FP0805R1-R07-R [EATON]

High frequency, high current power inductors;


型号：	FP0805R1-R07-R
厂家：	Eaton All Rights Reserved.
描述：	High frequency, high current power inductors 功率感应器电感器
文件：	总4页 (文件大小：650K)
中文：	中文翻译
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Effective June 2017

Supersedes December 2008

Technical Data 4340

FP0805

High frequency, high current power inductors

Applications

•

Multi-phase regulators

Voltage Regulator Module (VRM)

Point-of-load modules

Desktop and server VRM’s and EVRD’s

Data networking and storage systems

Graphics cards and battery power systems

DCR sensing

SMD Device

Environmental data

•

Storage temperature range (component):

-40 °C to +125 °C

Product features

•

Operating temperature range: -40 °C to +125 °C

(ambient plus self-temperature rise)

Solder reflow temperature:

•

7.5 x 7.6 x 5mm surface mount package

Ferrite core material

High current carrying capacity, Low core losses

Controlled DCR tolerance for sensing circuits

Inductance range from 32nH to 200nH

Current range from 20 to 110 Amps

Frequency range up to 2MHz

J-STD-020 (latest revision) compliant

HALOGEN

FREE

805

FP0

High frequency, high current power inductors

Technical Data 4340

Effective June 2017

Product Specifications

rms sat sat

Part Number⁷

OCL¹1ꢀ0 ꢁ(nH FLL²Mi(. ꢁ(nH

³ꢁAmpsH I 1⁴@ 25°C ꢁAmpsH I 2⁵@ 125°C ꢁAmpsH DCR ꢁmΩH @ 2ꢀ°C K-factor⁶

FP0805R1-R03-R

FP0805R1-R06-R

FP0805R1-R07-R

FP0805R1-R10-R

FP0805R1-R20-R

100

200

144

110

823.6

0.17 17%

Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.10V , 0.0Adc

rms

1: Peak current for approximately 20% rolloff at +25°C.

2: Peak current for approximately 20% rolloff at +125°C.

sat

Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1V , I

rms sat

sat

: DC current for an approximate temperature rise of 40°C without core loss. Derating is

rms

-3

K-factor: Used to determine B for core loss (see graph). B = K L ΔI 10 , B : (Gauss),

* *

p-p p-p

K: (K-factor from table), L: (inductance in nH), ΔI (peak-to-peak ripple current in amps).

p-p

necessary for AC currents. PCB pad layout, trace thickness and width, air-flow and proximity of

other heat generating components will affect the temperature rise. It is recommended the part

temperature not exceed 125°C under worst case operating conditions verified in the end

application.

Part Number Definition: FP0805Rx-Rxx-R

• FP0805 = Product code and size

• Rxx= Inductance value in μH, R = decimal point • “-R” suffix = RoHS compliant

• Rx is the DCR indicator

Dimensions- mm

Schematic

Bottom View

Top View

Side View

4.96 max

Recommended Pad Layout

7.49 max

3.43

2.16+/-0.2

3.0 typ.

0805Rx

Rxx

wwllyy R

7.62 max

5.13

2.79

3.12 +/-0.2

The nominal DCR is measured from point “a” to point”b.”

Part Marking:

0805Rx (Rx = DCR Indicator)

Rxx = Inductance value in μH. (R = Decimal point)

wwllyy = Date code

R = Revision level

Packaging information - mm

1.5

dia.

1.75

4.0

2.0

6.80

7.5

16.00

+/-0.30

0805Rx

Rxx

wwllyy

7.60

3.80

1.5

dia

7.72

5.10

12.0

User direction of feed

SECTION A-A

SECTION B-B

Supplied in tape-and-reel packaging, 950 parts per reel, 13” diameter reel.

www.eaton.com/electronics

FP0805

Technical Data 4340

Effective June 2017

High frequency, high current power inductor

Temperature rise vs total loss

0.2

0.4

0.6

0.8

1.2

1.4

Total Loss (W)

Core loss vs Bp-p

1MHz

500kHz

300kHz

200kH

100kHz

0.1

0.01

0.001

0.0001

0.00001

100

1000

p-p (Gauss)

10000

Inductance characteristics

% of OCL vs. % of I

sat

100%

80%

60%

40%

20%

-40°C

+25°C

+125°C

20%

40%

60%

80%

100%

120%

% of I

sat

www.eaton.com/electronics

FP0805

Technical Data 4340

High frequency, high current power inductor

Effective June 2017

Solder Reflow Profile

T_P

TTaabbllee 1 - SSttaannddaardd SnPPbb SSoolldeerr ((TT ))

T_C-5°C

t_P

Max. Ramp Up Rate = 3°C/s

Max. Ramp Down Rate = 6°C/s

Volume

mm³

<350

235°C

220°C

Volume

mm³

Package

Thickness

<2.5mm

>350

T_L

220°C

Preheat

>2.5mm

T_smax

TTaabbllee 2 - LLeeaadd ((PPbb)) Frreee SSoolldeerr ((TT ))

Volume

mm³

>2000

260°C

245°C

T_smin

mm³

t_s

Package

Thickness

<1.6mm

<350

260°C

1.6 – 2.5mm 260°C

>2.5mm 250°C

350 - 2000

260°C

250°C

245°C

25°C

Time 25°C to Peak

Time

Reference JDEC J-STD-020

Profile Feature

Preheat and Soak

Standard SnPb Solder Lead (Pb) Free Solder

100°C

• Temperature min. (T

)

150°C

smin

• Temperature max. (T

)

150°C

200°C

smax

) (t )

• Time (T

smin

to T

60-120 Seconds

3°C/ Second Max.

60-120 Seconds

3°C/ Second Max.

smax s

Average ramp up rate T

to T

smax

Liquidous temperature (T

Time at liquidous (t )

)

183°C

60-150 Seconds

217°C

60-150 Seconds

Peak package body temperature (T )*

Table 1

Table 2

Time (t )** within 5 °C of the specified classification temperature (T )

20 Seconds**

6°C/ Second Max.

6 Minutes Max.

30 Seconds**

6°C/ Second Max.

8 Minutes Max.

Average ramp-down rate (T to T

)

smax

Time 25°C to Peak Temperature

* Tolerance for peak profile temperature (T ) is defined as a supplier minimum and a user maximum.

** Tolerance for time at peak profile temperature (t ) is defined as a supplier minimum and a user maximum.

Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written

approval of an ofﬁcer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly

used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in signiﬁcant injury to the user.

Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also

reserves the right to change or update, without notice, any technical information contained in this bulletin.

Eaton

Electronics Division

1000 Eaton Boulevard

Cleveland, OH 44122

United States

www.eaton.com/electronics

Printed in USA

Eaton is a registered trademark.

All other trademarks are property

of their respective owners.

Publication No. 4340 BU-SB08859

June 2017

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