SD8350-3R9-R [EATON]

Low profile shielded drum core power inductors;


型号：	SD8350-3R9-R
厂家：	Eaton All Rights Reserved.
描述：	Low profile shielded drum core power inductors 功率感应器电感器
文件：	总4页 (文件大小：594K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Effective August 2017

Supersedes September 2011

Technical Data 4146

SD8350

Low profile shielded drum core power inductors

Applications

•

Server power

Notebook and laptop power

High power LED driver, portable devices

Base station, telecom, and networking

Battery chargers, RAM power supply

Industrial and automotive power systems

Noise filtering output filter chokes

Buck/boost converters, output converters

Environmental data

Product features

•

Storage temperature range (component):

-40 °C to +125 °C

Operating temperature range: -40 °C to +125 °C

(ambient plus self-temperature rise)

Solder reflow temperature:

•

Low-profile surface mount inductor

9.5 mm x 8.3 mm x 4.5 mm shielded drum core

Ferrite core material

Inductance range from 1.5 µH to 100 µH

Current range from 0.8 A to 9.1 A

Frequency range up to 1 MHz

J-STD-020 (latest revision) compliant

HALOGEN

FREE

SD8350

Technical Data 4146

Low profile shielded drum core power inductors

Effective August 2017

Product specifications

Rated

Inductance (µH)

OCL¹

µH 3ꢀ0

1.5

3.2

4.2

DCR mΩ

@ +2ꢀ °C Typ

11.8

DCR mΩ

@ +2ꢀ °C Max

14.0

rms

sat

Part Number

(A)

K-factor⁴

16.0

9.6

8.5

7.6

6.3

5.3

4.4

3.5

SD8350-1R8-R

SD8350-3R9-R

SD8350-4R7-R

SD8350-6R8-R

SD8350-100-R

SD8350-150-R

SD8350-220-R

SD8350-330-R

SD8350-470-R

SD8350-680-R

SD8350-101-R

1.8

3.9

4.7

6.8

5.50

4.50

4.10

3.90

3.20

2.30

1.80

1.40

1.30

1.00

0.80

9.1

6.3

5.5

4.4

4.0

2.9

2.6

2.2

1.8

1.5

1.3

16.2

18.5

20.8

31.4

45.0

63.5

111.4

130.0

200.8

308.0

19.0

22.0

25.0

36.0

53.0

75.0

125.0

150.0

6.8

9.9

13.6

20.4

31.4

44.9

65.1

99.7

2.9

2.4

2.0

100

240.0

360.0

1. Open Circuit Inductance Test Parameters: 100 kHz, 0.1 Vrms, 0.0 Adc.

4. K-factor: Used to determine B for core loss (see graph).

p-p

2. I : DC current for an approximate ΔT of 40 °C without core loss. Derating is necessary for AC

= K*L*ΔI, B (mT), K: (K factor from table), L: (Inductance in µH), ΔI (Peak to

rms

p-p p-p

currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating

components will affect the temperature rise. It is recommended that the temperature of the part

not exceed +125 °C under worst case operating conditions verified in the end application.

peak ripple current in Amps).

5. Part Number Definition: SD8350-xxx-R

SD8350 = Product code and size; -xxx = Inductance value in µH;

R = decimal point; If no R is present, third character equals number of zeros.

-R suffix = RoHS compliant

3. I Amps peak for approximately 35% rolloff (@ +25 °C)

sat

Dimensions-mm

RECOMMENDED PCB LAYOUT

2.9

SCHEMATIC

FRONT VIEW

TOP VIEW

8.3 max.

BOTTOM VIEW

2.5

4.5 max.

1.2

1.8

6.3

9.5 max.

LEFT VIEW

5.7

XXX

wwlly R

wwlly - or - wwllyy = Date codeR= Revision level

Part Marking:

xxx = Inductance value in μH. (R = Decimal point). If no R is present, third character = number of zeros

Do not route traces or vias underneath the inductor

Packaging information-mm

Supplied in tape-and-reel packaging, 750 parts per reel, 13” diameter reel.

www.eaton.com/electronics

SD8350

Technical Data 4146

Effective August 2017

Low profile shielded drum core power inductors

Temperature rise vs total loss

140

120

100

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

Total Loss (W)

Core loss vs Bp-p

300kHz

1MHz 500kHz

200kHz

100kHz

0. 1

0. 01

0. 001

0.0001

100

1000

Bp-p (mT)

Inductance characteristics

OCL Vs. Isat

120%

100%

80%

60%

40%

20%

+85 Deg. C

+25 Deg. C

-40 Deg. C

20%

40%

60%

80%

100%

120%

140%

% Isat

www.eaton.com/electronics

SD8350

Technical Data 4146

Low profile shielded drum core power inductors

Effective August 2017

Solder Reflow Profile

T_P

TTaabbllee 1 - SSttaannddaardd SnPPbb SSoolldeerr ((TT ))

T_C-5°C

t_P

Max. Ramp Up Rate = 3°C/s

Max. Ramp Down Rate = 6°C/s

Volume

mm³

<350

235°C

220°C

Volume

mm³

Package

Thickness

<2.5mm

>350

T_L

220°C

Preheat

>2.5mm

T_smax

TTaabbllee 2 - LLeeaadd ((PPbb)) Frreee SSoolldeerr ((TT ))

Volume

mm³

>2000

260°C

245°C

T_smin

mm³

t_s

Package

Thickness

<1.6mm

<350

260°C

1.6 – 2.5mm 260°C

>2.5mm 250°C

350 - 2000

260°C

250°C

245°C

25°C

Time 25°C to Peak

Time

Reference JDEC J-STD-020

Profile Feature

Preheat and Soak

Standard SnPb Solder Lead (Pb) Free Solder

100°C

• Temperature min. (T

)

150°C

smin

• Temperature max. (T

)

150°C

200°C

smax

) (t )

• Time (T

smin

to T

60-120 Seconds

3°C/ Second Max.

60-120 Seconds

3°C/ Second Max.

smax

Average ramp up rate T

to T

smax

Liquidous temperature (T

Time at liquidous (t )

)

183°C

60-150 Seconds

217°C

60-150 Seconds

Peak package body temperature (T )*

Table 1

Table 2

Time (t )** within 5 °C of the specified classification temperature (T )

20 Seconds**

6°C/ Second Max.

6 Minutes Max.

30 Seconds**

6°C/ Second Max.

8 Minutes Max.

Average ramp-down rate (T to T

)

smax

Time 25°C to Peak Temperature

* Tolerance for peak profile temperature (T ) is defined as a supplier minimum and a user maximum.

** Tolerance for time at peak profile temperature (t ) is defined as a supplier minimum and a user maximum.

Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written

approval of an ofﬁcer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly

used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in signiﬁcant injury to the user.

Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also

reserves the right to change or update, without notice, any technical information contained in this bulletin.

Eaton

Electronics Division

1000 Eaton Boulevard

Cleveland, OH 44122

United States

www.eaton.com/electronics

Eaton is a registered trademark.

Printed in USA

All other trademarks are property

of their respective owners.

Publication No. 4146 BU-SB111111

August 2017

相关型号：