FP1308-R21-R [EATON]

High frequency, high current power inductors;


型号：	FP1308-R21-R
厂家：	Eaton All Rights Reserved.
描述：	High frequency, high current power inductors 功率感应器电感器
文件：	总4页 (文件大小：279K)
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Effective June 2017

Supersedes Sepetember 2011

Technical Data DS4313

FP1308

High frequency, high current power inductors

Applications

•

Voltage regulator modules (VRMs) for servers

and microprocessors

•

Multi-phase buck inductors

High frequency, high current switching power

supplies

SMD Device

Environmental data

•

Storage temperature range (component):

-40 °C to +125 °C

Operating temperature range: -40 °C to +125 °C

(ambient plus self-temperature rise)

Solder reflow temperature:

Product features

•

13.7 x 12.9 x 8.0mm surface mount package

High current handling capability, compact

footprint

•

Ferrite core material

J-STD-020 (latest revision) compliant

Inductance range from 0.110µH to 0.440µH

Current range from 32 to 120 amps

Frequency range up to 2MHz

HALOGEN

Halogen free, lead free, RoHS compliant

FREE

Product Specifications

Part

Number⁵

FP1308-R11-R

FP1308-R21-R

FP1308-R26-R

FP1308-R32-R

FP1308-R44-R

Rated

OCL¹

DCR (mΩ) @

K-factor⁴

rms

sat

Inductance (μH)

0.110

1ꢀ0 (μH)

0.110

0.210

0.260

0.320

(Amps)

120

25°C Typical

0.20

25°C Max

0.24

21.330

21.333

21.335

21.340

21.366

0.210

0.260

0.320

0.440

0.20

0.440

0.24

Open Circuit Inductance (OCL) Test Parameters: 100kHz, 1.0V , 0.0Adc

rms

K-factor: Used to determine B for core loss (see graph). B = K L ΔI. B (mT): (Gauss), K:

* *

p-p p-p p-p

(K-factor from table), L: (inductance in μH), ΔI (peak-to-peak ripple current in amps).

Part Number Definition: FP1308-xxx-R

• FP1308 = Product code and size

• xxx= Inductance value in μH, R = decimal point. If no “R” is present, then

third character = # of zeros.

: DC current for an approximate temperature rise of 40°C without core loss. Derating is

rms

necessary for AC currents. PCB pad layout, trace thickness and width, air-flow and proximity of

other heat generating components will affect the temperature rise. It is recommended the part

temperature not exceed 125°C under worst case operating conditions verified in the end

application.

• “-R” suffix = RoHS compliant

: Peak current for approximately 20% rolloff at +25°C.

sat

FP1308

Technical Data DS4313

High frequency, high current power inductors

Effective June 2017

Dimensions - mm

Schematic

Recommended Pad Layout

Front View

Bottom View

Top View

7.62

2.54 (2plcs)

12.95 max.

3.18

5.4

7.2

8.0

13.70 max.

FP1308X- XX

wwllyy R

Left View

8.0 max.

Part Marking: FP1308

xxx = Inductance value in μH. (R = Decimal point). If no “R” is present, then last character is # 0f zeros

wwllyy = Date code

R = Revision level

Packaging Information - mm

1.5 dia. +0.1/-0.0

4.0

1.5 diia. min

2.0

1.75

Section A-A

11.5

24.0 ±0.3

13.9

FP1308-XXX

wwllyy R

13.2

8.2

User direction of feed

Supplied in tape-and-reel packaging, 400 parts per reel, 13” diameter reel.

Temperature Rise vs. Total Loss

100

0.5

1.5

2.5

Total Loss (W)

www.eaton.com/electronics

Technical Data DS4313

FP1308

Effective June 2017

High frequency, high current power inductors

Core Loss

500kHz 100kHz

300kHz

Core Loss vs B

p-p

50kHz

1MHz

0.1

0.01

0.001

0.0001

100

1000

(mT)

p-p

Inductance Characteristics

OCL vs I

sat

120%

100%

80%

60%

40%

20%

-40 °C

+25 °C

+125 °C

20%

40%

60%

80%

100%

120%

140%

160%

% of I

sat

www.eaton.com/electronics

FP1308

Technical Data DS4313

High frequency, high current power inductors

Effective June 2017

Solder Reflow Profile

T_P

TTaabbllee 1 - SSttaannddaardd SnPPbb SSoolldeerr ((TT ))

T_C-5°C

t_P

Max. Ramp Up Rate = 3°C/s

Max. Ramp Down Rate = 6°C/s

Volume

mm³

<350

235°C

220°C

Volume

mm³

Package

Thickness

<2.5mm

>350

T_L

220°C

Preheat

>2.5mm

T_smax

TTaabbllee 2 - LLeeaadd ((PPbb)) Frreee SSoolldeerr ((TT ))

Volume

mm³

>2000

260°C

245°C

T_smin

mm³

t_s

Package

Thickness

<1.6mm

<350

260°C

1.6 – 2.5mm 260°C

>2.5mm 250°C

350 - 2000

260°C

250°C

245°C

25°C

Time 25°C to Peak

Time

Reference JDEC J-STD-020

Profile Feature

Preheat and Soak

Standard SnPb Solder Lead (Pb) Free Solder

100°C

• Temperature min. (T

)

150°C

smin

• Temperature max. (T

)

150°C

200°C

smax

) (t )

• Time (T

smin

to T

60-120 Seconds

3°C/ Second Max.

60-120 Seconds

3°C/ Second Max.

smax s

Average ramp up rate T

to T

smax

Liquidous temperature (T

Time at liquidous (t )

)

183°C

60-150 Seconds

217°C

60-150 Seconds

Peak package body temperature (T )*

Table 1

Table 2

Time (t )** within 5 °C of the specified classification temperature (T )

20 Seconds**

6°C/ Second Max.

6 Minutes Max.

30 Seconds**

6°C/ Second Max.

8 Minutes Max.

Average ramp-down rate (T to T

)

smax

Time 25°C to Peak Temperature

* Tolerance for peak profile temperature (T ) is defined as a supplier minimum and a user maximum.

** Tolerance for time at peak profile temperature (t ) is defined as a supplier minimum and a user maximum.

Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written

approval of an officer of the Compan . Life support systems are devices which support or sustain life, and whose failure to perform, when properly

used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant inju y to the user.

Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also

reserves the right to change or update, without notice, any technical information contained in this bulletin.

Eaton

Electronics Division

1000 Eaton Boulevard

Cleveland, OH 44122

United States

www.eaton.com/electronics

Printed in USA

Eaton is a registered trademark.

All other trademarks are property

of their respective owners.

Publication No. DS4313 BU-SB111090

June 2017

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