MP2A-4R7-R [EATON]

MICRO-PAC PLUSâ¢ Low profile toroid power inductors;


型号：	MP2A-4R7-R
厂家：	Eaton All Rights Reserved.
描述：	MICRO-PAC PLUSâ¢ Low profile toroid power inductors 测试功率感应器电感器
文件：	总4页 (文件大小：543K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Effective July 2017

Supersedes March 2007

Technical Data 4112

MP2A

MICRO-PAC PLUS™ Low profile toroid power inductors

Applications

•

Mobile phones

Tablets and e-readers

GPS systems

Battery power devices

Notebook and laptop power

Hand held devices

Media players

Environmental data

SMD Device

•

Storage temperature range (component):

-40 °C to +125 °C

Operating temperature range: -40 °C to +125 °C

(ambient plus self-temperature rise)

Solder reflow temperature:

Product features

•

High performance, low profile, surface

mount power inductors

•

Small footprint and closed magnetic field

construction ensure low EMI

J-STD-020 (latest revision) compliant

•

Low DCR and high efficiency

Frequency range up to 500 kHz

Molybdenum permalloy (MPP) core material

MP2A

Technical Data 4112

MICRO-PAC PLUS™ Low profile toroid power inductors

Effective July 2017

Product specifications

Part

Inductance

OCL⁽¹⁾

DCR⁽²⁾

typ.

Ω

I RMS⁽³⁾

(A)

I SAT⁽⁴⁾

(A)

Volt⁽⁵⁾

µsec

Number

µH

(rated)

0.47

0.68

1.00

1.50

2.20

3.30

4.70

µH±20%

MP2A-R47-R

MP2A-R68-R

MP2A-1R0-R

MP2A-1R5-R

MP2A-2R2-R

MP2A-3R3-R

MP2A-4R7-R

MP2A-6R8-R

MP2A-8R2-R

MP2A-100-R

MP2A-150-R

MP2A-220-R

MP2A-330-R

MP2A-470-R

MP2A-680-R

MP2A-820-R

MP2A-101-R

0.47

0.68

1.21

1.54

2.30

3.21

4.86

6.85

8.54

10.02

15.18

21.40

32.74

46.48

68.53

81.15

99.65

0.024

0.027

0.067

0.073

0.086

0.098

0.117

0.136

0.167

0.179

0.217

0.311

0.476

0.727

1.108

1.463

2.015

3.52

3.31

2.11

2.02

1.87

1.75

1.60

1.49

1.34

1.29

1.18

0.98

0.79

0.64

0.52

0.45

0.39

5.80

4.83

3.63

3.22

2.64

2.23

1.81

1.53

1.54

1.42

1.16

0.97

0.79

0.66

0.54

0.50

0.45

1.20

1.27

2.00

2.09

2.26

2.42

2.64

2.84

3.15

3.26

3.59

4.30

5.32

6.57

8.11

9.32

10.94

6.80

8.20

10.00

15.00

22.00

33.00

47.00

68.00

82.00

100.00

Notes: (1) Open Circuit Inductance Test Parameters: 100 kHz, .25 Vrms, 0.0 Adc.

(2) DCR limits +20 °C.

(4) Peak current for approximately 30% rolloff at +20 °C.

(5) Applied Volt-Time product (V-µs) across the inductor.This value

represents the applied V-µs at 300 kHz necessary to generate a core

loss equal to 10% of the total losses for 40 °C temperature rise.

(3) RMS current for an approximate ∆T of 40 °C without core loss. It is

recommended that the temperature of the part not exceed +125 °C.

Dimensions- mm

TOP VIEW

PCB PAD LAYOUT

SIDE VIEW

SCHEMATIC

1.05

5.2

MAX

7.5

MAX

YWW

XXX

5.40

7.50

5.88

1.8

MAX

2.00

yww = Date Code

xxx = Inductance value per family chart

Do not route traces or vias underneath the inductor

Packaging information- mm

Parts packaged on 13" Diameter reel,

3,900 parts per reel.

ACTUAL SIZE

MICRO-PAC PLUS

Ao=5.6mm

A1=2.3mm

Bo=8.5mm

B1=6.3mm

Ko=2.1mm

www.eaton.com/electronics

MP2A

Technical Data 4112

Effective July 2017

MICRO-PAC PLUS™ Low profile toroid power inductors

Core loss

RMS DERATING WITH CORE LOSS

KHz

00KHz

100KHz

50 60

80 100

200

300

400 500 600

800 1000

% of AppliedVolt-µ-seconds

Inductance characteristics

OCL vs. Isat

100%

90%

80%

70%

60%

50%

40%

30%

20%

10%

0% 10% 20% 30% 40% 50% 60% 70% 80% 90% 100% 110% 120% 130% 140% 150% 160%

% of I sat

www.eaton.com/electronics

MP2A

Technical Data 4112

MICRO-PAC PLUS™ Low profile toroid power inductors

Effective July 2017

Solder Reflow Profile

T_P

TTaabbllee 1 - SSttaannddaardd SnPPbb SSoolldeerr ((TT ))

T_C-5°C

t_P

Max. Ramp Up Rate = 3°C/s

Max. Ramp Down Rate = 6°C/s

Volume

mm³

<350

235°C

220°C

Volume

mm³

Package

Thickness

<2.5mm

>350

T_L

220°C

Preheat

>2.5mm

T_smax

TTaabbllee 2 - LLeeaadd ((PPbb)) Frreee SSoolldeerr ((TT ))

Volume

mm³

>2000

260°C

245°C

T_smin

mm³

t_s

Package

Thickness

<1.6mm

<350

260°C

1.6 – 2.5mm 260°C

>2.5mm 250°C

350 - 2000

260°C

250°C

245°C

25°C

Time 25°C to Peak

Time

Reference JDEC J-STD-020

Profile Feature

Preheat and Soak

Standard SnPb Solder Lead (Pb) Free Solder

100°C

• Temperature min. (T

)

150°C

smin

• Temperature max. (T

)

150°C

200°C

smax

) (t )

• Time (T

smin

to T

60-120 Seconds

3°C/ Second Max.

60-120 Seconds

3°C/ Second Max.

smax s

Average ramp up rate T

to T

smax

Liquidous temperature (T

Time at liquidous (t )

)

183°C

60-150 Seconds

217°C

60-150 Seconds

Peak package body temperature (T )*

Table 1

Table 2

Time (t )** within 5 °C of the specified classification temperature (T )

20 Seconds**

6°C/ Second Max.

6 Minutes Max.

30 Seconds**

6°C/ Second Max.

8 Minutes Max.

Average ramp-down rate (T to T

)

smax

Time 25°C to Peak Temperature

* Tolerance for peak profile temperature (T ) is defined as a supplier minimum and a user maximum.

** Tolerance for time at peak profile temperature (t ) is defined as a supplier minimum and a user maximum.

Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written

approval of an officer of the Compan . Life support systems are devices which support or sustain life, and whose failure to perform, when properly

used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant inju y to the user.

Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also

reserves the right to change or update, without notice, any technical information contained in this bulletin.

Eaton

Electronics Division

1000 Eaton Boulevard

Cleveland, OH 44122

United States

www.eaton.com/electronics

Printed in USA

Eaton is a registered trademark.

All other trademarks are property

of their respective owners.

Publication No. 4112

July 2017

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