FP1109 [EATON]
High frequency, high current power inductors;型号: | FP1109 |
厂家: | Eaton All Rights Reserved. |
描述: | High frequency, high current power inductors |
文件: | 总4页 (文件大小:554K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Effective June 2017
Supersedes June 2011
Technical Data 4350
FP1109
High frequency, high current power inductors
Applications
•
•
•
•
•
•
•
Multi-phase regulators
Voltage Regulator Module (VRM)
Desktop and server VRMs and EVRDs
Data networking and storage systems
Graphics cards and battery power systems
Point-of-load modules
DCR sensing
Environmental data
SMD Device
•
Storage temperature range (component):
-40 °C to +125 °C
Product features
•
•
Operating temperature range: -40 °C to +125 °C
(ambient plus self-temperature rise)
Solder reflow temperature:
•
11.2 x 11.2 x 9.0mm maximum surface mount
package
•
•
•
•
•
•
Ferrite core material
J-STD-020 (latest revision) compliant
High current carrying capacity, low core losses
Controlled DCR tolerance for sensing circuits
Inductance range from 205nH to 950nH
Current range from 11.5 to 69 amps
Frequency range up to 2MHz
HALOGEN
Pb
HF
FREE
FP1109
Technical Data 4350
Effective June 2017
High frequency, high current power inductors
Product Specifications
rms sat sat
Part Number7
OCL1 ꢀ20 ꢁ(nH FLLꢀ Mi(. ꢁ(nH
I
3 ꢁAmpsH I 14 @ ꢀ5°C ꢁAmpsH I ꢀ5 @ 1ꢀ5°C ꢁAmpsH DCR ꢁmΩH @ ꢀ2°C K-factor6
FP1109-R20-R
FP1109-R23-R
FP1109-R27-R
FP1109-R33-R
FP1109-R47-R
FP1109-R58-R
FP1109-1R0-R
205
247
270
311
463
548
950
122
147
160
185
275
325
565
69
55
51
44
27
52
41
38
33
20
17
8.5
233
233
233
233
233
233
233
35
0.42 10%
22.5
11.5
1
2
3
Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.10V , 0.0Adc
rms
4
5
I
I
1: Peak current for approximately 30% rolloff at +25°C.
2: Peak current for approximately 30% rolloff at +125°C.
sat
Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1V , I
1
rms sat
sat
I
: DC current for an approximate temperature rise of 40°C without core loss. Derating is
rms
-3
K-factor: Used to determine B for core loss (see graph). B = K L ΔI 10 , B : (Gauss),
* *
p-p p-p
K: (K-factor from table), L: (inductance in nH), ΔI (peak-to-peak ripple current in amps).
Part Number Definition: FP1109-xxx-R
• FP1109 = Product code and size
• xxx= Inductance value in μH, R = decimal point. If no “R” is present, then
third character = # of zeros
6
*
p-p
necessary for AC currents. PCB pad layout, trace thickness and width, air-flow and proximity of
other heat generating components will affect the temperature rise. It is recommended the part
temperature not exceed 125°C under worst case operating conditions verified in the end
application.
7
• “-R” suffix = RoHS compliant
Dimensions- mm
Recommended Pad Layout
Front View
Top View
2
Side View
Schematic
1
2
2.5 nom.
(2x)
3.0
(2X)
9.0
max
11.2
max
11.4
4.10 ref
(2X)
2.03 ref
1
3.0
(2X)
11.2 max
Part Marking: FP1109
xxx = Inductance value in μH. (R = Decimal point). If no “R” is present, then last character is # of zeros
wwllyy = Date code
R = Revision level
Packaging information - mm
4.00
1.5 dia. +0.1/-0.0
2.00
1.75
1.5 dia. min
Section A-A
1
2
11.50
24.0 0.3
17.5 11.4
11.4
16.4
9.3
2.0
20.00
User direction of feed
Supplied in tape-and-reel packaging, 350 parts per reel, 13” diameter reel.
www.eaton.com/electronics
2
FP1109
Technical Data 4350
Effective June 2017
High frequency, high current power inductor
Temperature rise vs total loss
50
40
30
20
10
0
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
Total Loss (W )
Core loss vs Bp-p
1MHz
100
10
500kHz
300kHz
200kHz
100kHz
1
0.1
0.01
0.001
0.0001
0.00001
100
1000
10000
Bp-p (Gauss)
Inductance characteristics
% o f OC L vs. % o f I
1
sat
120%
100%
80%
60%
40%
20%
- 40°C
+25°C
+125°C
0%
0%
20%
40%
60%
80%
100%
120%
% o f I
1
sat
3
www.eaton.com/electronics
FP1109
Technical Data 4350
High frequency, high current power inductor
Effective June 2017
Solder Reflow Profile
TP
TTaabbllee 1 - SSttaannddaardd SnPPbb SSoolldeerr ((TT ))
cc
TC -5°C
tP
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
Volume
mm3
<350
235°C
220°C
Volume
mm3
Package
Thickness
<2.5mm
_
>350
TL
220°C
220°C
Preheat
A
t
_
>2.5mm
Tsmax
TTaabbllee 2 - LLeeaadd ((PPbb)) Frreee SSoolldeerr ((TT ))
cc
Volume
Volume
Volume
mm3
>2000
260°C
245°C
245°C
Tsmin
mm3
mm3
ts
Package
Thickness
<1.6mm
<350
260°C
1.6 – 2.5mm 260°C
>2.5mm 250°C
350 - 2000
260°C
250°C
245°C
25°C
Time 25°C to Peak
Time
Reference JDEC J-STD-020
Profile Feature
Preheat and Soak
Standard SnPb Solder Lead (Pb) Free Solder
100°C
• Temperature min. (T
)
150°C
smin
• Temperature max. (T
)
150°C
200°C
smax
) (t )
• Time (T
smin
to T
60-120 Seconds
3°C/ Second Max.
60-120 Seconds
3°C/ Second Max.
smax s
Average ramp up rate T
to T
smax
p
Liquidous temperature (T
Time at liquidous (t )
L
)
183°C
60-150 Seconds
217°C
60-150 Seconds
L
Peak package body temperature (T )*
Table 1
Table 2
P
Time (t )** within 5 °C of the specified classification temperature (T )
20 Seconds**
6°C/ Second Max.
6 Minutes Max.
30 Seconds**
6°C/ Second Max.
8 Minutes Max.
p
Average ramp-down rate (T to T
c
)
smax
p
Time 25°C to Peak Temperature
* Tolerance for peak profile temperature (T ) is defined as a supplier minimum and a user maximum.
p
** Tolerance for time at peak profile temperature (t ) is defined as a supplier minimum and a user maximum.
p
Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written
approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly
used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also
reserves the right to change or update, without notice, any technical information contained in this bulletin.
Eaton
Electronics Division
1000 Eaton Boulevard
Cleveland, OH 44122
United States
www.eaton.com/electronics
© 2017 Eaton
All Rights Reserved
Printed in USA
Eaton is a registered trademark.
All other trademarks are property
of their respective owners.
Publication No. 4350 BU-SB11642
June 2017
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