DR1040-1R5-R [EATON]

Shielded power inductors;


型号：	DR1040-1R5-R
厂家：	Eaton All Rights Reserved.
描述：	Shielded power inductors 电感器
文件：	总5页 (文件大小：447K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Effective April 2016

Technical Data 4147

Supersedes March 2007

DR1040

Shielded power inductors

Applications

•

LED/LCD backlighting

High definition televisions (HDTV)

Server and desktop power supplies

Portable electronics

Graphics cards and battery powered systems

Point-of-load (POL) modules

Printers and peripherals

Environmental Data

•

Storage temperature range (Component):

•

-40 °C to +125 °C

•

Operating temperature range: -40 °C to +125 °C

(ambient plus self-temperature rise)

Description

•

Shielded drum core

•

Solder reflow temperature: J-STD-020D

compliant

•

Inductance range from 1.4 μH to 323 μH

•

Current range from 0.52 A to 10 A

HALOGEN

•

10.5 mm x 10.3 mm footprint surface mount

package in a 4.0 mm height

FREE

•

Ferrite core material

•

Halogen free, lead free, RoHS compliant

DR1040

Shielded power inductors

Technical Data 4147

Effective April 2016

Product Specifications

DCR (mΩ)

typical

@ 23°C

DCR (mΩ)

maximum

@ 23°C

OCL¹

I_rms

(A)

I_sat

Part Number⁵

DR1040-1R5-R

DR1040-2R5-R

DR1040-3R8-R

DR1040-5R2-R

DR1040-7R0-R

DR1040-8R2-R

DR1040-100-R

DR1040-150-R

DR1040-220-R

DR1040-330-R

DR1040-470-R

DR1040-680-R

DR1040-820-R

DR1040-101-R

DR1040-151-R

DR1040-221-R

DR1040-331-R

(μH) ±±30

1.35

2.4

(A)

K-factor⁴

15.5

12.0

9.9

6.5

6.1

5.5

5.4

4.5

6.0

7.0

9.6

8.1

7.8

9.0

3.6

6.4

5.2

5.5

8.3

6.8

4.8

7.2

8.1

3.98

3.8

4.6

6.4

9.6

4.4

5.7

14.9

21.1 20ꢀ

32.6

45.8

65.3

3.1

3.6

4.7

2.5

2.9

4.0

2.2

2.45

2.1

3.3

1.9

128

183

260

304

430

640

1090

2.8

1.42

1.29

1.25

0.85

0.70

0.52

1.65

1.47

1.35

1.15

0.92

0.70

152

214

225

356

530

810

2.3

2.0

101

1.9

148

1.6

216

1.3

323

1.0

1. Open Circuit Inductance (OCL) Test Parameters: 100 kHz, 0.25 Vrms, 0.0 Adc, +25 ºC

4. K-factor: K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ΔI. Bp-p: (mT), K:

(K-factor from table), L: (Inductance in μH), ΔI (Peak to peak ripple current in Amps)..

5. Part Number Definition: DR1040-xxx-R

DR1040 = Product code and size

-xxx= inductance value in μH, R= decimal point,

2. I_rms: DC current for an approximate temperature rise of 30 ºC without core loss. Derating is necessary for AC currents.

PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the

temperature rise. It is recommended that the temperature of the part not exceed 125 ºC under worst case operating

conditions verified in the end application.

3. I_sat: Peak current for approximately 35ꢀ rolloff @ +25 ºC

If no R is present then last character equals number of zeros

-R suffix = RoHS compliant

Dimensions (mm)

Part marking: inductance value in uH. R = decimal point. If no R is present then last character equals number of zeroes.

wwlly = date code, R = revision level

Do not route traces or vias underneath the inductor

www.eaton.com/elx

DR1040

Shielded power inductors

Technical Data 4147

Effective April 2016

Packaging information (mm)

Supplied in tape and reel packaging , 850 parts per 13” diameter reel

Temperature rise vs. total loss

120

100

0.2

0.4

0.6

0.8

1.2

Total Loss (W)

www.eaton.com/elx

DR1040

Shielded power inductors

Technical Data 4147

Effective April 2016

Core loss vs. B

p-p

1 MHz 500 kHz

300 kHz

200 kHz

100 kHz

0.1

0.01

0.001

100

1000

B_p-p(mT)

Inductance characteristics

%OCL vs. I_sat

120%

100%

80%

60%

40%

20%

-40 °C

+25 °C

+85 °C

20%

40%

60%

80%

100%

120%

140%

160%

% of I_sat

www.eaton.com/elx

DR1040

Shielded power inductors

Technical Data 4147

Effective April 2016

Solder reflow profile

T_P

Table 1 - Standard SnPb Solder (T )

T_C-5°C

t_P

Volume

mm±

Volume

Max. Ramp Up Rate = 3°C/s

Max. Ramp Down Rate = 6°C/s

Package

mm±

Thickness

<±53

≥±53

T_L

<2.5mm)

235°C

220°C

Preheat

≥2.5mm

T_smax

Table 2 - Lead (Pb) Free Solder (T )

Volume

mm^±

Package

mm^±

T_smin

Thickness

<±53

±53 - 2333

>2333

t_s

<1.6mm

260°C

250°C

260°C

250°C

245°C

260°C

245°C

1.6 – 2.5mm

>2.5mm

25°C

Time 25°C to Peak

Time

Reference JDEC J-STD-020D

Profile Feature

Standard SnPb Solder

100°C

Lead (Pb) Free Solder

150°C

Preheat and Soak • Temperature min. (T

)

smin

• Temperature max. (T

)

150°C

200°C

smax

• Time (T

smin

to T

) (t )

smax

60-120 Seconds

3°C/ Second Max.

60-120 Seconds

3°C/ Second Max.

Average ramp up rate T

smax

to T

Liquidous temperature (Tl)

Time at liquidous (t )

183°C

60-150 Seconds

217°C

60-150 Seconds

Peak package body temperature (T )*

Table 1

Table 2

Time (t )** within 5 °C of the specified classification temperature (T )

20 Seconds**

6°C/ Second Max.

6 Minutes Max.

30 Seconds**

6°C/ Second Max.

8 Minutes Max.

Average ramp-down rate (T to T

)

smax

Time 25°C to Peak Temperature

* Tolerance for peak profile temperature (T ) is defined as a supplier minimum and a user maximum.

** Tolerance for time at peak profile temperature (t ) is defined as a supplier minimum and a user maximum.

Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written

approval of an ofﬁcer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly

used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in signiﬁcant injury to the user.

Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also

reserves the right to change or update, without notice, any technical information contained in this bulletin.

Eaton

Electronics Division

1000 Eaton Boulevard

Cleveland, OH 44122

United States

www.eaton.com/elx

Printed in USA

Eaton is a registered trademark.

Publication No. 4147

April 2016

All other trademarks are property

of their respective owners.

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