ECX-5865-70.656M [ECLIPTEK]

CRYSTALS 15/30 0+70 18PF 70.656MHZ AT CUT THIRD UM-1;


型号：	ECX-5865-70.656M
厂家：	Ecliptek
描述：	CRYSTALS 15/30 0+70 18PF 70.656MHZ AT CUT THIRD UM-1
文件：	总3页 (文件大小：67K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

RoHS

ECX-5865-70.656M

PLEASE NOTE: Due to the inherent proprietary nature of custom part numbers, certain parameters

are intentionally excluded from this specification sheet.

ECX-5865 -70.656M

Series

Nominal Frequency

Ecliptek Custom Crystal

70.656MHz

ELECTRICAL SPECIFICATIONS

Nominal Frequency

70.656MHz

ENVIRONMENTAL & MECHANICAL SPECIFICATIONS

Fine Leak Test

MIL-STD-883, Method 1014 Condition A

MIL-STD-883, Method 1014 Condition C

MIL-STD-883, Method 2004

Gross Leak Test

Lead Integrity

Mechanical Shock

Resistance to Soldering Heat

Resistance to Solvents

Solderability

MIL-STD-202, Method 213 Condition C

MIL-STD-202, Method 210

MIL-STD-202, Method 215

MIL-STD-883, Method 2003

Temperature Cycling

Vibration

MIL-STD-883, Method 1010

MIL-STD-883, Method 2007 Condition A

MECHANICAL DIMENSIONS (all dimensions in millimeters)

LINE MARKING

ECX

5865

12.70

MIN

DIA 0.35

±0.05 (X2)

7.9

±0.2

3.75 ±0.20

3.2 ±0.3

8.1

MAX

www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/16/2010 | Page 1 of 3

ECX-5865-70.656M

Recommended Solder Reflow Methods

Critical Zone

T_Lto T_P

T_P

Ramp-up

Ramp-down

T_L

T_SMax

T_SMin

t_L

t_P

t_SPreheat

t 25°C to Peak

Time (t)

High Temperature Solder Bath (Wave Solder)

TS MAX to TL (Ramp-up Rate)

3°C/second Maximum

Preheat

- Temperature Minimum (TS MIN)

- Temperature Typical (TS TYP)

- Temperature Maximum (TS MAX)

- Time (tS MIN)

150°C

175°C

200°C

60 - 180 Seconds

Ramp-up Rate (TL to TP)

3°C/second Maximum

Time Maintained Above:

- Temperature (TL)

- Time (tL)

217°C

60 - 150 Seconds

Peak Temperature (TP)

260°C Maximum for 10 Seconds Maximum

250°C +0/-5°C

Target Peak Temperature (TP Target)

Time within 5°C of actual peak (tp)

Ramp-down Rate

20 - 40 seconds

6°C/second Maximum

8 minutes Maximum

Level 1

Time 25°C to Peak Temperature (t)

Moisture Sensitivity Level

www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/16/2010 | Page 2 of 3

ECX-5865-70.656M

Recommended Solder Reflow Methods

Critical Zone

T_Lto T_P

T_P

Ramp-up

Ramp-down

T_L

T_SMax

T_SMin

t_L

t_P

t_SPreheat

t 25°C to Peak

Time (t)

Low Temperature Solder Bath (Wave Solder)

TS MAX to TL (Ramp-up Rate)

5°C/second Maximum

Preheat

- Temperature Minimum (TS MIN)

- Temperature Typical (TS TYP)

- Temperature Maximum (TS MAX)

- Time (tS MIN)

N/A

150°C

N/A

30 - 60 Seconds

Ramp-up Rate (TL to TP)

5°C/second Maximum

Time Maintained Above:

- Temperature (TL)

- Time (tL)

150°C

200 Seconds Maximum

Peak Temperature (TP)

245°C Maximum

Target Peak Temperature (TP Target)

Time within 5°C of actual peak (tp)

Ramp-down Rate

245°C Maximum 1 Time / 235°C Maximum 2 Times

5 seconds Maximum 1 Time / 15 seconds Maximum 2 Times

5°C/second Maximum

Time 25°C to Peak Temperature (t)

Moisture Sensitivity Level

N/A

Level 1

Low Temperature Manual Soldering

185°C Maximum for 10 seconds Maximum, 2 times Maximum.

High Temperature Manual Soldering

260°C Maximum for 5 seconds Maximum, 2 times Maximum.

www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/16/2010 | Page 3 of 3

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