FP1109 [EATON]

High frequency, high current power inductors;
FP1109
型号: FP1109
厂家: Eaton All Rights Reserved.    Eaton All Rights Reserved.
描述:

High frequency, high current power inductors

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Effective June 2017  
Supersedes June 2011  
Technical Data 4350  
FP1109  
High frequency, high current power inductors  
Applications  
Multi-phase regulators  
Voltage Regulator Module (VRM)  
Desktop and server VRMs and EVRDs  
Data networking and storage systems  
Graphics cards and battery power systems  
Point-of-load modules  
DCR sensing  
Environmental data  
SMD Device  
Storage temperature range (component):  
-40 °C to +125 °C  
Product features  
Operating temperature range: -40 °C to +125 °C  
(ambient plus self-temperature rise)  
Solder reflow temperature:  
11.2 x 11.2 x 9.0mm maximum surface mount  
package  
Ferrite core material  
J-STD-020 (latest revision) compliant  
High current carrying capacity, low core losses  
Controlled DCR tolerance for sensing circuits  
Inductance range from 205nH to 950nH  
Current range from 11.5 to 69 amps  
Frequency range up to 2MHz  
HALOGEN  
Pb  
HF  
FREE  
FP1109  
Technical Data 4350  
Effective June 2017  
High frequency, high current power inductors  
Product Specifications  
rms sat sat  
Part Number7  
OCL1 ꢀ20 ꢁ(nH FLLMi(. ꢁ(nH  
I
3 ꢁAmpsH I 14 @ ꢀ5°C ꢁAmpsH I ꢀ5 @ 1ꢀ5°C ꢁAmpsH DCR ꢁmΩH @ ꢀ2°C K-factor6  
FP1109-R20-R  
FP1109-R23-R  
FP1109-R27-R  
FP1109-R33-R  
FP1109-R47-R  
FP1109-R58-R  
FP1109-1R0-R  
205  
247  
270  
311  
463  
548  
950  
122  
147  
160  
185  
275  
325  
565  
69  
55  
51  
44  
27  
52  
41  
38  
33  
20  
17  
8.5  
233  
233  
233  
233  
233  
233  
233  
35  
0.42 10%  
22.5  
11.5  
1
2
3
Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.10V , 0.0Adc  
rms  
4
5
I
I
1: Peak current for approximately 30% rolloff at +25°C.  
2: Peak current for approximately 30% rolloff at +125°C.  
sat  
Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1V , I  
1
rms sat  
sat  
I
: DC current for an approximate temperature rise of 40°C without core loss. Derating is  
rms  
-3  
K-factor: Used to determine B for core loss (see graph). B = K L ΔI 10 , B : (Gauss),  
* *  
p-p p-p  
K: (K-factor from table), L: (inductance in nH), ΔI (peak-to-peak ripple current in amps).  
Part Number Definition: FP1109-xxx-R  
• FP1109 = Product code and size  
• xxx= Inductance value in μH, R = decimal point. If no “R” is present, then  
third character = # of zeros  
6
*
p-p  
necessary for AC currents. PCB pad layout, trace thickness and width, air-flow and proximity of  
other heat generating components will affect the temperature rise. It is recommended the part  
temperature not exceed 125°C under worst case operating conditions verified in the end  
application.  
7
• “-R” suffix = RoHS compliant  
Dimensions- mm  
Recommended Pad Layout  
Front View  
Top View  
2
Side View  
Schematic  
1
2
2.5 nom.  
(2x)  
3.0  
(2X)  
9.0  
max  
11.2  
max  
11.4  
4.10 ref  
(2X)  
2.03 ref  
1
3.0  
(2X)  
11.2 max  
Part Marking: FP1109  
xxx = Inductance value in μH. (R = Decimal point). If no “R” is present, then last character is # of zeros  
wwllyy = Date code  
R = Revision level  
Packaging information - mm  
4.00  
1.5 dia. +0.1/-0.0  
2.00  
1.75  
1.5 dia. min  
Section A-A  
1
2
11.50  
24.0 0.3  
17.5 11.4  
11.4  
16.4  
9.3  
2.0  
20.00  
User direction of feed  
Supplied in tape-and-reel packaging, 350 parts per reel, 13” diameter reel.  
www.eaton.com/electronics  
2
FP1109  
Technical Data 4350  
Effective June 2017  
High frequency, high current power inductor  
Temperature rise vs total loss  
50  
40  
30  
20  
10  
0
0
0.2  
0.4  
0.6  
0.8  
1
1.2  
1.4  
1.6  
Total Loss (W )  
Core loss vs Bp-p  
1MHz  
100  
10  
500kHz  
300kHz  
200kHz  
100kHz  
1
0.1  
0.01  
0.001  
0.0001  
0.00001  
100  
1000  
10000  
Bp-p (Gauss)  
Inductance characteristics  
% o f OC L vs. % o f I  
1
sat  
120%  
100%  
80%  
60%  
40%  
20%  
- 40°C  
+25°C  
+125°C  
0%  
0%  
20%  
40%  
60%  
80%  
100%  
120%  
% o f I  
1
sat  
3
www.eaton.com/electronics  
FP1109  
Technical Data 4350  
High frequency, high current power inductor  
Effective June 2017  
Solder Reflow Profile  
TP  
TTaabbllee 1 - SSttaannddaardd SnPPbb SSoolldeerr ((TT ))  
cc  
TC -5°C  
tP  
Max. Ramp Up Rate = 3°C/s  
Max. Ramp Down Rate = 6°C/s  
Volume  
mm3  
<350  
235°C  
220°C  
Volume  
mm3  
Package  
Thickness  
<2.5mm  
_
>350  
TL  
220°C  
220°C  
Preheat  
A
t
_
>2.5mm  
Tsmax  
TTaabbllee 2 - LLeeaadd ((PPbb)) Frreee SSoolldeerr ((TT ))  
cc  
Volume  
Volume  
Volume  
mm3  
>2000  
26C  
245°C  
245°C  
Tsmin  
mm3  
mm3  
ts  
Package  
Thickness  
<1.6mm  
<350  
26C  
1.6 – 2.5mm 26C  
>2.5mm 250°C  
350 - 2000  
26C  
250°C  
245°C  
25°C  
Time 25°C to Peak  
Time  
Reference JDEC J-STD-020  
Profile Feature  
Preheat and Soak  
Standard SnPb Solder Lead (Pb) Free Solder  
100°C  
• Temperature min. (T  
)
150°C  
smin  
• Temperature max. (T  
)
150°C  
200°C  
smax  
) (t )  
• Time (T  
smin  
to T  
60-120 Seconds  
C/ Second Max.  
60-120 Seconds  
C/ Second Max.  
smax s  
Average ramp up rate T  
to T  
smax  
p
Liquidous temperature (T  
Time at liquidous (t )  
L
)
183°C  
60-150 Seconds  
217°C  
60-150 Seconds  
L
Peak package body temperature (T )*  
Table 1  
Table 2  
P
Time (t )** within 5 °C of the specified classification temperature (T )  
20 Seconds**  
6°C/ Second Max.  
6 Minutes Max.  
30 Seconds**  
6°C/ Second Max.  
8 Minutes Max.  
p
Average ramp-down rate (T to T  
c
)
smax  
p
Time 25°C to Peak Temperature  
* Tolerance for peak profile temperature (T ) is defined as a supplier minimum and a user maximum.  
p
** Tolerance for time at peak profile temperature (t ) is defined as a supplier minimum and a user maximum.  
p
Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written  
approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly  
used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.  
Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also  
reserves the right to change or update, without notice, any technical information contained in this bulletin.  
Eaton  
Electronics Division  
1000 Eaton Boulevard  
Cleveland, OH 44122  
United States  
www.eaton.com/electronics  
© 2017 Eaton  
All Rights Reserved  
Printed in USA  
Eaton is a registered trademark.  
All other trademarks are property  
of their respective owners.  
Publication No. 4350 BU-SB11642  
June 2017  

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