FP1108L4-R120-R [EATON]
High frequency, high current power inductors;
| 型号： | FP1108L4-R120-R |
| 厂家： | 
Eaton All Rights Reserved. |
| 描述： | High frequency, high current power inductors |
| 文件： | 总6页 (文件大小：481K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Technical Data 10449
Effective October 2015
FP1108L3 and FP1108L4
High frequency, high current power inductors
Applications
•
Servers
•
Multi-phase and Vcore regulators
•
•
•
•
•
Voltage Regulator Modules (VRMs)
Desktop VRMs and EVRDs
Data networking and storage systems
Graphics cards and battery power systems
Point-of-Load modules
Environmental Data
•
Storage temperature range (Component):
-40°C to +125°C
•
Operating temperature range: -40°C to +125°C
Description
(ambient + self-temperature rise)
•
•
High current carrying capacity
Solder reflow temperature: J-STD-020D
compliant
•
Ultra low DCR
•
Low core loss
HALOGEN
•
Operating frequency
HF
Pb
FREE
− L3 version 500kHz-800kHz
− L4 version 1MHz-3MHz
•
Inductance range from 105nH to 180nH
•
Current range from 33 to 57 amps
•
11.0 x 8.0mm footprint surface mount package
in an 8.0mm heightt
•
Ferrite core material
•
Halogen free, lead free, RoHS compliant
FP1108L3 and FP1108L4
High frequency, high current power inductors
Technical Data 10449
Effective October 2015
Product Specifications
3
OCL1
(nH) 1ꢀ0
FLL2 (nH)
minimum
Irms
Isat14
(amps)
Isat25
(amps)
Isat36
(amps)
DCR (mΩ)
1ꢀ0 ꢁ 2ꢀꢂC
Part Number8
L3 Version
(amps)
K-factor7
FP1108L3-R105-R
L4 Version
105
76
91
57
48
45
0.05
552
FP1108L4-R120-R
FP1108L4-R150-R
FP1108L4-R180-R
120
150
180
86
91
91
91
50
40
33
42
34
28
40
32
26
0.05
0.05
0.05
552
552
552
108
129
1
4. Isat : Peak current for approximately 20% rolloff @ +25°C
1. Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.1Vrms, 0.0Adc, @ +25°C
2. Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1Vrms, @ Isat1, @ +25ºC
2
5. Isat : Peak current for approximately 20% rolloff @ +100°C
3
6. Isat : Peak current for approximately 20% rolloff @ +125°C
3. Irms: DC current for an approximate temperature rise of 40°C without core loss. This is for reference only and does not
represent absolute maximum ratings. Derating is necessary for AC currents. PCB layout, trace thickness and width,
air-flow, and proximity of other heat generating components will affect the temperature rise. It is recommended that
the temperature of the part not exceed 125°C under worst case operating conditions verified in the end application.
7. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ΔI * 10-3 Bp-p: (Gauss),
K: (K-factor from table), L: (Inductance in nH), ΔI (Peak to peak ripple current in Amps).
8. Part Number Definition: FP1108Lx-Rxxx-R
FP1108L = Product code and size
x= Version indicator
Rxxx= inductance value in μH, R= decimal point ,
-R suffix = RoHS compliant
Dimensions (mm)
b
a
8.0
max
8.0
max
Recommended Pad Layout
Schematic
3.5
11.0
max
3.6
nom
4.0
8.6
1.7
nom
3.0
nom
Part marking: 1108Lx (x = Version indicator), Rxxx = Inductance value in uH (R= decimal point)
wwllyy = date code, R = revision level
All soldering surfaces to be coplanar within 0.1 millimeters
PCB tolerances are 0.1 millimeters unless otherwise specified
DCR measured from point “a” to point “b”
Do not route traces or vias underneath the inductor
www.eaton.com/elx
2
FP1108L3 and FP1108L4
High frequency, high current power inductors
Technical Data 10449
Effective October 2015
Packaging information (mm)
Supplied in tape and reel packaging, 500 parts per 13” diameter reel
1.5 dia
1.5 dia
1.75
4.0
2.0
11.5
24.0
0.ꢀ
11.4
16.0
8.1
8.4
User Direction of feed
Temperature rise vs. total loss
FP1108L3
FP1108L4
60
60
50
40
30
20
10
0
50
40
30
20
10
0
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.0
0.1
0.2
0.3
0.4
0.5
0.6
Total Loss (W)
Total Loss (W)
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3
FP1108L3 and FP1108L4
High frequency, high current power inductors
Technical Data 10449
Effective October 2015
Core loss vs. B
p-p
FP1108L3
10
1
1.0MHz
800kHz
500kHz
300kHz
0.1
0.01
0.001
100
1000
10000
Bp-p (Gauss)
FP1108L4
10
1
3.0MHz
2.0MHz
1.5MHz
1.0MHz
700kHz
0.1
0.01
0.001
100
1000
10000
Bp-p (Gauss)
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4
FP1108L3 and FP1108L4
High frequency, high current power inductors
Technical Data 10449
Effective October 2015
Inductance characteristics
FP1108L3-R105-R
FP1108L4-R120-R
120%
120%
100%
80%
60%
40%
20%
0%
100%
80%
60%
-40°C
40%
-40°C
+25°C
+25°C
+100°C
+125°C
+100°C
20%
+125°C
0%
0
10
20
30
40
50
60
70
80
0
10
20
30
40
50
60
70
IDC (Amps)
IDC (Amps)
FP1108L4-R150-R
FP1108L4-R180-R
120%
100%
80%
60%
40%
20%
0%
120%
100%
80%
60%
40%
20%
0%
-40°C
+25°C
-40°C
+25°C
+100°C
+125°C
+100°C
+125°C
0
5
10
15
20
25
30
35
40
45
0
5
10
15
20
25
30
35
40
45
50
IDC (Amps)
IDC (Amps)
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5
FP1108L3 and FP1108L4
High frequency, high current power inductors
Technical Data 10449
Effective October 2015
Solder reflow profile
TP
Table 1 - Standard SnPb Solder (T )
c
TC -5°C
tP
Volume
mm3
Volume
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
Package
mm3
Thickness
<35ꢀ
≥35ꢀ
TL
<2.5mm)
235°C
220°C
220°C
220°C
Preheat
t
≥2.5mm
Tsmax
Table 2 - Lead (Pb) Free Solder (T )
c
Volume
Volume
Volume
mm3
Package
mm3
mm3
Tsmin
Thickness
<35ꢀ
35ꢀ - 2ꢀꢀꢀ
>2ꢀꢀꢀ
ts
<1.6mm
260°C
260°C
250°C
260°C
250°C
245°C
260°C
245°C
245°C
1.6 – 2.5mm
>2.5mm
25°C
Time 25°C to Peak
Time
Reference JDEC J-STD-020D
Profile Feature
Standard SnPb Solder
100°C
Lead (Pb) Free Solder
150°C
Preheat and Soak • Temperature min. (T
)
smin
• Temperature max. (T
)
150°C
200°C
smax
• Time (T
smin
to T
) (t )
smax
60-120 Seconds
3°C/ Second Max.
60-120 Seconds
3°C/ Second Max.
s
Average ramp up rate T
smax
to T
p
Liquidous temperature (Tl)
Time at liquidous (t )
183°C
60-150 Seconds
217°C
60-150 Seconds
L
Peak package body temperature (T )*
Table 1
Table 2
P
Time (t )** within 5 °C of the specified classification temperature (T )
20 Seconds**
6°C/ Second Max.
6 Minutes Max.
30 Seconds**
6°C/ Second Max.
8 Minutes Max.
p
c
Average ramp-down rate (T to T
p
)
smax
Time 25°C to Peak Temperature
* Tolerance for peak profile temperature (T ) is defined as a supplier minimum and a user maximum.
p
** Tolerance for time at peak profile temperature (t ) is defined as a supplier minimum and a user maximum.
p
Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written
approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly
used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also
reserves the right to change or update, without notice, any technical information contained in this bulletin.
Eaton
Electronics Division
1000 Eaton Boulevard
Cleveland, OH 44122
United States
www.eaton.com/elx
© 2015 Eaton
All Rights Reserved
Printed in USA
Eaton is a registered trademark.
Publication No. 10449 BU-MC15031
October 2015
All other trademarks are property
of their respective owners.
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