HC8LP [EATON]

Low profile, high current power inductors;


型号：	HC8LP
厂家：	Eaton All Rights Reserved.
描述：	Low profile, high current power inductors
文件：	总4页 (文件大小：417K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Effective October 2015

Supersedes March 2007

Technical Data 4126

HC8LP

Low proﬁle, high current power inductors

Applications

•

Multi-phase regulators

•

Voltage Regulator Modules (VRMs)

Distributed power systems DC-DC converters

Notebook and laptop regulators

Desktop and server VRMs and EVRDs

Point-of-Load (POL) modules

Battery power systems

High current power supplies

Data networking and storage systems

Environmental data

Product description

•

Storage temperature range (component):

•

Low profile surface mount inductors designed

-40°C to +155°C

for higher speed switch mode applications

requiring low voltage, and high current

•

Operating temperature range: -40°C to +155°C

(ambient plus self-temperature rise)

•

Design utilizes high temperature powder iron

•

Solder reflow temperature: J-STD-020D

material with a non-organic binder to eliminate

thermal aging

compliant

•

Inductance range from 0.17 uH to 47.9 uH

•

Current range from 1.7 to 56 Amps

•

Frequency range 1kHz to 500kHz

HC8LP

Technical Data 4126

Effective October 2015

Low proﬁle, high current power inductors

Product specifications

l_sat(amps)

DCR (mΩ)

maximum @ ±2°C

Volt-μSec⁵

(V-μs)

Part number⁶

HC8LP-R15-R

HC8LP-R39-R

HC8LP-R75-R

HC8LP-1R2-R

HC8LP-1R9-R

HC8LP-2R6-R

HC8LP-3R5-R

HC8LP-4R5-R

HC8LP-5R6-R

HC8LP-6R9-R

HC8LP-8R2-R

HC8LP-100-R

HC8LP-150-R

HC8LP-220-R

HC8LP-330-R

HC8LP-470-R

OCL¹(μH) ±±20

l_rms(amps)

150

320

rolloff

0.170

0.430

0.830

1.35

1.92

2.67

3.56

4.57

5.71

6.98

8.37

9.90

15.2

21.7

32.1

47.9

29.0

20.2

15.6

12.4

10.1

8.3

1.40

2.80

4.70

7.50

11.5

17.1

24.5

27.6

38.9

42.8

58.0

62.9

99.4

149

7.8

4.7

3.4

2.6

4.1

4.8

5.6

6.3

7.1

7.8

8.6

9.3

11.6

13.7

16.8

20.3

13.5

10.1

8.7

7.4

6.4

5.6

5.1

4.6

4.2

6.8

3.1

2.6

2.1

1.7

18.7

15.5

13.1

11.4

10.0

9.0

8.1

7.4

3.8

5.5

4.6

3.8

3.1

6.9

6.5

5.5

5.2

4.5

4.3

3.4

2.8

2.3

224

1.8

344

1. Open Circuit Inductance (OCL) Test Parameters: 100kHz, 1.0Vrms, 0.0Adc, @ +25°C

6. Part number deﬁnition: HC8LP-XXX-R

HC8LP = Product code and size

XXX = Inductance value in uH. R = Decimal point. If no R is present then last character equals

number of zeros

-R sufﬁx indicates RoHS compliant

2. Irms: DC current for an approximate DT of 40°C without core loss. Derating is necessary for AC currents.

PCB layout, trace thickness and width, air-ﬂow, and proximity of other heat generating components

will affect the temperature rise. It is recommended that the temperature of the part not exceed 155°C

under worst case operating conditions veriﬁed in the end application.

3. Peak current for approximately 15% rolloff @+20°C

4. Peak current for approximately 30% rolloff @+20°C

5. Applied Volt-Time product (V-μs) across the inductor. This value represents the applied V-μs at operating

frequency necessary to generate additional core loss which contributes to the 40°C temperature rise.

De-rating of the I_rmsis required to prevent excessive temperature rise. The 100% V-us rating is

equivalent to a ripple current Ip-p of 20% of Isat (30% rolloff option).

Dimensions–mm

TOP VIEW

SIDE VIEW

RECOMMENDED PAD LAYOUT

2.70

0 . 55

3.5 typ

2plcs

(2 x)

10.4

Max

10.9

Max

HC8LP-XXX

wwllyy R

3.0 typ

2plcs

4.0 typ

10.4

Max

FRONT VIEW

Dimesional Table

SCHEMATIC

FRONT VIEW

ref

max

R15

R39

R75

1R2

1R9

thru

470

2.1

3.5

3.3

Max

ref

2.7

3.5

3.95

2 plcs

ref

Part marking: HC8LP= (Product code and size)-xxx=(inductance value in uH, R= decimal point. If no R is present then last character equals

number of zeros. wwlyly=date code, R=revision level

Tolerances are 0.2 millimeters unless stated otherwise

All soldering surfaces to be coplanar within 0.1 millimeters

Do not route traces or vias underneath the inductor

www.eaton.com/elx

HC8LP

Technical Data 4126

Effective October 2015

Low proﬁle, high current power inductors

Packaging information–mm

Supplied in tape and reel packaging, 800 parts per reel

4.0

1.5 dia

+0.1/-0.0

2.0

1.5 dia

min

1.75

Ao=10.4 mm

Bo=11.2 mm

Ko=4.3 mm

11.5

24.0

HC8LP-XXX

wwllyy

+/-0.3

11.2

SECTION A-A

16.0

User direction of feed

Core loss

Irms DERATING WITH CORE LOSS

% Applied Volt-u Seconds

110

130

150

170

190

100kHz

200kHz

300kHz

400kHz

500kHz

100

Rolloff

OCL vs Isat

100

90 100 110 120 130 140 150 160 170 180 190 200 210 220

% of Isat

www.eaton.com/elx

HC8LP

Technical Data 4126

Effective October 2015

Low proﬁle, high current power inductors

Solder reflow profile

T_P

Table 1 - Standard SnPb Solder (T )

T_C-5°C

t_P

Volume

mm3

Volume

Max. Ramp Up Rate = 3°C/s

Max. Ramp Down Rate = 6°C/s

Package

mm3

Thickness

<352

≥352

T_L

<2.5mm)

235°C

220°C

Preheat

≥2.5mm

T_smax

Table 2 - Lead (Pb) Free Solder (T )

Volume

mm³

Package

mm³

T_smin

Thickness

<352

352 - ±222

>±222

t_s

<1.6mm

260°C

250°C

260°C

250°C

245°C

260°C

245°C

1.6 – 2.5mm

>2.5mm

25°C

Time 25°C to Peak

Time

Reference JDEC J-STD-020D

Profile Feature

Standard SnPb Solder

100°C

Lead (Pb) Free Solder

150°C

Preheat and Soak • Temperature min. (T

)

smin

• Temperature max. (T

)

150°C

200°C

smax

• Time (T

smin

to T

) (t )

smax

60-120 Seconds

3°C/ Second Max.

60-120 Seconds

3°C/ Second Max.

Average ramp up rate T

smax

to T

Liquidous temperature (Tl)

Time at liquidous (t )

183°C

60-150 Seconds

217°C

60-150 Seconds

Peak package body temperature (T )*

Table 1

Table 2

Time (t )** within 5 °C of the specified classification temperature (T )

20 Seconds**

6°C/ Second Max.

6 Minutes Max.

30 Seconds**

6°C/ Second Max.

8 Minutes Max.

Average ramp-down rate (T to T

)

smax

Time 25°C to Peak Temperature

* Tolerance for peak profile temperature (T ) is defined as a supplier minimum and a user maximum.

** Tolerance for time at peak profile temperature (t ) is defined as a supplier minimum and a user maximum.

Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written

approval of an ofﬁcer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly

used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in signiﬁcant injury to the user.

Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also

reserves the right to change or update, without notice, any technical information contained in this bulletin.

Eaton

Electronics Division

1000 Eaton Boulevard

Cleveland, OH 44122

United States

www.eaton.com/elx

Printed in USA

Eaton is a registered trademark.

Publication No. 4120

October 2015

All other trademarks are property

of their respective owners.

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