ECM2A5F1A10-40.000M [ECLIPTEK]

QUARTZ CRYSTAL RESONATOR, 40 MHz, ROHS COMPLIANT, CERAMIC, SMD, 4 PIN;
ECM2A5F1A10-40.000M
型号: ECM2A5F1A10-40.000M
厂家: Ecliptek    Ecliptek
描述:

QUARTZ CRYSTAL RESONATOR, 40 MHz, ROHS COMPLIANT, CERAMIC, SMD, 4 PIN

驱动 晶体 谐振器
文件: 总4页 (文件大小:121K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
RoHS  
Pb  
ECM2A5F1A10-40.000M  
ECM2A 5 F 1 A 10 -40.000M  
Series  
Nominal Frequency  
40.000MHz  
RoHS Compliant (Pb-free) 2.0mm x 2.5mm 4 Pad  
Ceramic SMD Crystal  
Load Capacitance  
10pF Parallel Resonant  
Frequency Tolerance  
±10ppm Maximum  
Mode of Operation  
AT-Cut Fundamental  
Frequency Stability  
±10ppm Maximum  
Operating Temperature Range  
0°C to +70°C  
ELECTRICAL SPECIFICATIONS  
Nominal Frequency  
Frequency Tolerance  
Frequency Stability  
Aging at 25°C  
40.000MHz  
±10ppm Maximum  
±10ppm Maximum  
±3ppm/year Maximum  
0°C to +70°C  
Operating Temperature Range  
Load Capacitance  
10pF Parallel Resonant  
5pF Maximum  
Shunt Capacitance (C0)  
Equivalent Series Resistance  
Mode of Operation  
50 Ohms Maximum  
AT-Cut Fundamental  
100µWatts Maximum  
Drive Level  
Spurious Response  
Storage Temperature Range  
Insulation Resistance  
-3dB Minimum; Fo to Fo +5000ppm  
-40°C to +90°C  
500 Megaohms Minimum at 100Vdc  
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS  
ESD Susceptibility  
MIL-STD-883, Method 3015, Class 1, HBM: 1500V  
MIL-STD-883, Method 1014, Condition A  
UL94-V0  
Fine Leak Test  
Flammability  
Gross Leak Test  
Mechanical Shock  
Moisture Resistance  
Moisture Sensitivity  
Resistance to Soldering Heat  
Resistance to Solvents  
Solderability  
MIL-STD-883, Method 1014, Condition C  
MIL-STD-883, Method 2002, Condition B  
MIL-STD-883, Method 1004  
J-STD-020, MSL 1  
MIL-STD-202, Method 210, Condition K  
MIL-STD-202, Method 215  
MIL-STD-883, Method 2003  
Temperature Cycling  
Vibration  
MIL-STD-883, Method 1010, Condition B  
MIL-STD-883, Method 2007, Condition A  
www.ecliptek.com | Specification Subject to Change Without Notice | Rev B 3/11/2011 | Page 1 of 4  
ECM2A5F1A10-40.000M  
MECHANICAL DIMENSIONS (all dimensions in millimeters)  
PIN CONNECTION  
1
2
3
4
Crystal  
Cover/Ground  
Crystal  
2.00  
0.65 ±0.10  
±0.10  
0.775  
±0.100  
(X4)  
Cover/Ground  
1
2
4
3
LINE MARKING  
1
2
40.0  
0.95  
±0.10  
2.50  
±0.10  
YZZ  
Y=Last Digit of Year  
ZZ=Week of the Year  
0.675 ±0.100  
(X4)  
0.55 MAX  
Suggested Solder Pad Layout  
All Dimensions in Millimeters  
1.0 (X4)  
1.2 (X4)  
Solder Land  
(X4)  
0.5  
0.3  
All Tolerances are ±0.1  
www.ecliptek.com | Specification Subject to Change Without Notice | Rev B 3/11/2011 | Page 2 of 4  
ECM2A5F1A10-40.000M  
Recommended Solder Reflow Methods  
Critical Zone  
TL to TP  
TP  
Ramp-up  
Ramp-down  
TL  
TS Max  
TS Min  
tL  
tP  
tSPreheat  
t 25°C to Peak  
Time (t)  
High Temperature Infrared/Convection  
TS MAX to TL (Ramp-up Rate)  
3°C/second Maximum  
Preheat  
- Temperature Minimum (TS MIN)  
- Temperature Typical (TS TYP)  
- Temperature Maximum (TS MAX)  
- Time (tS MIN)  
150°C  
175°C  
200°C  
60 - 180 Seconds  
Ramp-up Rate (TL to TP)  
3°C/second Maximum  
Time Maintained Above:  
- Temperature (TL)  
- Time (tL)  
217°C  
60 - 150 Seconds  
Peak Temperature (TP)  
260°C Maximum for 10 Seconds Maximum  
250°C +0/-5°C  
Target Peak Temperature (TP Target)  
Time within 5°C of actual peak (tp)  
Ramp-down Rate  
20 - 40 seconds  
6°C/second Maximum  
8 minutes Maximum  
Level 1  
Time 25°C to Peak Temperature (t)  
Moisture Sensitivity Level  
www.ecliptek.com | Specification Subject to Change Without Notice | Rev B 3/11/2011 | Page 3 of 4  
ECM2A5F1A10-40.000M  
Recommended Solder Reflow Methods  
Critical Zone  
TL to TP  
TP  
Ramp-up  
Ramp-down  
TL  
TS Max  
TS Min  
tL  
tP  
tSPreheat  
t 25°C to Peak  
Time (t)  
Low Temperature Infrared/Convection 240°C  
TS MAX to TL (Ramp-up Rate)  
5°C/second Maximum  
Preheat  
- Temperature Minimum (TS MIN)  
- Temperature Typical (TS TYP)  
- Temperature Maximum (TS MAX)  
- Time (tS MIN)  
N/A  
150°C  
N/A  
60 - 120 Seconds  
Ramp-up Rate (TL to TP)  
5°C/second Maximum  
Time Maintained Above:  
- Temperature (TL)  
- Time (tL)  
150°C  
200 Seconds Maximum  
Peak Temperature (TP)  
240°C Maximum  
Target Peak Temperature (TP Target)  
Time within 5°C of actual peak (tp)  
Ramp-down Rate  
240°C Maximum 1 Time / 230°C Maximum 2 Times  
10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time  
5°C/second Maximum  
Time 25°C to Peak Temperature (t)  
Moisture Sensitivity Level  
N/A  
Level 1  
Low Temperature Manual Soldering  
185°C Maximum for 10 seconds Maximum, 2 times Maximum.  
High Temperature Manual Soldering  
260°C Maximum for 5 seconds Maximum, 2 times Maximum.  
www.ecliptek.com | Specification Subject to Change Without Notice | Rev B 3/11/2011 | Page 4 of 4  

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