FP1108L2 [EATON]

High frequency, high current power inductors;


型号：	FP1108L2
厂家：	Eaton All Rights Reserved.
描述：	High frequency, high current power inductors
文件：	总6页 (文件大小：462K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Technical Data 10448

Effective October 2015

FP1108L1 and FP1108L2

High frequency, high current power inductors

Applications

•

Servers

•

Multi-phase and Vcore regulators

•

Voltage Regulator Modules (VRMs)

Desktop VRMs and EVRDs

Data networking and storage systems

Graphics cards and battery power systems

Point-of-Load modules

Environmental Data

•

Storage temperature range (Component):

-40°C to +125°C

•

Operating temperature range: -40°C to +125°C

Description

(ambient + self-temperature rise)

•

High current carrying capacity

Solder reflow temperature: J-STD-020D

compliant

•

Low core loss

•

Ultra low DCR

HALOGEN

•

Inductance range from 105nH to 150nH

FREE

•

Current range from 48 to 81 amps

•

11.0 x 8.2mm footprint surface mount package

in an 8.3mm height

•

Ferrite core material

•

Halogen free, lead free, RoHS compliant

FP1108L1 and FP1108L2

High frequency, high current power inductors

Technical Data 10448

Effective October 2015

Product Specifications

OCL¹

(nH) 1ꢀ0

FLL²(nH)

minimum

I_rms

I_sat1⁴

(amps)

I_sat2⁵

(amps)

I_sat3⁶

(amps)

DCR (mΩ)

1ꢀ0 ꢁ 2ꢀꢂC

Part Number⁸

L1 Version

(amps)

K-factor⁷

FP1108L1-R105-R

FP1108L1-R150-R

FP1108L1-R180-R

L2 Version

105

150

180

0.10

422

108

129

FP1108L2-R150-R

150

108

0.18

390

4. I_sat: Peak current for approximately 20% rolloff @ +25°C

1. Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.1Vrms, 0.0Adc, @ +25°C

2. Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1Vrms, @ I_sat1, @ +25ºC

5. I_sat: Peak current for approximately 20% rolloff @ +75°C

6. I_sat: Peak current for approximately 20% rolloff @ +100°C

3. I_rms: DC current for an approximate temperature rise of 40°C without core loss. Derating is necessary for AC currents.

PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the

temperature rise. It is recommended that the temperature of the part not exceed 125°C under worst case operating

conditions verified in the end application.

7. K-factor: Used to determine B_p-pfor core loss (see graph). Bp-p = K * L * ΔI * 10^-3B_p-p: (Gauss),

K: (K-factor from table), L: (Inductance in nH), ΔI (Peak to peak ripple current in Amps).

8. Part Number Definition: FP1108Lx-Rxxx-R

FP1108L = Product code and size

x= Version indicator

Rxxx= inductance value in μH, R= decimal point ,

-R suffix = RoHS compliant

Dimensions (mm)

8.2

max

8.3

max

Recommended Pad Layout

Schematic

3.15

2.45

11.0

max

3.0

nom

3.50

3.2 2.4

nom nom

Part marking: 1108Lx (x = Version indicator), Rxxx = Inductance value in uH (R= decimal point)

wwllyy = date code, R = revision level

All soldering surfaces to be coplanar within 0.1 millimeters

PCB tolerances are 0.1 millimeters unless otherwise specified

DCR measured from point “a” to point “b”

Do not route traces or vias underneath the inductor

www.eaton.com/elx

FP1108L1 and FP1108L2

High frequency, high current power inductors

Technical Data 10448

Effective October 2015

Packaging information (mm)

Supplied in tape and reel packaging, 450 parts per 13” diameter reel

4.0

1.5 dia

2.0

1.75

11.5

24.0

0.ꢀ

11.2

8.4

16.0

8.4

Section A–A

User Direction of feed

Temperature rise vs. total loss

FP1108L1

FP1108L2

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

Total Loss (W)

www.eaton.com/elx

FP1108L1 and FP1108L2

High frequency, high current power inductors

Technical Data 10448

Effective October 2015

Core loss vs. B

p-p

FP1108L1

300kHz

200kHz

500KH

100kHz

0.1

0.01

0.001

100

1000

10000

B_p-p(Gauss)

FP1108L2

1.0MHz

800kHz

500kHz

300kHz

0.1

0.01

0.001

100

1000

10000

B_p-p(Gauss)

www.eaton.com/elx

FP1108L1 and FP1108L2

High frequency, high current power inductors

Technical Data 10448

Effective October 2015

Inductance characteristics

FP1108L1-R105-R

FP1108L1-R150-R

120%

100%

80%

60%

40%

20%

100%

80%

60%

-40°C

+25°C

40%

20%

+125°C

+100°C

+125°C

+100°C

I_DC(Amps)

100

120

I_DC(Amps)

FP1108L1-R180-R

FP1108L2-R150-R

120%

100%

80%

60%

40%

20%

120%

100%

80%

60%

40%

20%

-40°C

+25°C

-40°C

+25°C

+100°C

+125°C

+100°C

I_DC(Amps)

www.eaton.com/elx

FP1108L1 and FP1108L2

High frequency, high current power inductors

Technical Data 10448

Effective October 2015

Solder reflow profile

T_P

Table 1 - Standard SnPb Solder (T )

T_C-5°C

t_P

Volume

mm3

Volume

Max. Ramp Up Rate = 3°C/s

Max. Ramp Down Rate = 6°C/s

Package

mm3

Thickness

<35ꢀ

≥35ꢀ

T_L

<2.5mm)

235°C

220°C

Preheat

≥2.5mm

T_smax

Table 2 - Lead (Pb) Free Solder (T )

Volume

mm³

Package

mm³

T_smin

Thickness

<35ꢀ

35ꢀ - 2ꢀꢀꢀ

>2ꢀꢀꢀ

t_s

<1.6mm

260°C

250°C

260°C

250°C

245°C

260°C

245°C

1.6 – 2.5mm

>2.5mm

25°C

Time 25°C to Peak

Time

Reference JDEC J-STD-020D

Profile Feature

Standard SnPb Solder

100°C

Lead (Pb) Free Solder

150°C

Preheat and Soak • Temperature min. (T

)

smin

• Temperature max. (T

)

150°C

200°C

smax

• Time (T

smin

to T

) (t )

smax

60-120 Seconds

3°C/ Second Max.

60-120 Seconds

3°C/ Second Max.

Average ramp up rate T

smax

to T

Liquidous temperature (Tl)

Time at liquidous (t )

183°C

60-150 Seconds

217°C

60-150 Seconds

Peak package body temperature (T )*

Table 1

Table 2

Time (t )** within 5 °C of the specified classification temperature (T )

20 Seconds**

6°C/ Second Max.

6 Minutes Max.

30 Seconds**

6°C/ Second Max.

8 Minutes Max.

Average ramp-down rate (T to T

)

smax

Time 25°C to Peak Temperature

* Tolerance for peak profile temperature (T ) is defined as a supplier minimum and a user maximum.

** Tolerance for time at peak profile temperature (t ) is defined as a supplier minimum and a user maximum.

Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written

approval of an ofﬁcer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly

used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in signiﬁcant injury to the user.

Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also

reserves the right to change or update, without notice, any technical information contained in this bulletin.

Eaton

Electronics Division

1000 Eaton Boulevard

Cleveland, OH 44122

United States

www.eaton.com/elx

Printed in USA

Eaton is a registered trademark.

Publication No. 10448 BU-MC15030

October 2015

All other trademarks are property

of their respective owners.

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