FP1010R [EATON]

High frequency, high current power inductors;
FP1010R
型号: FP1010R
厂家: Eaton All Rights Reserved.    Eaton All Rights Reserved.
描述:

High frequency, high current power inductors

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Technical Data 10531  
Effective April 2016  
FP1010R  
High frequency, high current power inductors  
Applications  
Multi-phase and Vcore regulators  
Voltage Regulator Modules (VRMs)  
Server and desktop  
Central processing unit (CPU)  
Graphics processing unit (GPU)  
Application specific integrated circuit (ASIC)  
High power density  
Data networking and storage systems  
Graphics cards and battery power systems  
Portable electronics  
Point-of-Load modules  
DCR Sensing circuits  
Environmental Data  
Description  
Storage temperature range (Component):  
-40 °C to +125 °C  
High current carrying capacity  
Low core loss  
Operating temperature range: -40 °C to +125 °C  
(ambient plus self-temperature rise)  
Magnetically shielded  
Tight tolerance DCR for sensing circuits  
Solder reflow temperature: J-STD-020D  
compliant  
10 mm x 7.0 mm footprint surface mount  
package in a 10 mm height  
HALOGEN  
Ferrite core material  
HF  
Pb  
Halogen free, lead free, RoHS compliant  
FREE  
FP1010R  
Technical Data 10531  
Effective April 2016  
High frequency, high current power inductors  
Product Specifications  
3
OCL1  
(nH) 1ꢀ5  
FLL2 (nH)  
minimum  
Irms  
(A)  
Isat14  
(A)  
Isat2ꢀ  
(A)  
Isat36  
(A)  
DCR (mΩ)  
ꢀ5 ꢁ 2ꢂ0C  
Part Number8  
FP1010R1-R120-R  
FP1010R1-R150-R  
FP1010R1-R330-R  
K-factor7  
371  
120  
150  
330  
84  
50  
50  
50  
94  
80  
30  
80  
68  
25  
75  
64  
23  
0.185  
0.185  
0.185  
105  
230  
371  
371  
1
4. Isat : Peak current for approximately 20% rolloff @ +25 °C  
1. Open Circuit Inductance (OCL) Test Parameters: 100 kHz, 0.1 Vrms, 0.0 Adc, +25 °C  
2. Full Load Inductance (FLL) Test Parameters: 100 kHz, 0.1 Vrms, Isat1, +25 °C  
2
5. Isat : Peak current for approximately 20% rolloff @ +100 °C  
3
3. Irms: DC current for an approximate temperature rise of 40 °C without core loss. Derating is necessary for AC currents.  
PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the  
temperature rise. It is recommended that the temperature of the part not exceed 125 °C under worst case operating  
conditions verified in the end application.  
6. Isat : Peak current for approximately 20% rolloff @ +125 °C  
7. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ΔI * 10-3. Bp-p:(Gauss),  
K: (K-factor from table), L: (Inductance in nH), Symbol I (Peak to peak ripple current in Amps).  
8. Part Number Definition: FP1010Rx-Rxxx-R  
FP1010R= Product code and size  
x= Version indicator  
-Rxxx= Inductance value in μH, R= decimal point  
-R suffix = RoHS compliant  
Dimensions (mm)  
Part marking: 1010Rx (x = Version Indicator), Rxxx = Inductance value in uH (R= decimal point)  
wwllyy = date code, R = revision level  
Tolerances are 0.15 millimeters unless stated otherwise  
All soldering surfaces to be coplanar within 0.1 millimeters  
PCB tolerances are 0.1 millimeters unless stated otherwise  
DCR measured from point “a” to point “b”  
Do not route traces or vias underneath the inductor  
www.eaton.com/elx  
2
FP1010R  
Technical Data 10531  
Effective April 2016  
High frequency, high current power inductors  
Packaging information (mm)  
Supplied in tape and reel packaging , 300 parts per 13” diameter reel  
Temperature rise vs. total loss  
60  
50  
40  
30  
20  
10  
0
0.0  
0.2  
0.4  
0.6  
0.8  
1.0  
Total Loss (W)  
www.eaton.com/elx  
3
FP1010R  
Technical Data 10531  
Effective April 2016  
High frequency, high current power inductors  
Core loss vs. B  
p-p  
10  
1
1 MHz  
800 kHz  
500 kHz  
300 kHz  
0.1  
0.01  
0.001  
100  
1000  
10000  
Bp-p (Gauss)  
Inductance characteristics  
FP1010R1-R120-R  
120%  
100%  
80%  
60%  
40%  
20%  
0%  
-40 °C  
+25 °C  
+100 °C  
+125 °C  
0
10  
20  
30  
40  
50  
60  
70  
80  
90 100 110 120 130  
IDC (A)  
www.eaton.com/elx  
4
FP1010R  
Technical Data 10531  
Effective April 2016  
High frequency, high current power inductors  
Inductance characteristics  
FP1010R1-R150-R  
FP1010R1-R330-R  
120%  
120%  
100%  
80%  
60%  
40%  
20%  
0%  
100%  
80%  
60%  
-40 °C  
40%  
20%  
0%  
-40 °C  
+25 °C  
+100 °C  
+125 °C  
+25 °C  
+100 °C  
+125 °C  
0
10  
20  
30  
40  
50  
60  
70  
80  
90  
100  
0
5
10  
15  
20  
25  
30  
35  
40  
45  
IDC (A)  
IDC (A)  
www.eaton.com/elx  
5
FP1010R  
Technical Data 10531  
Effective April 2016  
High frequency, high current power inductors  
Solder reflow profile  
TP  
Table 1 - Standard SnPb Solder (T )  
c
TC -5°C  
tP  
Volume  
mm3  
Volume  
Max. Ramp Up Rate = 3°C/s  
Max. Ramp Down Rate = 6°C/s  
Package  
mm3  
Thickness  
<3ꢀꢂ  
3ꢀꢂ  
TL  
<2.5mm)  
235°C  
220°C  
220°C  
220°C  
Preheat  
t
2.5mm  
Tsmax  
Table 2 - Lead (Pb) Free Solder (T )  
c
Volume  
Volume  
Volume  
mm3  
Package  
mm3  
mm3  
Tsmin  
Thickness  
<3ꢀꢂ  
3ꢀꢂ - 2ꢂꢂꢂ  
>2ꢂꢂꢂ  
ts  
<1.6mm  
260°C  
260°C  
250°C  
260°C  
250°C  
245°C  
260°C  
245°C  
245°C  
1.6 – 2.5mm  
>2.5mm  
25°C  
Time 25°C to Peak  
Time  
Reference JDEC J-STD-020D  
Profile Feature  
Standard SnPb Solder  
100°C  
Lead (Pb) Free Solder  
150°C  
Preheat and Soak • Temperature min. (T  
)
smin  
• Temperature max. (T  
)
150°C  
200°C  
smax  
• Time (T  
smin  
to T  
) (t )  
smax  
60-120 Seconds  
3°C/ Second Max.  
60-120 Seconds  
3°C/ Second Max.  
s
Average ramp up rate T  
smax  
to T  
p
Liquidous temperature (Tl)  
Time at liquidous (t )  
183°C  
60-150 Seconds  
217°C  
60-150 Seconds  
L
Peak package body temperature (T )*  
Table 1  
Table 2  
P
Time (t )** within 5 °C of the specified classification temperature (T )  
20 Seconds**  
6°C/ Second Max.  
6 Minutes Max.  
30 Seconds**  
6°C/ Second Max.  
8 Minutes Max.  
p
c
Average ramp-down rate (T to T  
p
)
smax  
Time 25°C to Peak Temperature  
* Tolerance for peak profile temperature (T ) is defined as a supplier minimum and a user maximum.  
p
** Tolerance for time at peak profile temperature (t ) is defined as a supplier minimum and a user maximum.  
p
Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written  
approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly  
used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.  
Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also  
reserves the right to change or update, without notice, any technical information contained in this bulletin.  
Eaton  
Electronics Division  
1000 Eaton Boulevard  
Cleveland, OH 44122  
United States  
www.eaton.com/elx  
© 2016 Eaton  
All Rights Reserved  
Printed in USA  
Eaton is a registered trademark.  
Publication No. 10531 BU&-MC16039  
April 2016  
All other trademarks are property  
of their respective owners.  

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