SV0522FMRC [DYNEX]

Rectifier Diode;


型号：	SV0522FMRC
厂家：	Dynex Semiconductor
描述：	Rectifier Diode 整流二极管快恢复二极管快速恢复二极管
文件：	总8页 (文件大小：64K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

SV05..F

Fast Recovery Diode

Advance Information

Replaces March 1998 version, DS4144-3.4

DS4144-4.0 January 2000

APPLICATIONS

■ Induction Heating

■ A.C. Motor Drives

■ Snubber Diode

■ Welding

KEY PARAMETERS

V_RRM

I_F(AV)

I_FSM

Q_r

2500V

145A

2500A

150µC

2.2µs

t_rr

■ High Frequency Rectification

■ UPS

FEATURES

■ Double Side Cooling

■ High Surge Capability

■ Low Recovery Charge

VOLTAGE RATINGS

Type Number

Repetitive Peak

Conditions

Reverse Voltage

V_RRM

SV05 25F M or K

SV05 24F M or K

SV05 22F M or K

SV05 20F M or K

V_RSM= V_RRM+ 100V

2500

2400

2200

2000

For 1/2" 20 UNF thread, add suffix K, e.g. SV05 25FK.

For M12 thread, add suffix M, e.g. SV05 25FM.

For stud anode add 'R' to type number, e.g. SV05 25FMR.

For outline DO8C add suffix 'C' to typ number,

e.g. SV05 25FKC.

Outline type codes: DO8 and DO8C.

See Package Details for further information.

CURRENT RATINGS

Symbol

I_F(AV)

Parameter

Mean forward current

Conditions

Max.

145

Units

Half wave resistive load, T_case= 65^oC

I_F(RMS)

RMS value

_case= 65^oC

225

I_F

Continuous (direct) forward current

195

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SV05..F

SURGE RATINGS

Conditions

Symbol

Parameter

Max.

2.5

Units

I_FSM

I²t

Surge (non-repetitive) forward current

I²t for fusing

10ms half sine; with 0% V_RRM,T_j= 150^oC

31 x 10³

2.0

A²s

I_FSM

I²t

Surge (non-repetitive) forward current

I²t for fusing

10ms half sine; with 50% V_RRM,T_j= 150^oC

20 x 10³

A²s

THERMAL AND MECHANICAL DATA

Conditions

Min.

Max. Units

Parameter

Symbol

R_th(j-c)

^oC/W

0.23

0.02

Thermal resistance - junction to case

Thermal resistance - case to heatsink

Mounting torque 15Nm

with mounting compound

R_th(c-h)

T_vj

T_stg

On-state (conducting)

150

16.5

^oC

Virtual junction temperature

Storage temperature range

Mounting torque

-55

13.5

CHARACTERISTICS

Symbol

Typ.

Units

Parameter

Conditions

At 600A peak, T_case= 25^oC

At V_RRM, T_case= 150^oC

Max.

2.8

V_FM

I_RRM

t_rr

Forward voltage

Peak reverse current

Reverse recovery time

2.2

µs

Q_RA1

I_RM

Recovered charge (50% chord)

Reverse recovery current

Soft factor

I_F= 600A, di_RR/dt = 80A/µs

150

140

µC

T_case= 150^oC, V_R= 100V

V_TO

r_T

Threshold voltage

At T_vj= 150^oC

1.4

2.5

250

mΩ

Slope resistance

At T_vj= 150^oC

V_FRM

Forward recovery voltage

di/dt = 1000A/µs, T_j= 125^oC

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SV05..F

DEFINITION OF K FACTOR AND Q_RA1

Q_RA1= 0.5x I_RR(t₁+ t₂)

k = t₁/t₂

dI_R/dt

t₁

t₂

0.5x I_RR

I_RR

CURVES

1000

Measured under pulse conditions

900

800

700

600

500

T_j= 150˚C

T_j= 25˚C

2.0

2.5

3.0

Instantaneous forward voltage V_F- (V)

Fig.1 Maximum (limit) forward characteristics

3.5

4.0

4.5

3/8

SV05..F

500

400

300

200

100

Measured under pulse

conditions

T_j= 25˚C

T_j= 150˚C

1.0

1.5

2.0

2.5

3.0

Instantaneous forward voltage V_F- (V)

Fig.2 Maximum (limit) forward characteristics

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SV05..F

10000

1000

100

50µs

Conditions:

T_j= 150 ˚C,

V_R= 100V

I_F

Q =

∫

t_p= 1ms

dI_R/dt

I_RR

I_F= 1000A

I_F= 500A

I_F= 200A

I_F= 100A

100

1000

Rate of rise of reverse current dI_R/dt - (A/µs)

Fig.3 Recovered charge

1000

Conditions:

T_j= 150˚C,

V_R= 100V

I_F= 1000A

100

1000

Rate of rise of reverse current dI_R/dt - (A/µs)

Fig.4 Typical reverse recovery current vs rate of rise of reverse current

5/8

SV05..F

0.1

d.c.

0.01

0.001

0.01

0.1

100

Time - (s)

Fig.5 Maximum (limit) transient thermal impedance - junction to case - (˚C/W)

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SV05..F

PACKAGE DETAILS - DO8 and DO8C

For further package information, please contact your local Customer Service Centre. All dimensions in mm, unless stated otherwise.

DO NOT SCALE.

Ø8.4 ± 0.3

8 min

20 max

Ø5.2 ± 0.2

12 ± 0.5

Ø27 max

8 min

Ø27 max

8 min

3.17 max

Thread M12

1/2" 20 UNF

Thread M12

1/2" 20 UNF

3.17 max

Nominal weight: 120g

Mounting torque: 15Nm ±10%

Nominal weight: 120g

Mounting torque: 15Nm ±10%

Package outine type code: DO8

Package outine type code: DO8C

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SV05..F

POWER ASSEMBLY CAPABILITY

The Power Assembly group was set up to provide a support service for those customers requiring more than the basic semiconduc-

tor, and has developed a flexible range of heatsink / clamping systems in line with advances in device types and the voltage and

current capability of our semiconductors.

We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The

Assembly group continues to offer high quality engineering support dedicated to designing new units to satisfy the growing needs of

our customers.

Using the up to date CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete

solution (PACs).

HEATSINKS

Power Assembly has it’s own proprietary range of extruded aluminium heatsinks. They have been designed to optimise the

performance or our semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on

request.

For further information on device clamps, heatsinks and assemblies, please contact your nearest Sales Representative or the

factory.

http://www.dynexsemi.com

e-mail: power_solutions@dynexsemi.com

HEADQUARTERS OPERATIONS

CUSTOMER SERVICE CENTRES

France, Benelux, Italy and Spain Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 64 46 54 50

North America Tel: 011-800-5554-5554. Fax: 011-800-5444-5444

UK, Germany, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020

DYNEX SEMICONDUCTOR LTD

Doddington Road, Lincoln.

Lincolnshire. LN6 3LF. United Kingdom.

Tel: 00-44-(0)1522-500500

SALES OFFICES

Fax: 00-44-(0)1522-500550

France, Benelux, Italy and Spain Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 64 46 54 50

Germany Tel: 07351 827723

DYNEX POWER INC.

Unit 7 - 58 Antares Drive,

Nepean, Ontario, Canada K2E 7W6.

Tel: 613.723.7035

Fax: 613.723.1518

Toll Free: 1.888.33.DYNEX (39639)

North America Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) /

Tel: (831) 440-1988. Fax: (831) 440-1989 / Tel: (949) 733-3005. Fax: (949) 733-2986.

UK, Germany, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020

These offices are supported by Representatives and Distributors in many countries world-wide.

TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRINTED IN UNITED KINGDOM

Datasheet Annotations:

Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:-

Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started.

Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change.

Advance Information: The product design is complete and final characterisation for volume production is well in hand.

No Annotation: The product parameters are fixed and the product is available to datasheet specification.

This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as

a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves

the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such

methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication

or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury

or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request.

All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners.

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