EC3145A-11.2896M [ECLIPTEK]
OSCILLATORS 50PPM 0+70 5.0V 4 11.2896MHZ CMOS 20% FULL 14PIN DIP;
| 型号： | EC3145A-11.2896M |
| 厂家： | 
Ecliptek |
| 描述： | OSCILLATORS 50PPM 0+70 5.0V 4 11.2896MHZ CMOS 20% FULL 14PIN DIP |
| 文件： | 总7页 (文件大小：183K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
RoHS
Pb
EC3145A-11.2896M
EC31 45
A
-11.2896M
Series
Nominal Frequency
RoHS Compliant (Pb-free) 5.0V 14 Pin DIP Metal
Thru-Hole HCMOS/TTL VCXO
11.2896MHz
Operating Temperature Range
Frequency Tolerance/Stability
±50ppm Maximum
0°C to +70°C
Linearity
Package
Duty Cycle
50 ±10(%)
20% Maximum
Frequency Deviation
±100ppm Minimum
ELECTRICAL SPECIFICATIONS
Nominal Frequency
11.2896MHz
Frequency Tolerance/Stability
±50ppm Maximum (Inclusive of all conditions: Calibration Tolerance at 25°C, Frequency Stability over the
Operating Temperature Range, Supply Voltage Change, Output Load Change, First Year Aging at 25°C,
Shock, and Vibration)
Aging at 25°C
±5ppm/year Maximum
Operating Temperature Range
Supply Voltage
0°C to +70°C
5.0Vdc ±5%
Input Current
20mA Maximum
Output Voltage Logic High (Voh)
Output Voltage Logic Low (Vol)
Rise/Fall Time
2.4Vdc Minimum with TTL Load, Vdd-0.5Vdc with HCMOS Load
0.4Vdc Maximum with TTL Load, 0.5Vdc Maximum with HCMOS Load
5nSec Maximum (0.4Vdc to 2.4Vdc w/TTL Load, 20% to 80% of waveform w/HCMOS Load)
Duty Cycle
50 ±10(%) (Measured at 1.4Vdc with TTL Load or at 50% of waveform with HCMOS Load)
Load Drive Capability
Output Logic Type
Control Voltage
10TTL Load or 15pF HCMOS Load Maximum
CMOS
2.5Vdc ±2.0Vdc
Frequency Deviation
Linearity
±100ppm Minimum
20% Maximum
Transfer Function
Positive Transfer Characteristic
±100pSec Maximum
±25pSec Maximum
10mSec Maximum
Absolute Clock Jitter
One Sigma Clock Period Jitter
Start Up Time
Storage Temperature Range
-55°C to +125°C
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
Fine Leak Test
MIL-STD-883, Method 1014, Condition A
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 2004
Gross Leak Test
Lead Integrity
Mechanical Shock
Resistance to Soldering Heat
Resistance to Solvents
Solderability
MIL-STD-202, Method 213, Condition C
MIL-STD-202, Method 210
MIL-STD-202, Method 215
MIL-STD-883, Method 2003
Temperature Cycling
Vibration
MIL-STD-883, Method 1010
MIL-STD-883, Method 2007, Condition A
www.ecliptek.com | Specification Subject to Change Without Notice | Rev Q 2/17/2010 | Page 1 of 7
EC3145A-11.2896M
MECHANICAL DIMENSIONS (all dimensions in millimeters)
PIN CONNECTION
15.240
±0.203
1
Control Voltage
Ground/Case Ground
Output
0.9 MAX
DIA 0.457
7
±0.100 (X4)
8
1
7
8
7.620
±0.203
14
Supply Voltage
14
LINE MARKING
1
2
ECLIPTEK
5.08 MIN
EC31
EC31=Product Series
5.08 MAX
3
4
11.289M
XXYZZ
MARKING
ORIENTATION
13.2
MAX
XX=Ecliptek Manufacturing
Code
Y=Last Digit of the Year
ZZ=Week of the Year
20.8 MAX
OUTPUT WAVEFORM
VOH
80% or 2.4VDC
50% or 1.4VDC
20% or 0.4VDC
VOL
Fall
Time
Rise
Time
TW
T
Duty Cycle (%) = TW/T x 100
www.ecliptek.com | Specification Subject to Change Without Notice | Rev Q 2/17/2010 | Page 2 of 7
EC3145A-11.2896M
Test Circuit for TTL Output
RL Value
(Ohms)
Output Load
Drive Capability
CL Value
(pF)
390
780
15
15
6
10TTL
5TTL
Frequency
Counter
Oscilloscope
1100
2000
2200
2TTL
15
3
10LSTTL
1TTL
Probe
(Note 2)
Table 1: RL Resistance Value and CL Capacitance
Value Vs. Output Load Drive Capability
Supply
Voltage
RL
(Note 4)
Output
(VDD
)
Current
Meter
0.1µF
(Note 1)
0.01µF
CL
(Note 3)
Power
Supply
Voltage
(Note 1)
Power
Supply
Ground
Meter
Note 5
Voltage
Control
Power
Supply
Voltage
Meter
Note 1: An external 0.1µF low frequency tantalum bypass capacitor in parallel with a 0.01µF high frequency
ceramic bypass capacitor close to the package ground and VDD pin is required.
Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth
(>300MHz) passive probe is recommended.
Note 3: Capacitance value CL includes sum of all probe and fixture capacitance.
Note 4: Resistance value RL is shown in Table 1. See applicable specification sheet for 'Load Drive Capability'.
Note 5: All diodes are MMBD7000, MMBD914, or equivalent.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev Q 2/17/2010 | Page 3 of 7
EC3145A-11.2896M
Test Circuit for CMOS Output
Frequency
Counter
Oscilloscope
Probe
(Note 2)
Supply
Voltage
(VDD
)
Output
Current
Meter
0.1µF
(Note 1)
0.01µF
(Note 1)
CL
(Note 3)
Power
Supply
Voltage
Meter
Ground
Voltage
Control
Power
Supply
Voltage
Meter
Note 1: An external 0.1µF low frequency tantalum bypass capacitor in parallel with a 0.01µF high frequency
ceramic bypass capacitor close to the package ground and VDD pin is required.
Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth
(>300MHz) passive probe is recommended.
Note 3: Capacitance value CL includes sum of all probe and fixture capacitance.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev Q 2/17/2010 | Page 4 of 7
EC3145A-11.2896M
Recommended Solder Reflow Methods
Critical Zone
TL to TP
TP
Ramp-up
Ramp-down
TL
TS Max
TS Min
tL
tP
tSPreheat
t 25°C to Peak
Time (t)
High Temperature Solder Bath (Wave Solder)
TS MAX to TL (Ramp-up Rate)
3°C/second Maximum
Preheat
- Temperature Minimum (TS MIN)
- Temperature Typical (TS TYP)
- Temperature Maximum (TS MAX)
- Time (tS MIN)
150°C
175°C
200°C
60 - 180 Seconds
Ramp-up Rate (TL to TP)
3°C/second Maximum
Time Maintained Above:
- Temperature (TL)
- Time (tL)
217°C
60 - 150 Seconds
Peak Temperature (TP)
260°C Maximum for 10 Seconds Maximum
250°C +0/-5°C
Target Peak Temperature (TP Target)
Time within 5°C of actual peak (tp)
Ramp-down Rate
20 - 40 seconds
6°C/second Maximum
8 minutes Maximum
Level 1
Temperatures shown are applied to back of PCB board and device leads
only. Do not use this method for product with the Gull Wing option.
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
Additional Notes
www.ecliptek.com | Specification Subject to Change Without Notice | Rev Q 2/17/2010 | Page 5 of 7
EC3145A-11.2896M
Recommended Solder Reflow Methods
Critical Zone
TL to TP
TP
Ramp-up
Ramp-down
TL
TS Max
TS Min
tL
tP
tSPreheat
t 25°C to Peak
Time (t)
Low Temperature Infrared/Convection 185°C
TS MAX to TL (Ramp-up Rate)
5°C/second Maximum
Preheat
- Temperature Minimum (TS MIN)
- Temperature Typical (TS TYP)
- Temperature Maximum (TS MAX)
- Time (tS MIN)
N/A
150°C
N/A
60 - 120 Seconds
Ramp-up Rate (TL to TP)
5°C/second Maximum
Time Maintained Above:
- Temperature (TL)
- Time (tL)
150°C
200 Seconds Maximum
Peak Temperature (TP)
185°C Maximum
185°C Maximum 2 Times
10 seconds Maximum 2 Times
5°C/second Maximum
N/A
Target Peak Temperature (TP Target)
Time within 5°C of actual peak (tp)
Ramp-down Rate
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
Additional Notes
Level 1
Temperatures shown are applied to body of device. Use this method only
for product with the Gull Wing option.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev Q 2/17/2010 | Page 6 of 7
EC3145A-11.2896M
Recommended Solder Reflow Methods
Critical Zone
TL to TP
TP
Ramp-up
Ramp-down
TL
TS Max
TS Min
tL
tP
tSPreheat
t 25°C to Peak
Time (t)
Low Temperature Solder Bath (Wave Solder)
TS MAX to TL (Ramp-up Rate)
5°C/second Maximum
Preheat
- Temperature Minimum (TS MIN)
- Temperature Typical (TS TYP)
- Temperature Maximum (TS MAX)
- Time (tS MIN)
N/A
150°C
N/A
30 - 60 Seconds
Ramp-up Rate (TL to TP)
5°C/second Maximum
Time Maintained Above:
- Temperature (TL)
- Time (tL)
150°C
200 Seconds Maximum
Peak Temperature (TP)
245°C Maximum
Target Peak Temperature (TP Target)
Time within 5°C of actual peak (tp)
Ramp-down Rate
245°C Maximum 1 Time / 235°C Maximum 2 Times
5 seconds Maximum 1 Time / 15 seconds Maximum 2 Times
5°C/second Maximum
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
Additional Notes
N/A
Level 1
Temperatures shown are applied to back of PCB board and device leads
only. Do not use this method for product with the Gull Wing option.
Low Temperature Manual Soldering
185°C Maximum for 10 seconds Maximum, 2 times Maximum. (Temperatures listed are applied to device leads only.
This method can be utilized with both Gull Wing and Non-Gull Wing devices.)
High Temperature Manual Soldering
260°C Maximum for 5 seconds Maximum, 2 times Maximum. (Temperatures listed are applied to device leads only. This
method can be utilized with both Gull Wing and Non-Gull Wing devices.)
www.ecliptek.com | Specification Subject to Change Without Notice | Rev Q 2/17/2010 | Page 7 of 7
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