HCM1307-1R0-R [EATON]

High current power inductors;
HCM1307-1R0-R
型号: HCM1307-1R0-R
厂家: Eaton All Rights Reserved.    Eaton All Rights Reserved.
描述:

High current power inductors

电感器
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Technical Data 10433  
Effective September 2015  
HCM1307  
High current power inductors  
Applications  
Multi-phase regulators  
Voltage Regulator Modules (VRMs)  
Distributed power systems DC-DC converters  
Desktop and server VRMs and EVRDs  
Point-of-Load (POL) modules  
Field Programmable Gate Array  
(FPGA) DC-DC converters  
Battery power systems  
High current power supplies  
Data networking and storage systems  
Environmental Data  
Description  
Storage temperature range (Component):  
High current carrying capacity  
-55°C to +125°C  
Low core losses  
Operating temperature range: -55°C to +125°C  
(ambient + self-temperature rise)  
Magnetically shielded, low EMI  
Solder reflow temperature: J-STD-020D  
compliant  
Frequency range up to 1MHz  
Inductance range from 0.47μH to 3.3μH  
Current range from 15 to 63 amps  
HALOGEN  
14.2 x 13.0mm footprint surface mount  
package in a 6.5mm height  
HF  
Pb  
FREE  
Iron powder core material  
Halogen free, lead free, RoHS compliant  
HCM1307  
High current power inductors  
Technical Data 10433  
Effective September 2015  
Product Specifications  
3
4
OCL1  
(μH) ±±20  
FLL± (μH)  
minimum  
Irms  
Isat  
DCR (mΩ)  
typical @ +±2°C  
DCR (mΩ)  
maximum @ +±2°C  
Part Number6  
HCM1307-R47-R  
HCM1307-1R0-R  
HCM1307-3R3-R  
(amps)  
(amps)  
K-factor5  
192  
0.47  
1.0  
0.26  
0.56  
1.85  
38  
63  
1.0  
1.7  
4.3  
1.2  
2.0  
4.5  
29  
49  
111  
3.3  
15  
40  
88  
1. Open Circuit Inductance (OCL) Test Parameters: 100kHz, 1.0Vrms, 0.0Adc, @ +25°C  
2. Full Load Inductance (FLL) Test Parameters: 100kHz, 1.0Vrms, @ Isat, @ +25ºC  
3. Irms: DC current for an approximate temperature rise of 40°C without core loss. Derating is necessary for AC currents.  
PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the  
temperature rise. It is recommended that the temperature of the part not exceed 125°C under worst case operating  
conditions verified in the end application.  
4. Isat: Peak current for approximately 30% rolloff @ +25°C  
5. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ΔI. Bp-p: (Gauss), K: (K-factor from table), L:  
(Inductance in μH), ΔI (Peak to peak ripple current in Amps).  
6. Part Number Definition: HCM1307-xxx-R  
HCM1307 = Product code and size  
xxx= inductance value in μH, R= decimal point ,  
If no R is present then last character equals number of zeros  
-R suffix = RoHS compliant  
Dimensions (mm)  
Recommended Pad Layout  
Schematic  
13.2  
±1.±  
6.3  
±±.2  
2.5  
±±.3  
14.2±  
1
XXX  
wlyy R  
4.9  
12.5  
±±.5  
3.8  
±±.5  
2
8.±  
ref  
7.7  
3.25  
Part marking: XXX=Inductance value in uH, R= decimal point. If no R is present then last character equals number of zeros.  
wlyy=date code, R=revision level  
All soldering surfaces to be coplanar within 0.10 millimeters  
Tolerances are 0.3 millimeters unless stated otherwise  
Color: Grey  
Do not route traces or vias underneath the inductor  
www.eaton.com/elx  
2
HCM1307  
High current power inductors  
Technical Data 10433  
Effective September 2015  
Packaging information (mm)  
Supplied in tape and reel packaging, 400 parts per 13” diameter reel  
2.0  
4.0  
1.75  
1.5 dia  
11.5  
24.0  
0.3  
13.3  
1.5 dia  
20.0  
7.0  
4.5  
13.1  
User direction of feed  
Temperature rise vs. total loss  
60  
50  
40  
30  
20  
10  
0
HCM1307-R47-R  
HCM1307-1R0-R  
HCM1307-3R3-R  
0.0  
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
1.4  
1.6  
1.8  
2.0  
2.2  
Total Loss (W)  
www.eaton.com/elx  
3
HCM1307  
High current power inductors  
Technical Data 10433  
Effective September 2015  
Core loss vs. B  
p-p  
10.000  
1.000  
0.100  
0.010  
0.001  
500kHz  
300kHz  
200kHz  
1MHz  
100kHz  
50kHz  
25kHz  
100  
1000  
Bp-p (Gauss)  
10000  
Inductance characteristics  
HCM1307-R47-R  
HCM1307-1R0-R  
110%  
100%  
90%  
80%  
70%  
60%  
50%  
40%  
110%  
100%  
90%  
80%  
70%  
60%  
50%  
40%  
0
10  
20  
30  
40  
50  
60  
70  
80  
90  
0
5
10 15 20 25 30 35 40 45 50 55 60 65  
(Amps)  
(Amps)  
IDC  
IDC  
HCM1307-3R3-R  
110%  
100%  
90%  
80%  
70%  
60%  
50%  
40%  
0
5
10  
15  
20  
25  
30  
35  
40  
45  
(Amps)  
IDC  
www.eaton.com/elx  
4
HCM1307  
High current power inductors  
Technical Data 10433  
Effective September 2015  
Solder reflow profile  
TP  
Table 1 - Standard SnPb Solder (T )  
c
TC -5°C  
tP  
Volume  
mm3  
Volume  
Max. Ramp Up Rate = 3°C/s  
Max. Ramp Down Rate = 6°C/s  
Package  
mm3  
Thickness  
<352  
352  
TL  
<2.5mm)  
235°C  
220°C  
220°C  
220°C  
Preheat  
t
2.5mm  
Tsmax  
Table 2 - Lead (Pb) Free Solder (T )  
c
Volume  
Volume  
Volume  
mm3  
Package  
mm3  
mm3  
Tsmin  
Thickness  
<352  
352 - ±222  
>±222  
ts  
<1.6mm  
260°C  
260°C  
250°C  
260°C  
250°C  
245°C  
260°C  
245°C  
245°C  
1.6 – 2.5mm  
>2.5mm  
25°C  
Time 25°C to Peak  
Time  
Reference JDEC J-STD-020D  
Profile Feature  
Standard SnPb Solder  
100°C  
Lead (Pb) Free Solder  
150°C  
Preheat and Soak • Temperature min. (T  
)
smin  
• Temperature max. (T  
)
150°C  
200°C  
smax  
• Time (T  
smin  
to T  
) (t )  
smax  
60-120 Seconds  
3°C/ Second Max.  
60-120 Seconds  
3°C/ Second Max.  
s
Average ramp up rate T  
smax  
to T  
p
Liquidous temperature (Tl)  
Time at liquidous (t )  
183°C  
60-150 Seconds  
217°C  
60-150 Seconds  
L
Peak package body temperature (T )*  
Table 1  
Table 2  
P
Time (t )** within 5 °C of the specified classification temperature (T )  
20 Seconds**  
6°C/ Second Max.  
6 Minutes Max.  
30 Seconds**  
6°C/ Second Max.  
8 Minutes Max.  
p
c
Average ramp-down rate (T to T  
p
)
smax  
Time 25°C to Peak Temperature  
* Tolerance for peak profile temperature (T ) is defined as a supplier minimum and a user maximum.  
p
** Tolerance for time at peak profile temperature (t ) is defined as a supplier minimum and a user maximum.  
p
Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written  
approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly  
used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.  
Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also  
reserves the right to change or update, without notice, any technical information contained in this bulletin.  
Eaton  
Electronics Division  
1000 Eaton Boulevard  
Cleveland, OH 44122  
United States  
www.eaton.com/elx  
© 2015 Eaton  
All Rights Reserved  
Eaton is a registered trademark.  
Printed in USA  
Publication No. 10433 BU-MC15009  
September 2015  
All other trademarks are property  
of their respective owners.  

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