HCM1103-R36-R [EATON]

High current power inductors;


型号：	HCM1103-R36-R
厂家：	Eaton All Rights Reserved.
描述：	High current power inductors
文件：	总7页 (文件大小：2896K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Effective July 2017

Supersedes June 2012

Technical Data 4449

HCM1103

High current power inductors

Applications

•

Voltage Regulator Module (VRM)

Multi-phase regulators

Point-of-load modules

Desktop and server VRMs and EVRDs

Base station equipment

Notebook and laptop regulators

Battery power systems

Graphics cards

Data networking and storage systems

Product features

Environmental Data

•

11.5 x 10.3 x 3.0 mm maximum surface

mount package

•

Storage temperature range (Component):

-55 °C to +125 °C

•

Iron powder core material

•

Operating temperature range: -55 °C to +125 °C

(ambient plus self-temperature rise)

Magnetically shielded, low EMI

High current carrying capacity, low core losses

Inductance range from 0.12 µH to 22.0 µH

Current range from 3.0 A to 75 A

Solder reflow temperature:

J-STD-020 (latest revision) compliant

HALOGEN

Halogen free, lead free, RoHS compliant

FREE

HCM1103

High current power inductors

Technical Data 4449

Effective July 2017

Product Specifications

DCR (mΩ) @

+2ꢀ °C Typical

DCR (mΩ) @

+2ꢀ °C Maximum

ꢀ.61

Part

Number⁶

OCL¹

2ꢀ0 (µH)

ꢀ.12

ꢀ.36

ꢀ.47

ꢀ.68

1.ꢀ

2.2

3.3

4.7

8.2

FLL min.²

(µH)

ꢀ.ꢀ7

ꢀ.26

ꢀ.33

ꢀ.38

ꢀ.56

1.2

1.9

2.6

4.6

5.6

8.4

12.3

⁴@ +25 °C

(A)

rms

sat

(A)

3ꢀ

K-Factor⁵

12ꢀꢀ

711

HCM11ꢀ3-R12-R

HCM11ꢀ3-R36-R

HCM11ꢀ3-R47-R

HCM11ꢀ3-R68-R

HCM11ꢀ3-1Rꢀ-R

HCM11ꢀ3-2R2-R

HCM11ꢀ3-3R3-R

HCM11ꢀ3-4R7-R

HCM11ꢀ3-8R2-R

HCM11ꢀ3-1ꢀꢀ-R

HCM11ꢀ3-15ꢀ-R

HCM11ꢀ3-22ꢀ-R

ꢀ.55

1.1ꢀ

1.5ꢀ

2.9ꢀ

5.5ꢀ

8.4ꢀ

14.5

2ꢀ.5

35.ꢀ

4ꢀ.ꢀ

59.ꢀ

9ꢀ.ꢀ

2ꢀ

1.3ꢀ

2.ꢀꢀ

3.4ꢀ

6.ꢀꢀ

9.ꢀꢀ

16.ꢀ

22.5

38.5

515

51ꢀ

377

264

23ꢀ

2ꢀ5

153

141

9.ꢀ

7.ꢀ

5.ꢀ

4.ꢀ

3.ꢀ

8.5

7.5

6.ꢀ

5.ꢀ

1ꢀ.ꢀ

15.ꢀ

22.ꢀ

44.ꢀ

65.ꢀ

99.ꢀ

114

1. Open Circuit Inductance (OCL) Test Parameters: 1ꢀꢀ kHz, ꢀ.25 V_rms, ꢀ.ꢀ Adc @

+25 °C

4. I_sat: Peak current for approximately 3ꢀ0 rolloff at +25 °C

5. K-factor: Used to determine B_p-pfor core loss (see graph). B_p-p

= K * L * ∆I. B_p-p:(Gauss), K: (K-factor from table),

L: (Inductance in µH), ∆I (peak-to-peak ripple current in Amps).

6. Part Number Definition: HCM11ꢀ3-xxx-R

2. Full Load Inductance (FLL) Test Parameters: 1ꢀꢀ kHz, ꢀ.25 V_rms, I_sat@ +25 °C.

3. I_rms: DC current for an approximate temperature rise of 4ꢀ °C without core

loss. Derating is necessary for AC currents. PCB layout, trace thickness and

width, air-flow and proximity of other heat generating components will affect

the temperature rise. It is recommended that the temperature of the part not

exceed +125 °C under worst case operating conditions verified in the end

application.

HCM11ꢀ3 = Product code and size

xxx= Inductance value in µH, R = decimal point,

if no R is present then third character = number of zeros.

-R suffix = RoHS compliant

Dimensions (mm)

Top View

Side View

Bottom View

Recommended Pad Layout

Schematic

HCM1103-R36-R &

HCM1103-R47-R

HCM1103-R12-R &

HCM1103-R68-R to

HCM1103-220R

wlyy R

Part Marking: xxx = Inductance value in uH, R = decimal point, if no R is present then third character = # of zeros.

wlyy = (Date code), R = Revision Level

All soldering surfaces to be coplanar within 0.10 millimeters.

Tolerances are 0.3 millimeters unless stated otherwise.

HCM1103-R36-R and HCM1103-R47-R Color: Top Grey

HCM1103-R12-R and HCM1103-R68-R to HCM1103-220-R Color : Top Grey

Do not route traces or vias underneath the inductor

www.eaton.com/electronics

HCM1103

High current power inductors

Technical Data 4449

Effective July 2017

Packaging information (mm)

Supplied in tape and reel packaging, 1000 parts per 13” diameter reel.

wlyy R

Temperature rise vs. total loss

60.0

50.0

40.0

30.0

20.0

10.0

0.0

HCM1103-R12-R

HCM1103-R36-R

HCM1103-R47-R

HCM1103-R68-R

HCM1103-1R0-R

HCM1103-2R2-R

HCM1103-3R3-R

HCM1103-4R7-R

HCM1103-8R2-R

HCM1103-100-R

HCM1103-150-R

HCM1103-220-R

0.0

0.2

0.4

0.6

1.0

1.2

1.4

1.6

0.8

Total Loss (W)

www.eaton.com/electronics

HCM1103

High current power inductors

Technical Data 4449

Effective July 2017

Core loss vs. B

p-p

HCM1103-; R36-R and R47-R

10000

1000

100

300K

200K

100K

50K

25K

0.1

100

1000

10000

B_p-p(Gauss)

HCM1103-; R12-R, R68-R through 220-R

10000.0

1000.0

100.0

10.0

500K

300K

200K

100K

50K

25K

1.0

0.1

100

1000

10000

B_p-p(Gauss)

www.eaton.com/electronics

HCM1103

High current power inductors

Technical Data 4449

Effective July 2017

Inductance characteristics

HCM1103-; R36-R, R47-R

HCM1103-R12-R

110%

100%

90%

80%

70%

60%

50%

40%

30%

110%

100%

90%

80%

70%

60%

50%

40%

30%

HCM1103-R36-R

HCM1103-R47-R

I_dc(A)

HCM1103-; R68-R, 1R0-R

HCM1103-; 2R2-R, 3R3-R

110%

100%

90%

80%

70%

60%

50%

40%

30%

110%

100%

90%

80%

70%

60%

50%

40%

30%

HCM1103-R68-R

HCM1103-1R0-R

HCM1103-2R2-R

HCM1103-3R3-R

I_dc(A)

HCM1103-4R7-R

HCM1103-; 8R2-R, 100-R

110%

100%

90%

80%

70%

60%

50%

40%

30%

110%

100%

90%

80%

70%

60%

50%

40%

30%

HCM1103-8R2-R

HCM1103-100-R

I_dc(A)

www.eaton.com/electronics

HCM1103

High current power inductors

Technical Data 4449

Effective July 2017

Inductance characteristics

110%

100%

90%

80%

70%

60%

50%

HCM1103-150-R

40%

HCM1103-220-R

30%

I_dc(A)

www.eaton.com/electronics

HCM1103

High current power inductors

Technical Data 4449

Effective July 2017

Solder reflow profile

T_P

Table 1 - Standard SnPb Solder (T )

T_C-5°C

t_P

Volume

mm3

Volume

Max. Ramp Up Rate = 3°C/s

Max. Ramp Down Rate = 6°C/s

Package

mm3

Thickness

<350

≥350

T_L

<2.5mm)

235°C

220°C

Preheat

≥2.5mm

T_smax

Table 2 - Lead (Pb) Free Solder (T )

Volume

mm³

Package

mm³

T_smin

Thickness

<350

350 - 2000

>2000

t_s

<1.6mm

260°C

250°C

260°C

250°C

245°C

260°C

245°C

1.6 – 2.5mm

>2.5mm

25°C

Time 25°C to Peak

Time

Reference JDEC J-STD-020

Profile Feature

Standard SnPb Solder

100°C

Lead (Pb) Free Solder

150°C

Preheat and Soak • Temperature min. (T

smin

)

• Temperature max. (T

)

150°C

200°C

smax

• Time (T

smin

to T

) (t )

60-120 Seconds

3°C/ Second Max.

60-120 Seconds

3°C/ Second Max.

smax

Average ramp up rate T

to T

smax

Liquidous temperature (T^l)

183°C

60-150 Seconds

217°C

60-150 Seconds

Time at liquidous (t )

Peak package body temperature (T )*

Table 1

Table 2

Time (t )** within 5 °C of the specified classification temperature (T )

20 Seconds**

6°C/ Second Max.

6 Minutes Max.

30 Seconds**

6°C/ Second Max.

8 Minutes Max.

Average ramp-down rate (T to T

)

smax

Time 25°C to Peak Temperature

* Tolerance for peak profile temperature (T ) is defined as a supplier minimum and a user maximum.

** Tolerance for time at peak profile temperature (t ) is defined as a supplier minimum and a user maximum.

Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written

approval of an ofﬁcer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly

used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in signiﬁcant injury to the user.

Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also

reserves the right to change or update, without notice, any technical information contained in this bulletin.

Eaton

Electronics Division

1000 Eaton Boulevard

Cleveland, OH 44122

United States

www.eaton.com/electronics

Printed in USA

Eaton is a registered trademark.

Publication No. 4449 BU-SB12434

July 2017

All other trademarks are property

of their respective owners.

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