles at 50Hz
Duration
Fig. 3 Maximum (limit) on-state characteristics
Fig. 4 Surge (non-repetitive) on-state current vs time
(with 50% VRSM at Tcase = 125˚C)
100
VFGM
10
1.0
Table gives pulse power PGM in watts
Pulse Pulse Frequency
Width
µs
Hz
100 400
50
100W
75W
50W
20
25
100
500
1ms
10ms
100 100
100 100
100 100
100
100
100
100
100
10
10W
5W
100
50
-
25
-
-
0.1
Tj = 25˚C
Tj = 125˚C
1.0
0.01
mit 1%
Upper limit 99%
VGD
0.1
Lower li
0.001
0.001
0.001
0.01
0.1
1.0
10
IFGM
0.01
0.1
1
10
1000
100
Gate trigger current, IGT - (A)
Time - (s)
Fig. 5 Gate characteristics
Fig. 6 Transient thermal impedance - dc
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MP02TT800
3000
3000
Twater = 30˚C
Twater = 25˚C
Number of cycles
Number of cycles
1
3
5
10
20
30
50
100
1
3
5
10
20
30
50
100
2500
2000
1500
2500
2000
1500
1000
500
1
1000
500
1
1
10
100
1
10
100
Duty cycles - (%)
Duty cycles - (%)
Fig. 7 Single phase welding rating @Twater = 25˚C
Fig. 8 Single phase welding rating @Twater = 30˚C
3000
3000
Twater = 40˚C
Twater = 50˚C
Number of cycles
Number of cycles
1
3
5
10
20
30
50
100
1
3
5
10
20
30
50
100
2500
2000
1500
2500
2000
1500
1000
500
1
1000
500
1
1
10
100
1
10
100
Duty cycles - (%)
Duty cycles - (%)
Fig. 9 Single phase welding rating @Twater = 40˚C
Fig. 10 Single phase welding rating @Twater = 50˚C
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MP02TT800
PACKAGE DETAILS
Forfurtherpackageinformation, please visitourwebsiteorcontactyournearestCustomerServiceCentre. Alldimensionsinmm, unless
stated otherwise. DO NOT SCALE.
23
23
K2
24
15
5
G2
Ø6.5
13
80
K1
G1
2 Off water connectors
1/4 - 18 NTP (W12)
2
3
1
M6
2.8 X 0.8
23.8
21.6
50.8
94
Water-way plug
2 Off Holes M3 x 0.5
10 deep
Recommended fixings for mounting: M6 socket head cap screws.
Auxiliary gate and cathode leads can be ordered separately.
Nominal weight: 1200g
Module outline type code: MP02-W12
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MP02TT800
PACKAGE DETAILS
Forfurtherpackageinformation, please visitourwebsiteorcontactyournearestCustomerServiceCentre. Alldimensionsinmm, unless
stated otherwise. DO NOT SCALE.
23
23
K2
24
15
5
G2
fl6.5
13
80
K1
G1
2 Off water connectors
1/4 BSP (W13)
2
3
1
M6
2.8 X 0.8
23.8
21.6
50.8
94
Water-way plug
2 Off Holes M3 x 0.5
10 deep
Recommended fixings for mounting: M6 socket head cap screws.
Auxiliary gate and cathode leads can be ordered separately.
Nominal weight: 1200g
Module outline type code: MP02-W13
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MP02TT800
POWER ASSEMBLY CAPABILITY
The Power Assembly group provides support for those customers requiring more than the basic semiconductor switch. Using CAD
design tools the group has developed a flexible range of heatsink / clamping systems in line with advances in device types and the
voltage and current capability of Dynex semiconductors.
An extensive range of air and liquid cooled assemblies is available covering the range of circuit designs in general use today.
HEATSINKS
The Power Assembly group has a proprietary range of extruded aluminium heatsinks. These were designed to optimise the
performance of Dynex semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on
request.
For further information on device clamps, heatsinks and assemblies, please contact your nearest sales representative or customer
service office.
http://www.dynexsemi.com
e-mail: power_solutions@dynexsemi.com
HEADQUARTERS OPERATIONS
DYNEX SEMICONDUCTOR LTD
Doddington Road, Lincoln.
Lincolnshire. LN6 3LF. United Kingdom.
Tel: 00-44-(0)1522-500500
CUSTOMER SERVICE CENTRES
Mainland Europe Tel: +33 (0)1 58 04 91 00. Fax: +33 (0)1 46 38 51 33
North America Tel: (613) 723-7035. Fax: (613) 723-1518.
UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020
SALES OFFICES
Fax: 00-44-(0)1522-500550
Mainland Europe Tel: +33 (0)1 58 04 91 00. Fax: +33 (0)1 46 38 51 33
North America Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) /
Tel: (949) 733-3005. Fax: (949) 733-2986.
DYNEX POWER INC.
99 Bank Street, Suite 410,
Ottawa, Ontario, Canada, K1P 6B9
Tel: 613.723.7035
UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020
Fax: 613.723.1518
Toll Free: 1.888.33.DYNEX (39639)
These offices are supported by Representatives and Distributors in many countries world-wide.
© Dynex Semiconductor 2001 Publication No. DS5435-1 Issue No. 1.2 June 2001
TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRINTED IN UNITED KINGDOM
Datasheet Annotations:
Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:-
Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started.
Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change.
Advance Information: The product design is complete and final characterisation for volume production is well in hand.
No Annotation: The product parameters are fixed and the product is available to datasheet specification.
This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as
a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves
the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such
methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication
or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury
or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request.
All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners.
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