ECM2A5F1A12-40.000MTR [ECLIPTEK]

QUARTZ CRYSTAL RESONATOR, 40 MHz, ROHS COMPLIANT, CERAMIC, SMD, 4 PIN;


型号：	ECM2A5F1A12-40.000MTR
厂家：	Ecliptek
描述：	QUARTZ CRYSTAL RESONATOR, 40 MHz, ROHS COMPLIANT, CERAMIC, SMD, 4 PIN 驱动晶体谐振器
文件：	总5页 (文件大小：154K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

RoHS

ECM2A5F1A12-40.000M TR

ECM2A 5 F 1 A 12 -40.000M TR

Series

Packaging Options

RoHS Compliant (Pb-free) 2.0mm x 2.5mm 4 Pad

Ceramic SMD Crystal

Tape & Reel

Nominal Frequency

Frequency Tolerance

±10ppm Maximum

40.000MHz

Load Capacitance

12pF Parallel Resonant

Frequency Stability

±10ppm Maximum

Mode of Operation

AT-Cut Fundamental

Operating Temperature Range

0°C to +70°C

ELECTRICAL SPECIFICATIONS

Nominal Frequency

Frequency Tolerance

Frequency Stability

Aging at 25°C

40.000MHz

±10ppm Maximum

±3ppm/year Maximum

0°C to +70°C

Operating Temperature Range

Load Capacitance

12pF Parallel Resonant

5pF Maximum

Shunt Capacitance (C0)

Equivalent Series Resistance

Mode of Operation

50 Ohms Maximum

AT-Cut Fundamental

100µWatts Maximum

Drive Level

Spurious Response

Storage Temperature Range

Insulation Resistance

-3dB Minimum; Fo to Fo +5000ppm

-40°C to +90°C

500 Megaohms Minimum at 100Vdc

ENVIRONMENTAL & MECHANICAL SPECIFICATIONS

ESD Susceptibility

MIL-STD-883, Method 3015, Class 1, HBM: 1500V

MIL-STD-883, Method 1014, Condition A

UL94-V0

Fine Leak Test

Flammability

Gross Leak Test

Mechanical Shock

Moisture Resistance

Moisture Sensitivity

Resistance to Soldering Heat

Resistance to Solvents

Solderability

MIL-STD-883, Method 1014, Condition C

MIL-STD-883, Method 2002, Condition B

MIL-STD-883, Method 1004

J-STD-020, MSL 1

MIL-STD-202, Method 210, Condition K

MIL-STD-202, Method 215

MIL-STD-883, Method 2003

Temperature Cycling

Vibration

MIL-STD-883, Method 1010, Condition B

MIL-STD-883, Method 2007, Condition A

www.ecliptek.com | Specification Subject to Change Without Notice | Rev B 3/11/2011 | Page 1 of 5

ECM2A5F1A12-40.000M TR

MECHANICAL DIMENSIONS (all dimensions in millimeters)

PIN CONNECTION

Crystal

Cover/Ground

Crystal

2.00

0.65 ±0.10

±0.10

0.775

±0.100

(X4)

Cover/Ground

LINE MARKING

40.0

0.95

±0.10

2.50

±0.10

YZZ

Y=Last Digit of Year

ZZ=Week of the Year

0.675 ±0.100

(X4)

0.55 MAX

Suggested Solder Pad Layout

All Dimensions in Millimeters

1.0 (X4)

1.2 (X4)

Solder Land

(X4)

0.5

0.3

All Tolerances are ±0.1

www.ecliptek.com | Specification Subject to Change Without Notice | Rev B 3/11/2011 | Page 2 of 5

ECM2A5F1A12-40.000M TR

Tape & Reel Dimensions

Quantity Per Reel: 1000 Units

4.00 ±0.10

2.00 ±0.10

DIA 1.50 ±0.10

0.25 ±0.05

3.50 ±0.10

8.00 ±0.20

4.50 ±0.10

2.80

±0.10

4.00 ±0.10

2.30 ±0.10

1.00 ±0.10

14.4 MAX

*Compliant to EIA 481A

1.5 MIN

DIA 40 MIN

Access Hole at

Slot Location

330 MAX

DIA 50 MIN

2.5 MIN Width

10.0 MIN Depth

Tape slot in Core

for Tape Start

DIA 20.2 MIN

DIA 13.0 ±0.2

8.4 +1.5/-0.0

www.ecliptek.com | Specification Subject to Change Without Notice | Rev B 3/11/2011 | Page 3 of 5

ECM2A5F1A12-40.000M TR

Recommended Solder Reflow Methods

Critical Zone

T_Lto T_P

T_P

Ramp-up

Ramp-down

T_L

T_SMax

T_SMin

t_L

t_P

t_SPreheat

t 25°C to Peak

Time (t)

High Temperature Infrared/Convection

TS MAX to TL (Ramp-up Rate)

3°C/second Maximum

Preheat

- Temperature Minimum (TS MIN)

- Temperature Typical (TS TYP)

- Temperature Maximum (TS MAX)

- Time (tS MIN)

150°C

175°C

200°C

60 - 180 Seconds

Ramp-up Rate (TL to TP)

3°C/second Maximum

Time Maintained Above:

- Temperature (TL)

- Time (tL)

217°C

60 - 150 Seconds

Peak Temperature (TP)

260°C Maximum for 10 Seconds Maximum

250°C +0/-5°C

Target Peak Temperature (TP Target)

Time within 5°C of actual peak (tp)

Ramp-down Rate

20 - 40 seconds

6°C/second Maximum

8 minutes Maximum

Level 1

Time 25°C to Peak Temperature (t)

Moisture Sensitivity Level

www.ecliptek.com | Specification Subject to Change Without Notice | Rev B 3/11/2011 | Page 4 of 5

ECM2A5F1A12-40.000M TR

Recommended Solder Reflow Methods

Critical Zone

T_Lto T_P

T_P

Ramp-up

Ramp-down

T_L

T_SMax

T_SMin

t_L

t_P

t_SPreheat

t 25°C to Peak

Time (t)

Low Temperature Infrared/Convection 240°C

TS MAX to TL (Ramp-up Rate)

5°C/second Maximum

Preheat

- Temperature Minimum (TS MIN)

- Temperature Typical (TS TYP)

- Temperature Maximum (TS MAX)

- Time (tS MIN)

N/A

150°C

N/A

60 - 120 Seconds

Ramp-up Rate (TL to TP)

5°C/second Maximum

Time Maintained Above:

- Temperature (TL)

- Time (tL)

150°C

200 Seconds Maximum

Peak Temperature (TP)

240°C Maximum

Target Peak Temperature (TP Target)

Time within 5°C of actual peak (tp)

Ramp-down Rate

240°C Maximum 1 Time / 230°C Maximum 2 Times

10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time

5°C/second Maximum

Time 25°C to Peak Temperature (t)

Moisture Sensitivity Level

N/A

Level 1

Low Temperature Manual Soldering

185°C Maximum for 10 seconds Maximum, 2 times Maximum.

High Temperature Manual Soldering

260°C Maximum for 5 seconds Maximum, 2 times Maximum.

www.ecliptek.com | Specification Subject to Change Without Notice | Rev B 3/11/2011 | Page 5 of 5

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