FP1007R1-R22-R [EATON]

High frequency, high current power inductors;


型号：	FP1007R1-R22-R
厂家：	Eaton All Rights Reserved.
描述：	High frequency, high current power inductors 测试功率感应器电感器
文件：	总5页 (文件大小：531K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Effective October 2015

Technical Data 4341

Supersedes September 2010

FP1007

High frequency, high current power inductors

Applications

•

Servers

•

Multi-phase and Vcore regulators

•

Voltage Regulator Modules (VRMs)

Desktop VRMs and EVRDs

Data networking and storage systems

Graphics cards and battery power systems

Point-of-Load modules

DCR Sensing circuits

Product description

Environmental data

•

High current carrying capacity

Storage temperature range (Component):

-40°C to +125°C

•

Low core loss

•

Operating temperature range: -40°C to +125°C

(ambient + self-temperature rise)

•

Frequency range up to 2MHz

•

Inductance Range from 115 nH to 300nH

•

Solder reflow temperature:

J-STD-020D compliant

•

Current range from 32 to 94 amps

•

10.4 x 8.0mm footprint surface mount package

HALOGEN

in 6.5, 7.5 or 7.5mm height

•

Ferrite core material

FREE

•

Halogen free, lead free, RoHS compliant

FP1007

Technical Data 4341

Effective October 2015

High frequency, high current power inductors

Product specifications

OCL¹

FLL²

I_rms

I_sat1⁴

I_sat2⁵

DCR (mΩ)

Part Number⁷

R1 version

(nH) 1ꢀ0

(nH) minimum

(amps)

@ 2ꢀ°C 50

K-factor⁸

FP1007R1-R12-R

FP1007R1-R14-R

FP1007R1-R17-R

FP1007R1-R22-R

FP1007R1-R30-R

R2 version

120

140

170

215

300

0.29 10ꢀ

371

100

122

155

216

FP1007R2-R12-R

FP1007R2-R14-R

FP1007R2-R17-R

FP1007R2-R22-R

FP1007R2-R30-R

R3 version

120

140

170

215

300

0.48 8ꢀ

368

100

122

155

216

FP1007R3-R12-R

FP1007R3-R15-R

FP1007R3-R17-R

FP1007R3-R22-R

FP1007R3-R23-R

FP1007R3-R27-R

FP1007R3-R30-R

115

150

175

215

230

270

300

0.29 5ꢀ

354

108

126

155

165

194

216

1. Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.1Vrms, 0.0Adc, +25°C

2. Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1Vrms, I_sat1, +25°C

6. K-factor: Used to determine B_p-pfor core loss (see graph).

B_p-p= K * L * ∆I * 10^-3. B_p-p:(Gauss), K: (K-factor from table),

L: (Inductance in nH), ∆I (Peak-to-peak ripple current in Amps).

7. Part Number Definition: FP1007Rx-Rxx-R

FP1007R= Product code and size

3. I_rms: Irms: DC current for an approximate temperature rise of 40ºC without core loss. Derating is

necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other

heat generating components will affect the temperature rise. It is recommended that the

temperature of the part not exceed 125°C under worst case operating conditions verified in the

end application.

x = DCR indicator

Rxx = Inductance value in μH, R= decimal point

-R suffix = RoHS compliant

4. I_sat1: Peak current for approximately 20ꢀ rolloff @ +25°C

5. I_sat2: Peak current for approximately 20ꢀ rolloff @ +125°C

Dimensions (mm)

Recommended Pad Layout

Schematic

Part marking: FP1007Rx (x = DCR indicator), Rxx (xx = inductance value in

uH, R = decimal point, wwllyy = date code, R = revision level

Tolerances are 0.25 millimeters unless stated otherwise.

PCB tolerances are 0.1 millimeters unless stated otherwise

All soldering surfaces to be coplanar within 0.1 millimeter

DCR measured from point “a” to point “b”

Do not route traces or vias underneath the inductor

www.eaton.com/elx

FP1007

Technical Data 4341

Effective October 2015

High frequency, high current power inductors

Packaging information (mm)

Supplied in tape and reel packaging,

FP1007R1 700 parts per 13 ” diameter reel

FP1007R2 750 parts per 13 ” diameter reel

FP1007R3 650 parts per 13 ” diameter reel

User direction of feed

Temperature rise vs. total loss

www.eaton.com/elx

FP1007

Technical Data 4341

Effective October 2015

High frequency, high current power inductors

Core loss vs. B_p-p

Inductance characteristics

www.eaton.com/elx

FP1007

Technical Data 4341

Effective October 2015

High frequency, high current power inductors

Solder reflow profile

T_P

Table 1 - Standard SnPb Solder (T )

T_C-5°C

t_P

Volume

mm3

Volume

Max. Ramp Up Rate = 3°C/s

Max. Ramp Down Rate = 6°C/s

Package

mm3

Thickness

<35ꢀ

≥35ꢀ

T_L

<2.5mm)

235°C

220°C

Preheat

≥2.5mm

T_smax

Table 2 - Lead (Pb) Free Solder (T )

Volume

mm³

Package

mm³

T_smin

Thickness

<35ꢀ

35ꢀ - 2ꢀꢀꢀ

>2ꢀꢀꢀ

t_s

<1.6mm

260°C

250°C

260°C

250°C

245°C

260°C

245°C

1.6 – 2.5mm

>2.5mm

25°C

Time 25°C to Peak

Time

Reference JDEC J-STD-020D

Profile Feature

Standard SnPb Solder

100°C

Lead (Pb) Free Solder

150°C

Preheat and Soak • Temperature min. (T

)

smin

• Temperature max. (T

)

150°C

200°C

smax

• Time (T

smin

to T

) (t )

smax

60-120 Seconds

3°C/ Second Max.

60-120 Seconds

3°C/ Second Max.

Average ramp up rate T

smax

to T

Liquidous temperature (Tl)

Time at liquidous (t )

183°C

60-150 Seconds

217°C

60-150 Seconds

Peak package body temperature (T )*

Table 1

Table 2

Time (t )** within 5 °C of the specified classification temperature (T )

20 Seconds**

6°C/ Second Max.

6 Minutes Max.

30 Seconds**

6°C/ Second Max.

8 Minutes Max.

Average ramp-down rate (T to T

)

smax

Time 25°C to Peak Temperature

* Tolerance for peak profile temperature (T ) is defined as a supplier minimum and a user maximum.

** Tolerance for time at peak profile temperature (t ) is defined as a supplier minimum and a user maximum.

Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written

approval of an ofﬁcer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly

used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in signiﬁcant injury to the user.

Eaton

Electronics Division

1000 Eaton Boulevard

Cleveland, OH 44122

United States

www.eaton.com/elx

Printed in USA

Eaton is a registered trademark.

Publication No. 4341 BU-10927

October 2015

All other trademarks are property

of their respective owners.

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