FP1206R1-R15-R [EATON]
High frequency, high current power inductors;
| 型号： | FP1206R1-R15-R |
| 厂家： | 
Eaton All Rights Reserved. |
| 描述： | High frequency, high current power inductors 测试 功率感应器 电感器 |
| 文件： | 总4页 (文件大小：741K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Effective June 2017
Supersedes April 2009
Technical Data 4366
FP1206
High frequency, high current power inductors
Applications
•
•
•
•
•
•
•
Multi-phase regulators
Voltage Regulator Module (VRM)
Desktop and server VRMs and EVRDs
Data networking and storage systems
Graphics cards and battery power systems
Point of load modules
DCR current sensing
Environmental data
SMD Device
•
Storage temperature range (component):
-40 °C to +125 °C
Product features
•
•
Operating temperature range: -40 °C to +125 °C
(ambient plus self-temperature rise)
Solder reflow temperature:
•
•
•
•
8.0 x12.0 x 6.0mm surface mount package
Ferrite core material
High current carrying capacity, low core losses
Designed for high speed, high current switch
mode applications
J-STD-020 (latest revision) compliant
HALOGEN
Pb
HF
•
•
•
•
Controlled DCR tolerance for sensing circuits
Inductance range from 120nH to 400nH
Current range from 24 to 88 amps
Frequency range up to 1MHz
FREE
FP1206
Technical Data 4366
Effective June 2017
High frequency, high current power inductors
Product Specifications
3
Part
Number7
FP1206R1-R12-R
FP1206R1-R15-R
FP1206R1-R25-R
FP1206R1-R30-R
FP1206R1-R40-R
OCL1
FLL2
I
I
14
I
25
sat
(Amps) @125°C
DCR (mΩ)
rms
sat
1ꢀ0 (nH)
120
150
250
300
Min. (nH)
86
108
180
216
(Amps)
(Amps) @25°C
@2ꢀ°C
K-factor6
358
358
358
358
88
70
43
34
24
65
51
32
26
19
50
0.43 6.5%
400
288
358
1 Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.1V , 0.0Adc
rms
5 I 2: Peak current for approximately 20% rolloff at +125°C.
sat
2 Full Load Inductance (FLL) Test Parameters: 100kHz, .01V , I
1
6 K-factor: Used to determine B for core loss (see graph). B = K * L * ΔI * 10-3. B :(Gauss), K:
rms sat
p-p p-p p-p
3 I : DC current for an approximate temperature rise of 40°C without core loss. Derating is
(K-factor from table), L: (Inductance in nH), ΔI (Peak-to-peak ripple current in amps).
7 Part Number Definition: FP1206Rx-Rxx-R
• FP1206 = Product code and size
rms
necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other
heat generating components will affect the temperature rise. It is recommended that the
temperature of the part not exceed 125°C under worst case operating conditions verified in the
end application.
• Rx= DCR indicator
• Rxx= Inductance value in uH, R = decimal point
• -R suffix = RoHS compliant
4 I 1: Peak current for approximately 20% rolloff at +25°C.
sat
Dimensions- mm
Top View
Side View
Bottom View
Schematic
Recommended Pad Layout
6.ꢀ
2.ꢀ
ꢀ.2
4.5
2.5
7.7
ꢀ.3
2.8
ꢀ.2
max
a
1
2
7.7
11.7
ꢀ.3
12ꢀ6Rx
Rxx
7.5
typ.
wwllyy
R
b
The nominal DCR is measured between points “a” and “b”
Part Marking: 1206Rx (Rx is the DCR indicator)
Rxx = Inductance value in μH. (R = Decimal point).
wwllyy = Date code
R = Revision level
Packaging information - mm
1.5 dia
4.ꢀ
1.75
A
2.ꢀ
1.5 dia
11.5
24.ꢀ
ꢀ.3
12ꢀ6Rx
Rxx
12.4
wwllyy
R
User direction of feed
6.4
8.4
16.ꢀ
A
Section A-A
Supplied in tape-and-reel packaging, 620 parts per reel, 13” diameter reel.
www.eaton.com/electronics
2
FP1206
Technical Data 4366
Effective June 2017
High frequency, high current power inductor
Temperature rise vs total loss
60
50
40
30
20
10
0
0
0.5
1
1.5
2
2.5
Total Los s (W)
Core loss vs Bp-p
500 300
kH z kH z
1
100
kHz
200
kHz
M Hz
10
1
0.1
0.01
0.001
0.0001
100
1000
10000
B
Gauss)
p-p
Inductance characteristics
% of OCL vs. % of Isat
1
100%
80%
60%
40%
20%
-40°C
+25°C
+125°C
0%
0%
20%
40%
60%
80%
100%
120%
140%
% of Isat
1
3
www.eaton.com/electronics
FP1206
Technical Data 4366
High frequency, high current power inductor
Effective June 2017
Solder Reflow Profile
TP
TTaabbllee 1 - SSttaannddaardd SnPPbb SSoolldeerr ((TT ))
cc
TC -5°C
tP
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
Volume
mm3
<350
235°C
220°C
Volume
mm3
Package
Thickness
<2.5mm
_
>350
TL
220°C
220°C
Preheat
A
t
_
>2.5mm
Tsmax
TTaabbllee 2 - LLeeaadd ((PPbb)) Frreee SSoolldeerr ((TT ))
cc
Volume
Volume
Volume
mm3
>2000
260°C
245°C
245°C
Tsmin
mm3
mm3
ts
Package
Thickness
<1.6mm
<350
260°C
1.6 – 2.5mm 260°C
>2.5mm 250°C
350 - 2000
260°C
250°C
245°C
25°C
Time 25°C to Peak
Time
Reference JDEC J-STD-020
Profile Feature
Preheat and Soak
Standard SnPb Solder Lead (Pb) Free Solder
100°C
• Temperature min. (T
)
150°C
smin
• Temperature max. (T
)
150°C
200°C
smax
) (t )
• Time (T
smin
to T
60-120 Seconds
3°C/ Second Max.
60-120 Seconds
3°C/ Second Max.
smax s
Average ramp up rate T
to T
smax
p
Liquidous temperature (T
Time at liquidous (t )
L
)
183°C
60-150 Seconds
217°C
60-150 Seconds
L
Peak package body temperature (T )*
Table 1
Table 2
P
Time (t )** within 5 °C of the specified classification temperature (T )
20 Seconds**
6°C/ Second Max.
6 Minutes Max.
30 Seconds**
6°C/ Second Max.
8 Minutes Max.
p
Average ramp-down rate (T to T
c
)
smax
p
Time 25°C to Peak Temperature
* Tolerance for peak profile temperature (T ) is defined as a supplier minimum and a user maximum.
p
** Tolerance for time at peak profile temperature (t ) is defined as a supplier minimum and a user maximum.
p
Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written
approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly
used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also
reserves the right to change or update, without notice, any technical information contained in this bulletin.
Eaton
Electronics Division
1000 Eaton Boulevard
Cleveland, OH 44122
United States
www.eaton.com/electronics
© 2017 Eaton
All Rights Reserved
Printed in USA
Eaton is a registered trademark.
All other trademarks are property
of their respective owners.
Publication No. 4366 BU-SB09349
June 2017
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