EB13C3J2H-8.000M TR [ECLIPTEK]

OSCILLATORS 25PPM -40+85 3.3V 4 8.000MHZ TS CMOS 5X7MM 4PAD SMD;


型号：	EB13C3J2H-8.000M TR
厂家：	Ecliptek
描述：	OSCILLATORS 25PPM -40+85 3.3V 4 8.000MHZ TS CMOS 5X7MM 4PAD SMD
文件：	总5页 (文件大小：167K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

RoHS

EB13C3J2H-8.000M

EB13C3 J 2 H -8.000M

Series

Nominal Frequency

RoHS Compliant (Pb-free) Low Current 3.3V 4 Pad

5mm x 7mm Ceramic SMD LVCMOS Oscillator

8.000MHz

Logic Control / Additional Output

Tri-State (High Impedance)

Frequency Tolerance/Stability

±25ppm over -40°C to +85°C

Duty Cycle

50 ±5(%)

ELECTRICAL SPECIFICATIONS

Nominal Frequency

8.000MHz

Frequency Tolerance/Stability

±25ppm over -40°C to +85°C (Inclusive of all conditions: Calibration Tolerance at 25°C, Frequency Stability

over the Operating Temperature Range, Supply Voltage Change, Ouput Load Change, First Year Aging at

25°C, Shock, and Vibration)

Supply Voltage

3.3Vdc ±10%

Input Current

2mA Maximum

Output Voltage Logic High (Voh)

Input Current Logic High (Ioh)

Output Voltage Logic Low (Vol)

Input Current Logic Low (Iol)

Rise/Fall Time

90% of Vdd Minimum

-1.6mA

10% of Vdd Maximum

+1.6mA

6nSec Maximum (Measured at 20% to 80% of waveform)

50 ±5(%) (Measured at 50% of waveform)

15pF Maximum

Duty Cycle

Load Drive Capability

Output Logic Type

CMOS

Logic Control / Additional Output

Tri-State Input Voltage (Vih and Vil)

Tri-State (High Impedance)

90% of Vdd Minimum or No Connect to Enable Output, 10% of Vdd Maximum to Disable Output (High

Impedance)

Standby Current

10µA Maximum (Disabled Output: High Impedance)

25pSec Maximum

One Sigma Clock Period Jitter

Start Up Time

10mSec Maximum

Storage Temperature Range

-55°C to +125°C

ENVIRONMENTAL & MECHANICAL SPECIFICATIONS

Fine Leak Test

MIL-STD-883, Method 1014, Condition A

MIL-STD-883, Method 1014, Condition C

MIL-STD-202, Method 213, Condition C

MIL-STD-202, Method 210

Gross Leak Test

Mechanical Shock

Resistance to Soldering Heat

Resistance to Solvents

Solderability

MIL-STD-202, Method 215

MIL-STD-883, Method 2003

Temperature Cycling

Vibration

MIL-STD-883, Method 1010

MIL-STD-883, Method 2007, Condition A

www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/16/2010 | Page 1 of 5

EB13C3J2H-8.000M

MECHANICAL DIMENSIONS (all dimensions in millimeters)

PIN CONNECTION

Tri-State

7.00

±0.15

5.08

±0.15

Ground

Output

Supply Voltage

MARKING

ORIENTATION

2.60

±0.15

5.00

±0.15

LINE MARKING

ECLIPTEK

8.000M

XXYZZ

1.2 ±0.2

XX=Ecliptek Manufacturing

Code

1.4 ±01

Y=Last Digit of the Year

ZZ=Week of the Year

3.68

±0.15

1.60 ±0.20

Suggested Solder Pad Layout

All Dimensions in Millimeters

2.0 (X4)

2.2 (X4)

Solder Land

(X4)

2.88

1.81

All Tolerances are ±0.1

www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/16/2010 | Page 2 of 5

EB13C3J2H-8.000M

OUTPUT WAVEFORM & TIMING DIAGRAM

VIH

VIL

VOH

80% of Waveform

OUTPUT DISABLE

(HIGH IMPEDANCE

STATE)

50% of Waveform

20% of Waveform

VOL

tPLZ

tPZL

Fall

Time

Rise

Time

Duty Cycle (%) = TW/T x 100

Test Circuit for CMOS Output

Frequency

Counter

Oscilloscope

Probe

(Note 2)

Supply

Voltage

(V_DD

)

Output

Current

Meter

Power

Supply

0.01µF

(Note 1)

Voltage

Meter

0.1µF

(Note 1)

C_L

(Note 3)

Ground

No Connect

or Tri-State

Note 1: An external 0.1µF low frequency tantalum bypass capacitor in parallel with a 0.01µF high frequency

ceramic bypass capacitor close to the package ground and V_DDpin is required.

Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth

(>300MHz) passive probe is recommended.

Note 3: Capacitance value C_Lincludes sum of all probe and fixture capacitance.

www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/16/2010 | Page 3 of 5

EB13C3J2H-8.000M

Recommended Solder Reflow Methods

Critical Zone

T_Lto T_P

T_P

Ramp-up

Ramp-down

T_L

T_SMax

T_SMin

t_L

t_P

t_SPreheat

t 25°C to Peak

Time (t)

High Temperature Infrared/Convection

TS MAX to TL (Ramp-up Rate)

3°C/second Maximum

Preheat

- Temperature Minimum (TS MIN)

- Temperature Typical (TS TYP)

- Temperature Maximum (TS MAX)

- Time (tS MIN)

150°C

175°C

200°C

60 - 180 Seconds

Ramp-up Rate (TL to TP)

3°C/second Maximum

Time Maintained Above:

- Temperature (TL)

- Time (tL)

217°C

60 - 150 Seconds

Peak Temperature (TP)

260°C Maximum for 10 Seconds Maximum

250°C +0/-5°C

Target Peak Temperature (TP Target)

Time within 5°C of actual peak (tp)

Ramp-down Rate

20 - 40 seconds

6°C/second Maximum

8 minutes Maximum

Level 1

Time 25°C to Peak Temperature (t)

Moisture Sensitivity Level

Additional Notes

Temperatures shown are applied to body of device.

www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/16/2010 | Page 4 of 5

EB13C3J2H-8.000M

Recommended Solder Reflow Methods

Critical Zone

T_Lto T_P

T_P

Ramp-up

Ramp-down

T_L

T_SMax

T_SMin

t_L

t_P

t_SPreheat

t 25°C to Peak

Time (t)

Low Temperature Infrared/Convection 240°C

TS MAX to TL (Ramp-up Rate)

5°C/second Maximum

Preheat

- Temperature Minimum (TS MIN)

- Temperature Typical (TS TYP)

- Temperature Maximum (TS MAX)

- Time (tS MIN)

N/A

150°C

N/A

60 - 120 Seconds

Ramp-up Rate (TL to TP)

5°C/second Maximum

Time Maintained Above:

- Temperature (TL)

- Time (tL)

150°C

200 Seconds Maximum

Peak Temperature (TP)

240°C Maximum

Target Peak Temperature (TP Target)

Time within 5°C of actual peak (tp)

Ramp-down Rate

240°C Maximum 1 Time / 230°C Maximum 2 Times

10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time

5°C/second Maximum

Time 25°C to Peak Temperature (t)

Moisture Sensitivity Level

Additional Notes

N/A

Level 1

Temperatures shown are applied to body of device.

Low Temperature Manual Soldering

185°C Maximum for 10 seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.)

High Temperature Manual Soldering

260°C Maximum for 5 seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.)

www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/16/2010 | Page 5 of 5

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