FP1208R1-R15-R [EATON]

High frequency, high current power inductors;


型号：	FP1208R1-R15-R
厂家：	Eaton All Rights Reserved.
描述：	High frequency, high current power inductors
文件：	总4页 (文件大小：540K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Effective June 2017

Supersedes August 2013

Technical Data 10148

FP1208

High frequency, high current power inductors

Applications

•

Multi-phase regulators

Voltage Regulator Modules (VRMs)

Desktop and server VRMs and EVRDs

Data networking and storage systems

Graphics cards and battery power systems

Point-of-Load modules

DCR Sensing circuits

Environmental data

Product features

•

Storage temperature range (component):

-40 °C to +125 °C

Operating temperature range: -40 °C to +125 °C

(ambient plus self-temperature rise)

Solder reflow temperature:

•

12.1x8.0x8.0mm maximum surface mount

package

•

Ferrite core material

Controlled DCR for sensing circuits

Inductance range from 150nH to 250nH

Current range from 44 to 85 Amps

Halogen free, lead free, RoHS compliant

J-STD-020 (latest revision) compliant

HALOGEN

FREE

FP1208

Technical Data 10148

Effective June 2017

High frequency, high current power inductors

Product Specifications

Part

OCL

FLL min.

(nH)

114

1⁴

2⁵

I 3⁶

sat

(Amps)

DCR

rms

sat

Number ⁸

(nH) 1ꢀ0

15ꢀ

(Amps)

(mΩ) @ 2ꢀ°C

K-factor

283

FP12ꢀ8R1-R15-R

FP12ꢀ8R1-R18-R

FP12ꢀ8R1-R21-R

FP12ꢀ8R1-R23-R

FP12ꢀ8R1-R25-R

18ꢀ

21ꢀ

23ꢀ

25ꢀ

137

16ꢀ

176

191

5ꢀ

ꢀ.29 50

283

1. Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.1V

, 0.0Adc@25°C

5. I 2: Peak current for approximately 20% rolloff @ 85°C

sat

6. I 3: Peak current for approximately 20% rolloff @ 125°C

sat

7. K-factor: Used to determine Bp-p for core loss (see graph). B = K * L

rms

, I

2. Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1V

3. I

rms sat

: DC current for an approximate temperature rise of 40°C without core loss. Derating is

p-p

rms

-3

necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of

other heat generating components will affect the temperature rise. It is recommended that the

temperature of the part not exceed 125°C under worst case operating conditions verified in

the end application.

* ∆I * 10 . B :(Gauss), K: (K-factor from table),L: (Inductance in nH),

p-p

∆I (Peak to peak ripple current in Amps).

8. Part Number Definition: FP1208Rx-Rxx-R:

- FP1208= Product code and size

- Rx= DCR indicator

4. I 1: Peak current for approximately 20% rolloff @ 25°C

sat

- Rxx= Inductance value in µH

- “-R” suffix = RoHS compliant

Dimensions- mm

DCR measured from point “a” to point “b”

Part marking: 1208Rx (Rx= DCR indicator), Rxx = Inductance value in uH (R= decimal point) wwllyy= date

code, r= revision level

Tolerances are +/- 0.15 millimeters unless stated otherwise.

PCB tolerances are +/- 0.10 millimeters unless stated otherwise.

All soldering surfaces to be be coplanar within 0.1 millimeters.

Packaging information - mm

Supplied in tape and reel packaging, 500 parts on a 13” diameter reel.

www.eaton.com/electronics

FP1208

Technical Data 10148

Effective June 2017

High frequency, high current power inductor

Temperature rise vs total loss

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

Total Loss (W)

Core loss vs Bp-p

0.1

0.01

0.001

100

1000

10000

p-p

(Gauss)

Inductance characteristics

% of OCL vs % of I _sat1

100%

80%

60%

40%

20%

-40°C

+25°C

+85°C

+125°C

20%

40%

60%

80%

100%

120%

140%

% of I_sat

www.eaton.com/electronics

FP1208

Technical Data 10148

High frequency, high current power inductor

Effective June 2017

Solder Reflow Profile

T_P

TTaabbllee 1 - SSttaannddaardd SnPPbb SSoolldeerr ((TT ))

T_C-5°C

t_P

Max. Ramp Up Rate = 3°C/s

Max. Ramp Down Rate = 6°C/s

Volume

mm³

<350

235°C

220°C

Volume

mm³

Package

Thickness

<2.5mm

>350

T_L

220°C

Preheat

>2.5mm

T_smax

TTaabbllee 2 - LLeeaadd ((PPbb)) Frreee SSoolldeerr ((TT ))

Volume

mm³

>2000

260°C

245°C

T_smin

mm³

t_s

Package

Thickness

<1.6mm

<350

260°C

1.6 – 2.5mm 260°C

>2.5mm 250°C

350 - 2000

260°C

250°C

245°C

25°C

Time 25°C to Peak

Time

Reference JDEC J-STD-020

Profile Feature

Preheat and Soak

Standard SnPb Solder Lead (Pb) Free Solder

100°C

• Temperature min. (T

)

150°C

smin

• Temperature max. (T

)

150°C

200°C

smax

) (t )

• Time (T

smin

to T

60-120 Seconds

3°C/ Second Max.

60-120 Seconds

3°C/ Second Max.

smax s

Average ramp up rate T

to T

smax

Liquidous temperature (T

Time at liquidous (t )

)

183°C

60-150 Seconds

217°C

60-150 Seconds

Peak package body temperature (T )*

Table 1

Table 2

Time (t )** within 5 °C of the specified classification temperature (T )

20 Seconds**

6°C/ Second Max.

6 Minutes Max.

30 Seconds**

6°C/ Second Max.

8 Minutes Max.

Average ramp-down rate (T to T

)

smax

Time 25°C to Peak Temperature

* Tolerance for peak profile temperature (T ) is defined as a supplier minimum and a user maximum.

** Tolerance for time at peak profile temperature (t ) is defined as a supplier minimum and a user maximum.

Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written

approval of an ofﬁcer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly

used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in signiﬁcant injury to the user.

Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also

reserves the right to change or update, without notice, any technical information contained in this bulletin.

Eaton

Electronics Division

1000 Eaton Boulevard

Cleveland, OH 44122

United States

www.eaton.com/electronics

Printed in USA

Eaton is a registered trademark.

All other trademarks are property

of their respective owners.

Publication No. 10148 BU-SB13927

June 2017

相关型号：