SD3112-2R2-R [EATON]

Low profile metalized shielded drum core power inductors;
SD3112-2R2-R
型号: SD3112-2R2-R
厂家: Eaton All Rights Reserved.    Eaton All Rights Reserved.
描述:

Low profile metalized shielded drum core power inductors

测试 功率感应器 电感器
文件: 总4页 (文件大小:868K)
中文:  中文翻译
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Effective October 2017  
Supersedes March 2007  
Technical Data 4127  
SD3112  
Low profile metalized shielded drum core power inductors  
Applications  
Mobile phones  
Digital cameras  
Media players  
Small LCD displays  
LED driver and LED flash circuits  
Hard disk drives  
LCD Backlighting  
SMD Device  
Envirmental data  
Storage temature range (component):  
-40 °C to +125 °C  
Operating temperature range: -40 °C to +125 °C  
(ambient plus self-temperature rise)  
Solder reflow temperature:  
Product features  
3.1 mm x 3.1 mm x 1.2 mm shielded drum  
core  
Ferrite core material  
J-STD-02atest revision) compliant  
Inductance range from 1.0 uH to 220 uH  
Current range from 1.65 A to 0.113 A  
Frequency range up t4 MHz  
SD3112  
Technical Data 4127  
Effective October 2017  
Low profile metalized shielded drum core power inductors  
Product specifications  
Part Number  
Rated  
OCL (1)  
(µH)  
Part  
Irms (2)  
(A)  
Isat (3)  
(A)  
DCR ()  
typ. @  
+20 °C  
0.069  
0.099  
0.140  
0.165  
0.246  
0.291  
0.408  
0.446  
0.654  
0.953  
1.48  
1.85  
2.56  
2.93  
3.
6.01  
9.12  
K-factor  
(4)  
Inductance  
(µH)  
1.0  
Marking  
Designator  
SD3112-1R0-R  
SD3112-1R5-R  
SD3112-2R2-R  
SD3112-3R3-R  
SD3112-4R7-R  
SD3112-6R8-R  
SD3112-8R2-R  
SD3112-100-R  
SD3112-150-R  
SD3112-220-R  
SD3112-330-R  
SD3112-470-R  
SD3112-680-R  
SD3112-820-R  
SD3112-101-R  
SD3112-151-R  
SD3112-221-R  
1.11+/-30%  
1.70+/-30%  
2.41+/-30%  
3.24+/-30%  
4.72+/-30%  
6.47+/-30%  
8.50+/-30%  
10.01+/-30%  
15.28+/-20%  
21.66+/-20%  
33.30+/-20%  
47.44+/-20%  
68.10+/-20%  
83.19+/-20%  
99.8+/-20%  
149.4+/-20%  
219.9+/-20%  
A
B
C
D
E
F
G
H
I
J
K
L
M
N
O
P
Q
1.39  
1.16  
0.97  
0.90  
0.74  
0.68  
0.57  
0.55  
0.45  
1.65  
1.33  
1.12  
0.97  
0.80  
0.68  
0.60  
0.55  
0.44  
0.37  
0.30  
0.25  
0.211  
0.190  
0.174  
0.142  
0.117  
135  
110  
92  
79  
66  
56  
49  
45  
37  
31  
25  
21  
17  
16  
14  
12  
10  
1.5  
2.2  
3.3  
4.7  
6.8  
8.2  
10.0  
15.0  
22.0  
33.0  
47.0  
68.0  
82.0  
100.0  
150.0  
220.0  
0.37  
0.30  
0.270  
0.228  
0.213  
0.184  
0.149  
0.121  
(1) Open Circuit Inductance Test Parameters: 100 kHz, 0.1 V, 0.0 Adc.  
(3) Isat Amperes peak for approximately 30% rolloff (@+20 °C)  
(4) K-factor: Used to determine B p-p for core loss (see graph).  
B p-p = K*L*I, B p-p(mT), K: (K factor from table), L: (Inductance in uH),  
(Peak to peak ripple current in Ams).  
(2) Irms: DC current for an approximate DT of 40 °C without core loss. Derating is  
necessary for AC currents. PCB layout, trace thickness and width, air-flow, and  
proximity of other heat generating components will affect the temperature rise. It  
is recommended that the temperature of the part not exceed +125 °C under  
worst case operating conditions verified in the end application.  
Dimensions- mm  
Dimensions are in milimeters.  
Part Marking:  
3 Digit Marking: (1st digit: Indicats inductance value per letter in Part Marking Designator); (2nd digit: Bi-weekly production date code); (3rd digit: Last digit of the year produced).  
Do not route traces or vis underneath the inductor  
Packaging information- mm  
Parts packaged on 13" Diameter reel,  
4,100 parts per reel.  
www.eaton.com/electronics  
2
SD3110  
Technical Data 4137  
Effective October 2017  
Low profile metalized shielded drum core power inductors  
Temperature rise vs total loss loss  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
0
0.05  
0.1  
0.15  
0.2  
0.25  
0.3  
0.35  
0.4  
0.45  
Total Loss (W)  
Core loss vs Bp-p  
10  
1
1MHz  
500kHz  
300Hz  
200kHz  
0.1  
100kHz  
50kHz  
0.01  
0.001  
0.0001  
0.00001  
0.000001  
1
10  
100  
1000  
Bp-p (mT)  
Inductance characteristics  
120%  
110%  
100%  
90%  
80%  
70%  
60%  
50%  
40%  
30%  
20%  
10%  
-40°C  
25°C  
85°C  
0%  
0%  
10%  
20%  
30%  
40%  
50%  
60%  
70%  
80%  
90%  
100%  
110% 120% 130% 140%  
%
of IfssIaa tt  
3
www.eaton.com/electronics  
SD3112  
Technical Data 4127  
Low profile metalized shielded drum core power inductors  
Effective October 2017  
Solder Reflow Profile  
TP  
TTaabbllee 1 - SSttaannddaardd SnPPbb SSoolldeerr ((TT ))  
cc  
TC -5°C  
tP  
Max. Ramp Up Rate = 3°C/s  
Max. Ramp Down Rate = 6°C/s  
Volume  
mm3  
<350  
235°C  
220°C  
Volume  
mm3  
Package  
Thickness  
<2.5mm  
_
>350  
TL  
220°C  
220°C  
Preheat  
A
t
_
>2.5mm  
Tsmax  
TTaabbllee 2 - LLeeaadd ((PPbb)) Frreee SSoolldeerr ((TT ))  
cc  
Volume  
Volume  
Volume  
mm3  
>2000  
26C  
245°C  
245°C  
Tsmin  
mm3  
mm3  
ts  
Package  
Thickness  
<1.6mm  
<0  
26C  
1.6 – 2.5mm 26C  
>mm 250°C  
350 - 2000  
26C  
250°C  
245°C  
25°C  
Time 25°C to Peak  
Time  
Reference JDEC J-STD-020  
Profile Feature  
Preheat and Soak  
Stanard SnPb Solder Lead (Pb) Free Solder  
100°C  
• Temperature min. (T  
)
150°C  
smin  
• Temperature max. (T  
)
150°C  
200°C  
smax  
) (t )  
• Time (T  
smin  
to T  
60120 Seconds  
C/ Second Max.  
60-120 Seconds  
C/ Second Max.  
smax s  
Average ramp up rate T  
to T  
smax  
p
Liquidous temperature (T  
Time at liquidous (t )  
L
)
183°C  
60-150 Seconds  
217°C  
60-150 Seconds  
L
Peak package body temperature (T )*  
Table 1  
Table 2  
P
Time (t )** within 5 °C of the specifieclassification emperature (T )  
20 Seconds**  
6°C/ Second Max.  
6 Minutes Max.  
30 Seconds**  
6°C/ Second Max.  
8 Minutes Max.  
p
Average ramp-down rate (T to T  
c
)
smax  
p
Time 25°C Peak Temperature  
* Tolerance for peak pre temperature (T ) is defined as a supplier minimum and a user maximum.  
p
olerance for time at peak profile tmperature (t ) is defined as a supplier minimum and a user maximum.  
p
Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written  
approval of an officer of the Compan . Life support systems are devices which support or sustain life, and whose failure to perform, when properly  
used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant inju y to the user.  
Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also  
reserves the right to change or update, without notice, any technical information contained in this bulletin.  
Eaton  
Electronics Division  
1000 Eaton Boulevard  
Cleveland, OH 44122  
United States  
www.eaton.com/electronics  
© 2017 Eaton  
All Rights Reserved  
Printed in USA  
Eaton is a registered trademark.  
All other trademarks are property  
of their respective owners.  
Publication No. 4127  
October 2017  

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