ECX-6553-27.000M TR [ECLIPTEK]
CRYSTALS 30/50 -10+60 18PF P 27.000MHZ ATCUT ATCUT FUND 3.2X2.5MM 4PAD SMD;
| 型号： | ECX-6553-27.000M TR |
| 厂家： | 
Ecliptek |
| 描述： | CRYSTALS 30/50 -10+60 18PF P 27.000MHZ ATCUT ATCUT FUND 3.2X2.5MM 4PAD SMD |
| 文件： | 总4页 (文件大小：120K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
RoHS
Pb
ECX-6553-27.000M
PLEASE NOTE: Due to the inherent proprietary nature of custom part numbers, certain parameters
are intentionally excluded from this specification sheet.
ECX-6553 -27.000M
Series
Nominal Frequency
Ecliptek Custom Crystal
27.000MHz
ELECTRICAL SPECIFICATIONS
Nominal Frequency
27.000MHz
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
ESD Susceptibility
MIL-STD-883, Method 3015, Class 1, HBM: 1500V
Fine Leak Test
MIL-STD-883, Method 1014, Condition A
UL94-V0
Flammability
Gross Leak Test
Mechanical Shock
Moisture Resistance
Moisture Sensitivity
Resistance to Soldering Heat
Resistance to Solvents
Solderability
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 1004
J-STD-020, MSL 1
MIL-STD-202, Method 210, Condition K
MIL-STD-202, Method 215
MIL-STD-883, Method 2003
Temperature Cycling
Vibration
MIL-STD-883, Method 1010, Condition B
MIL-STD-883, Method 2007, Condition A
MECHANICAL DIMENSIONS (all dimensions in millimeters)
PIN CONNECTION
1
2
3
4
Crystal
Cover/Ground
Crystal
2.50
0.70 ±0.10
±0.10
1.00
±0.10
(X4)
Cover/Ground
1
2
4
3
LINE MARKING
1
2
ECX
6553
1.20
±0.10
3.20
±0.10
0.90 ±0.10
(X4)
0.80 MAX
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/16/2010 | Page 1 of 4
ECX-6553-27.000M
Suggested Solder Pad Layout
All Dimensions in Millimeters
1.3 (X4)
1.3 (X4)
Solder Land
(X4)
0.8
0.4
All Tolerances are ±0.1
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/16/2010 | Page 2 of 4
ECX-6553-27.000M
Recommended Solder Reflow Methods
Critical Zone
TL to TP
TP
Ramp-up
Ramp-down
TL
TS Max
TS Min
tL
tP
tSPreheat
t 25°C to Peak
Time (t)
High Temperature Infrared/Convection
TS MAX to TL (Ramp-up Rate)
3°C/second Maximum
Preheat
- Temperature Minimum (TS MIN)
- Temperature Typical (TS TYP)
- Temperature Maximum (TS MAX)
- Time (tS MIN)
150°C
175°C
200°C
60 - 180 Seconds
Ramp-up Rate (TL to TP)
3°C/second Maximum
Time Maintained Above:
- Temperature (TL)
- Time (tL)
217°C
60 - 150 Seconds
Peak Temperature (TP)
260°C Maximum for 10 Seconds Maximum
250°C +0/-5°C
Target Peak Temperature (TP Target)
Time within 5°C of actual peak (tp)
Ramp-down Rate
20 - 40 seconds
6°C/second Maximum
8 minutes Maximum
Level 1
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/16/2010 | Page 3 of 4
ECX-6553-27.000M
Recommended Solder Reflow Methods
Critical Zone
TL to TP
TP
Ramp-up
Ramp-down
TL
TS Max
TS Min
tL
tP
tSPreheat
t 25°C to Peak
Time (t)
Low Temperature Infrared/Convection 245°C
TS MAX to TL (Ramp-up Rate)
5°C/second Maximum
Preheat
- Temperature Minimum (TS MIN)
- Temperature Typical (TS TYP)
- Temperature Maximum (TS MAX)
- Time (tS MIN)
N/A
150°C
N/A
30 - 60 Seconds
Ramp-up Rate (TL to TP)
5°C/second Maximum
Time Maintained Above:
- Temperature (TL)
- Time (tL)
150°C
200 Seconds Maximum
Peak Temperature (TP)
245°C Maximum
Target Peak Temperature (TP Target)
Time within 5°C of actual peak (tp)
Ramp-down Rate
245°C Maximum 2 Times / 230°C Maximum 1 Time
10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time
5°C/second Maximum
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
N/A
Level 1
Low Temperature Manual Soldering
185°C Maximum for 10 seconds Maximum, 2 times Maximum.
High Temperature Manual Soldering
260°C Maximum for 5 seconds Maximum, 2 times Maximum.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/16/2010 | Page 4 of 4
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