FP1110V1-R20-R [EATON]

High frequency, high current power inductors;


型号：	FP1110V1-R20-R
厂家：	Eaton All Rights Reserved.
描述：	High frequency, high current power inductors
文件：	总6页 (文件大小：419K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Technical Data 10427

Effective August 2015

FP1110V

High frequency, high current power inductors

Applications

•

Servers

•

Multi-phase and Vcore regulators

•

Voltage Regulator Modules (VRMs)

Desktop VRMs and EVRDs

Data networking and storage systems

Point-of-Load modules

DCR Sensing circuits

Environmental Data

•

Storage temperature range (Component):

-40°C to +125°C

Description

•

Operating temperature range: -40°C to +125°C

(ambient + self-temperature rise)

•

Vertical design utilizes less board space

•

Solder reflow temperature: J-STD-020D

compliant

•

Controlled DCR for sensing circuits

•

Inductance Range from 195 nH to 320nH

•

Current range from 42 to 70 amps

•

HALOGEN

10.7 x 7.5mm and 10.5 x 6.2mm footprint

surface mount package in a 9.5mm height

FREE

•

Ferrite core material

•

Halogen free, lead free, RoHS compliant

FP1110V

Technical Data 10427

Effective August 2015

High frequency, high current power inductors

Product specifications

OCL¹

FLL²

sat2

DCR (mΩ)

rms

sat1

Part Number⁷

(nH) 1ꢀ0

minimum (nH)

(amps)

50 ꢁ ꢂ2ꢀꢃC

K-factor⁶

V1-10.7 x 7.5 x 9.5mm

FP1110V1-R20-R

195

220

270

320

140

158

173

230

0.23

278

FP1110V1-R22-R

FP1110V1-R27-R

FP1110V1-R32-R

V2-10.5 x 6.2 x 9.5mm

FP1110V2-R200-R

200

144

0.18

328

1. Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.1Vrms, 0.0Adc, +25°C

2. Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1Vrms, @ I_sat1, @ +25ºC

5. I_sat: Peak current for approximately 20% rolloff @ +100ºC

6. K-factor: Used to determine B_p-pfor core loss (see graph). B_p-p= K * L * ΔI * 10^-3.

3. I_rms: DC current for an approximate temperature rise of 40°C without core loss. Derating is necessary for AC currents.

PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the

temperature rise. It is recommended that the temperature of the part not exceed +125°C under worst case operating

conditions verified in the end application.

B_p-p:(Gauss), K: (K-factor from table), L: (Inductance in nH), ΔI (Peak to peak ripple current in Amps).

7. Part Number Definition: FP1110Vx-Rxx(x)-R

FP1110V = Product code

x= DCR indicator

4. I_sat1 : Peak current for approximately 20% rolloff @ +25ºC

Rxx(x)= Inductance value in uH, R= decimal point

-R suffix = RoHS compliant

Dimensions (mm)

7.5

max

9.5

max

Recommended Pad Layout

Schematic

10.7

max

4.6

2.8

4.1

3.4

2.8

3.3

Recommended Pad Layout

Schematic

6.2

max

9.5

max

10.5

max

4.0

3.6

4.2

3.0

2.15

2.8

Part marking: FP1110V1 or V2, Rxx(x)=inductance value in µH, R=decimal point

wwllyy= date code, R=revision level

DCR measured from point “a” to point “b”

Soldering surfaces to be coplanar within 0.10 millimeters

Do not route traces or vias underneath the inductor.

www.eaton.com/elx

FP1110V

Technical Data 10427

Effective April 2015

High frequency, high current power inductors

Packaging information (mm)

(Drawing not to scale)

(Supplied in tape and reel packaging, 300 parts per 13” diameter reel

FP1110V1

4.0

2.0

1.75

11.5

24.0

0.ꢀ

10.9

20.0

Part marking

9.5

7.6

User Direction of feed

FP1110V2

1.5 dia

1.75

4.0

2.0

1.5 dia

11.5

24.0

0.ꢀ

10.7

20.0

10.2

Part marking

2.5

6.4

User Direction of feed

www.eaton.com/elx

FP1110V

Technical Data 10427

Effective August 2015

High frequency, high current power inductors

Temperature rise vs. total loss

FP1110V1

FP1110V2

0.0

0.2

0.4

0.6

0.8

1.0

1.2

0.0

0.2

0.4

0.6

0.8

1.0

Total Loss (W)

Core loss vs. B_p-p

FP1110V1

FP1110V2

0.1

0.01

0.1

0.01

0.001

100

1000

10000

100

1000

B_p-p(Gauss)

10000

B_p-p(Gauss)

www.eaton.com/elx

FP1110V

Technical Data 10427

Effective April 2015

High frequency, high current power inductors

Inductance characteristics

FP1110V1-R20-R

FP1110V1-R22-R

120%

100%

80%

60%

40%

20%

100%

80%

60%

40%

-40°C

+25°C

+100°C

+125°C

-40°C

+25°C

+100°C

+125°C

20%

10 20 30 40 50 60 70 80 90 100 110 120

10 20 30 40 50 60 70 80 90 100 110

I_DC(Amps)

FP1110V1-R27-R

FP1110V1-R32-R

120%

100%

80%

60%

40%

20%

120%

100%

80%

60%

40%

20%

-40°C

+25°C

+100°C

+125°C

+25°C

+100°C

+125°C

I_DC(Amps)

FP1110V2-R200-R

120%

100%

80%

60%

40%

20%

-40°C

+25°C

+100°C

+125°C

90 100

I_DC(Amps)

www.eaton.com/elx

FP1110V

Technical Data 10427

Effective August 2015

High frequency, high current power inductors

Solder reflow profile

T_P

Table 1 - Standard SnPb Solder (T )

T_C-5°C

t_P

Volume

Max. Ramp Up Rate = 3°C/s

Max. Ramp Down Rate = 6°C/s

Package

mm³

Thickness

<35ꢀ

≥35ꢀ

T_L

<2.5mm)

235°C

220°C

Preheat

≥2.5mm

T_smax

Table 2 - Lead (Pb) Free Solder (T )

Volume

mm³

Package

mm³

T_smin

Thickness

<35ꢀ

35ꢀ - 2ꢀꢀꢀ

>2ꢀꢀꢀ

t_s

<1.6mm

260°C

250°C

260°C

250°C

245°C

260°C

245°C

1.6 – 2.5mm

>2.5mm

25°C

Time 25°C to Peak

Time

Reference JDEC J-STD-020D

Profile Feature

Standard SnPb Solder

100°C

Lead (Pb) Free Solder

150°C

Preheat and Soak • Temperature min. (T

)

smin

• Temperature max. (T

)

150°C

200°C

smax

• Time (T

smin

to T

) (t )

smax

60-120 Seconds

3°C/ Second Max.

60-120 Seconds

3°C/ Second Max.

Average ramp up rate T

smax

to T

Liquidous temperature (Tl)

Time at liquidous (t )

183°C

60-150 Seconds

217°C

60-150 Seconds

Peak package body temperature (T )*

Table 1

Table 2

Time (t )** within 5 °C of the specified classification temperature (T )

20 Seconds**

6°C/ Second Max.

6 Minutes Max.

30 Seconds**

6°C/ Second Max.

8 Minutes Max.

Average ramp-down rate (T to T

)

smax

Time 25°C to Peak Temperature

* Tolerance for peak profile temperature (T ) is defined as a supplier minimum and a user maximum.

** Tolerance for time at peak profile temperature (t ) is defined as a supplier minimum and a user maximum.

Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written

approval of an ofﬁcer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly

used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in signiﬁcant injury to the user.

Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also

reserves the right to change or update, without notice, any technical information contained in this bulletin.

Eaton

Electronics Division

1000 Eaton Boulevard

Cleveland, OH 44122

United States

www.eaton.com/elx

Printed in USA

Eaton is a registered trademark.

Publication No. 10427 BU-MC15008

August 2015

All other trademarks are property

of their respective owners.

相关型号：