ECX-5870-25.000M TR [ECLIPTEK]

CRYSTALS 30/50 0+70 18PF 25.000MHZ AT CUT FUND HC-49/UP;


型号：	ECX-5870-25.000M TR
厂家：	Ecliptek
描述：	CRYSTALS 30/50 0+70 18PF 25.000MHZ AT CUT FUND HC-49/UP
文件：	总4页 (文件大小：130K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

ECX-5870-25.000M

PLEASE NOTE: Due to the inherent proprietary nature of custom part numbers, certain parameters

are intentionally excluded from this specification sheet.

ECX-5870 -25.000M

Series

Nominal Frequency

Ecliptek Custom Crystal

25.000MHz

ELECTRICAL SPECIFICATIONS

Nominal Frequency

25.000MHz

ENVIRONMENTAL & MECHANICAL SPECIFICATIONS

Fine Leak Test

MIL-STD-883, Method 1014 Condition A

MIL-STD-883, Method 1014 Condition C

MIL-STD-202, Method 213 Condition C

MIL-STD-202, Method 210

Gross Leak Test

Mechanical Shock

Resistance to Soldering Heat

Resistance to Solvents

Solderability

MIL-STD-202, Method 215

MIL-STD-883, Method 2003

Temperature Cycling

Vibration

MIL-STD-883, Method 1010

MIL-STD-883, Method 2007 Condition A

MECHANICAL DIMENSIONS (all dimensions in millimeters)

LINE MARKING

ECX5870

4.50

MAX

13.30 MAX

4.85

MAX

0.50 MIN (x2)

4.88 ±0.20

0.80 ±0.30 (x2)

11.60 MAX

NOTE: Coplanarity 0.360 MAX

www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/16/2010 | Page 1 of 4

ECX-5870-25.000M

Suggested Solder Pad Layout

All Dimensions in Millimeters

5.5 (X2)

2.0 (X2)

4.0

Solder Land

(X2)

All Tolerances are ±0.1

www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/16/2010 | Page 2 of 4

ECX-5870-25.000M

Recommended Solder Reflow Methods

Critical Zone

T_Lto T_P

T_P

Ramp-up

Ramp-down

T_L

T_SMax

T_SMin

t_L

t_P

t_SPreheat

t 25°C to Peak

Time (t)

High Temperature Infrared/Convection

TS MAX to TL (Ramp-up Rate)

3°C/second Maximum

Preheat

- Temperature Minimum (TS MIN)

- Temperature Typical (TS TYP)

- Temperature Maximum (TS MAX)

- Time (tS MIN)

150°C

175°C

200°C

60 - 180 Seconds

Ramp-up Rate (TL to TP)

3°C/second Maximum

Time Maintained Above:

- Temperature (TL)

- Time (tL)

217°C

60 - 150 Seconds

Peak Temperature (TP)

260°C Maximum for 10 Seconds Maximum

250°C +0/-5°C

Target Peak Temperature (TP Target)

Time within 5°C of actual peak (tp)

Ramp-down Rate

20 - 40 seconds

6°C/second Maximum

8 minutes Maximum

Level 1

Time 25°C to Peak Temperature (t)

Moisture Sensitivity Level

www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/16/2010 | Page 3 of 4

ECX-5870-25.000M

Recommended Solder Reflow Methods

Critical Zone

T_Lto T_P

T_P

Ramp-up

Ramp-down

T_L

T_SMax

T_SMin

t_L

t_P

t_SPreheat

t 25°C to Peak

Time (t)

Low Temperature Infrared/Convection 245°C

TS MAX to TL (Ramp-up Rate)

5°C/second Maximum

Preheat

- Temperature Minimum (TS MIN)

- Temperature Typical (TS TYP)

- Temperature Maximum (TS MAX)

- Time (tS MIN)

N/A

150°C

N/A

30 - 60 Seconds

Ramp-up Rate (TL to TP)

5°C/second Maximum

Time Maintained Above:

- Temperature (TL)

- Time (tL)

150°C

200 Seconds Maximum

Peak Temperature (TP)

245°C Maximum

Target Peak Temperature (TP Target)

Time within 5°C of actual peak (tp)

Ramp-down Rate

245°C Maximum 2 Times / 230°C Maximum 1 Time

10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time

5°C/second Maximum

Time 25°C to Peak Temperature (t)

Moisture Sensitivity Level

N/A

Level 1

Low Temperature Manual Soldering

185°C Maximum for 10 seconds Maximum, 2 times Maximum.

High Temperature Manual Soldering

260°C Maximum for 5 seconds Maximum, 2 times Maximum.

www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/16/2010 | Page 4 of 4

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