MP03G260-14 [DYNEX]

Rectifier Diode, 1 Phase, 2 Element, 267A, 1400V V(RRM), Silicon, MP03, 3 PIN;
MP03G260-14
型号: MP03G260-14
厂家: Dynex Semiconductor    Dynex Semiconductor
描述:

Rectifier Diode, 1 Phase, 2 Element, 267A, 1400V V(RRM), Silicon, MP03, 3 PIN

二极管
文件: 总9页 (文件大小:94K)
中文:  中文翻译
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MP03 XX 260 Series  
Dual Diode Modules  
Replaces December 1998 version, DS5104-2.0  
DS5104-3.0 January 2000  
FEATURES  
KEY PARAMETERS  
VRRM  
IFSM  
IF(AV) (per arm)  
Visol  
1600V  
8100A  
267A  
Dual Device Module  
Electrically Isolated Package  
Pressure Contact Construction  
International Standard Footprint  
Alumina (non-toxic) Isolation Medium  
2500V  
CIRCUIT OPTIONS  
Code  
Circuit  
APPLICATIONS  
HB  
Rectifier Bridges  
DC Power Bridges  
Plating Rectifiers  
Traction Systems  
G
GN  
VOLTAGE RATINGS  
Conditions  
Type  
Number  
Repetitive  
Peak  
PACKAGE OUTLINE  
Voltages  
VRRM  
MP03/260-16  
MP03/260-14  
MP03/260-12  
MP03/260-10  
1600  
1400  
1200  
1000  
Tvj = 150oC  
IRM = 30mA  
VRSM = VRRM + 100V  
Lower voltage grades available. For full description of part  
numbers see "Ordering instructions" on page 3.  
Module outline type code: MP03.  
See Package Details for further information.  
CURRENT RATINGS - PER ARM  
Max.  
267  
240  
235  
Parameter  
Conditions  
Units  
Symbol  
Tcase = 75oC  
case = 85oC  
A
T
A
A
IF(AV)  
Mean forward current  
Halfwave, resistive load  
Tcase = 75oC  
Theatsink = 75oC  
Theatsink = 85oC  
211  
420  
A
A
IF(RMS)  
RMS value  
1/9  
MP03 XX 260 Series  
SURGE RATINGS - PER ARM  
Symbol  
Parameter  
Units  
A
Conditions  
Max.  
VR = 0  
8100  
10ms half sine;  
IFSM  
Surge (non-repetitive) forward current  
I2t for fusing  
Tj = 150˚C  
A
VR = 50% VRRM  
VR = 0  
6500  
A2s  
328000  
10ms half sine;  
Tj = 150˚C  
I2t  
VR = 50% VRRM  
A2s  
211000  
THERMAL & MECHANICAL RATINGS  
Parameter  
Max.  
0.21  
0.22  
Symbol  
Conditions  
Units  
oC/W  
dc  
Thermal resistance - junction to case  
per Diode  
Rth(j-c)  
halfwave  
3 phase  
oC/W  
oC/W  
0.23  
Thermal resistance - case to heatsink  
per Diode  
Mounting torque = 5Nm  
with mounting compound  
oC/W  
oC  
Rth(c-hs)  
0.05  
150  
Tvj  
Virtual junction temperature  
Storage temperature range  
-40 to 150 oC  
Tsto  
Commoned terminals to base plate  
AC RMS, 1min, 50Hz  
Isolation voltage  
2.5  
Visol  
kV  
CHARACTERISTICS  
Symbol  
Parameter  
Max.  
1.3  
Conditions  
At 600A, Tcase = 25oC  
At VRRM, Tj = 150oC  
At Tvj = 150oC  
Units  
V
VFM  
IRM  
VTO  
rT  
Forward voltage  
Peak reverse current  
30  
mA  
V
Threshold voltage  
0.84  
0.667  
On-state slope resistance  
At Tvj = 150oC  
m  
2/9  
MP03 XX 260 Series  
ORDERING INSTRUCTIONS  
Part number is made up as follows:  
MP03 HB 260 - 16  
MP = Pressure contact module  
03  
= Outline type  
HB = Circuit configuration code (see "circuit options" - front page)  
260 = Nominal average current rating at Tcase = 75oC  
16  
Examples:  
MP03 HB260-10  
= VRRM/100  
MP03 G260-14  
MP023GN260-12  
Note: Preferred type is HB configuration. G & GN types are available for specific applications, only when requested.  
MOUNTING RECOMMENDATIONS  
Adequate heatsinking is required to maintain the base  
temperature at 75oC if full rated current is to be achieved.  
Power dissipation may be calculated by use of VTO and rT  
informationinaccordancewithstandardformulae.Wecan  
provide assistance with calculations or choice of heatsink  
if required.  
An even coating of thermal compound (eg. Unial) should be  
appliedtoboth theheatsinkandmodulemountingsurfaces.  
This should ideally be 0.05mm (0.002") per surface to  
ensure optimum thermal performance.  
After application of thermal compound, place the module  
squarely over the mounting holes, (or 'T' slots) in the  
heatsink. Using a torque wrench, slowly tighten the  
recommended fixing bolts at each end, rotating each in turn  
no more than 1/4 of a revolution at a time. Continue until the  
required torque of 5Nm (44lb.ins) is reached at both ends.  
The heatsink surface must be smooth and flat; a surface  
finish of N6 (32µin) and a flatness within 0.05mm (0.002")  
are recommended.  
Immediatelypriortomounting,theheatsinksurfaceshould  
be lightly scrubbed with fine emery, Scotch Brite or a mild  
chemical etchant and then cleaned with a solvent to  
remove oxide build up and foreign material. Care should  
be taken to ensure no foreign particles remain.  
It is not acceptable to fully tighten one fixing bolt before  
startingtotightentheothers. SuchactionmayDAMAGEthe  
module.  
3/9  
MP03 XX 260 Series  
CURVES  
2500  
2000  
1500  
1000  
500  
Tj = 150˚C  
0
0.5  
1.0  
1.5  
2.0  
Instantaneous forward voltage IF - (V)  
Fig. 1 Maximum (limit) forward characteristics (Per diode)  
0.3  
0.2  
0.1  
Rth(j-hs)  
Rth(j-c)  
0
0.001  
0.010  
0.100  
1.0  
10  
100  
Time - (s)  
Fig. 2 Transient thermal impedance (DC) - (Per diode)  
4/9  
MP03 XX 260 Series  
15000  
12500  
10000  
7500  
5000  
2500  
0
22  
20  
18  
16  
14  
12  
10  
I2t  
1
10  
1
2 3  
cycles at 50Hz  
Duration  
Fig. 3 Surge (non-repetitive) forward current vs time (with 0% VRRM, Tcase = 150˚C)  
5
10 20 30 50  
ms  
5/9  
MP03 XX 260 Series  
500  
450  
400  
350  
300  
250  
200  
150  
100  
50  
d.c.  
180˚ Rectangular  
180˚ Sine  
120˚ Rectangular  
60˚ Rectangular  
0
0
50  
100  
150  
200  
250  
300  
350  
400 425  
Mean forward current - (A)  
Fig. 4 On-state power loss per arm vs forward current at various conduction angles, 50/60Hz  
160  
140  
120  
100  
80  
d.c.  
60  
40  
20  
0
0
50  
100  
150  
200  
250  
300  
350  
400 425  
Forward current - (A)  
Fig. 5 Maximum permissible case temperature vs forward current per arm at various conduction angles, 50/60Hz  
6/9  
MP03 XX 260 Series  
1400  
1200  
1000  
800  
600  
400  
200  
0
0.04  
0.08  
0.02  
R- Load  
L- Load  
0.01 Rth(hs-a) ˚C/W  
0.10  
0.12  
0.15  
0.20  
0.30  
0.40  
0
20  
40  
60  
80 100 120 140  
0
200  
400  
600  
D.C. output current - (A)  
Maximum ambient temperature - (˚C)  
Fig. 6 50/60Hz single phase bridge dc output current vs power loss and maximum permissible ambient temperature for  
various values of heatsink thermal resistance.  
(Note: Rth(hs-a) values given above are true heatsink thermal resistances to ambient and already account for Rth(c-hs) module contact thermal).  
1400  
1200  
0.08  
0.04 0.02  
Rth(hs-a) ˚C/W  
0.01  
R & L - Load  
1000  
800  
600  
400  
200  
0
0.10  
0.12  
0.15  
0.20  
0.30  
0.40  
0
20  
40  
60  
80 100 120 140 160  
0
200  
400 500  
D.C. output current - (A)  
Maximum ambient temperature - (˚C)  
Fig. 7 50/60Hz 3- phase bridge dc output current vs power loss and maximum permissible ambient temperature for various  
values of heatsink thermal resistance.  
(Note: Rth(hs-a) values given above are true heatsink thermal resistances to ambient and already account for Rth(c-hs) module contact thermal).  
7/9  
MP03 XX 260 Series  
PACKAGE DETAILS  
For further package information, please contact your local Customer Service Centre. All dimensions in mm, unless stated otherwise.  
DO NOT SCALE.  
42.5  
35  
28.5  
4 holes Ø5.5  
5
80  
2
3
2x M8  
1
92  
Recommended fixings for mounting:  
Recommended mounting torque:  
M5 socket head cap screws.  
5Nm (44lb.ins)  
Recommended torque for electrical connections: 8Nm (70lb.ins)  
Maximum torque for electrical connections:  
Nominal weight: 950g  
9Nm (80lb.ins)  
Module outline type code: MP03  
CIRCUIT CONFIGURATIONS  
1
1
2
3
3
HB  
2
G
1
2
3
GN  
8/9  
MP03 XX 260 Series  
http://www.dynexsemi.com  
e-mail: power_solutions@dynexsemi.com  
HEADQUARTERS OPERATIONS  
CUSTOMER SERVICE CENTRES  
France, Benelux, Italy and Spain Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 64 46 54 50  
North America Tel: 011-800-5554-5554. Fax: 011-800-5444-5444  
DYNEX SEMICONDUCTOR LTD  
Doddington Road, Lincoln.  
UK, Germany, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020  
Lincolnshire. LN6 3LF. United Kingdom.  
Tel: 00-44-(0)1522-500500  
SALES OFFICES  
Fax: 00-44-(0)1522-500550  
France, Benelux, Italy and Spain Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 64 46 54 50  
Germany Tel: 07351 827723  
DYNEX POWER INC.  
Unit 7 - 58 Antares Drive,  
Nepean, Ontario, Canada K2E 7W6.  
Tel: 613.723.7035  
Fax: 613.723.1518  
Toll Free: 1.888.33.DYNEX (39639)  
North America Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) /  
Tel: (831) 440-1988. Fax: (831) 440-1989 / Tel: (949) 733-3005. Fax: (949) 733-2986.  
UK, Germany, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020  
These offices are supported by Representatives and Distributors in many countries world-wide.  
© Dynex Semiconductor 2000 Publication No. DS5104-3 Issue No. 3.0 January 2000  
TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRINTED IN UNITED KINGDOM  
Datasheet Annotations:  
Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:-  
Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started.  
Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change.  
Advance Information: The product design is complete and final characterisation for volume production is well in hand.  
No Annotation: The product parameters are fixed and the product is available to datasheet specification.  
This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as  
a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves  
the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such  
methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication  
or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury  
or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request.  
All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners.  
9/9  

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