EH1125TTS-11.0592M [ECLIPTEK]

CRYSTAL OSCILLATOR, CLOCK, 11.0592 MHz, HCMOS/TTL OUTPUT, ROHS COMPLIANT, METAL, DIP-14/4;


型号：	EH1125TTS-11.0592M
厂家：	Ecliptek
描述：	CRYSTAL OSCILLATOR, CLOCK, 11.0592 MHz, HCMOS/TTL OUTPUT, ROHS COMPLIANT, METAL, DIP-14/4 机械输出元件振荡器
文件：	总7页 (文件大小：145K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

RoHS

EH1125TTS-11.0592M

EH11 25

T TS -11.0592M

Series

Nominal Frequency

11.0592MHz

RoHS Compliant (Pb-free) 5.0V 14 Pin DIP Metal

Thru-Hole HCMOS/TTL High Frequency Oscillator

Pin 1 Connection

Tri-State (High Impedance)

Frequency Tolerance/Stability

±25ppm Maximum

Duty Cycle

50 ±5(%)

Package

Operating Temperature Range

0°C to +70°C

ELECTRICAL SPECIFICATIONS

Nominal Frequency

11.0592MHz

Frequency Tolerance/Stability

±25ppm Maximum (Inclusive of all conditions: Calibration Tolerance at 25°C, Frequency Stability over the

Operation Temperature Range, Supply Voltage Change, Output Load Change, 1st Year Aging at 25°C,

Shock, and Vibration)

Aging at 25°C

±5ppm/year Maximum

Operating Temperature Range

Supply Voltage

0°C to +70°C

5.0Vdc ±10%

Input Current

50mA Maximum (No Load)

Output Voltage Logic High (Voh)

Output Voltage Logic Low (Vol)

Rise/Fall Time

2.4Vdc Minimum with TTL Load, Vdd-0.4Vdc Minimum with HCMOS Load (IOH = -16mA)

0.4Vdc Maximum with TTL Load, 0.5Vdc Maximum with HCMOS Load (IOL = +16mA)

6nSec Maximum (Measured at 0.8Vdc to 2.0Vdc with TTL Load, 20% to 80% of waveform with HCMOS

Load)

Duty Cycle

50 ±5(%) (Measured at 50% of waveform with TTL Load or with HCMOS Load)

Load Drive Capability

Output Logic Type

10TTL Load or 50pF HCMOS Load Maximum

CMOS

Pin 1 Connection

Tri-State (High Impedance)

Tri-State Input Voltage (Vih and Vil)

+2.2Vdc Minimum to enable output, +0.8Vdc Maximum to disable output (High Impedance), No Connect to

enable output.

Absolute Clock Jitter

±250pSec Maximum, ±100pSec Typical

±50pSec Maximum, ±30pSec Typical

10mSec Maximum

One Sigma Clock Period Jitter

Start Up Time

Storage Temperature Range

-55°C to +125°C

ENVIRONMENTAL & MECHANICAL SPECIFICATIONS

Fine Leak Test

MIL-STD-883, Method 1014, Condition A

MIL-STD-883, Method 1014, Condition C

MIL-STD-883, Method 2004

Gross Leak Test

Lead Integrity

Mechanical Shock

Resistance to Soldering Heat

Resistance to Solvents

Solderability

MIL-STD-202, Method 213, Condition C

MIL-STD-202, Method 210

MIL-STD-202, Method 215

MIL-STD-883, Method 2003

Temperature Cycling

Vibration

MIL-STD-883, Method 1010

MIL-STD-883, Method 2007, Condition A

www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 3/11/2011 | Page 1 of 7

EH1125TTS-11.0592M

MECHANICAL DIMENSIONS (all dimensions in millimeters)

PIN CONNECTION

15.240

±0.203

Tri-State (High

Impedance)

0.9 MAX

DIA 0.457

Ground/Case Ground

Output

±0.100 (X4)

7.620

±0.203

Supply Voltage

LINE MARKING

ECLIPTEK

5.08 MIN

EH11TS

EH11=Product Series

5.08 MAX

11.059M

MARKING

ORIENTATION

13.2

MAX

XXYZZ

XX=Ecliptek Manufacturing

Code

Y=Last Digit of the Year

ZZ=Week of the Year

20.8 MAX

OUTPUT WAVEFORM & TIMING DIAGRAM

VIH

VIL

VOH

80% or 2.0VDC

OUTPUT DISABLE

(HIGH IMPEDANCE

STATE)

50% or 1.4VDC

20% or 0.8VDC

VOL

tPLZ

tPZL

Fall

Time

Rise

Time

Duty Cycle (%) = TW/T x 100

www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 3/11/2011 | Page 2 of 7

EH1125TTS-11.0592M

Test Circuit for TTL Output

R_LValue

(Ohms)

Output Load

Drive Capability

C_LValue

(pF)

390

780

10TTL

5TTL

Frequency

Counter

1100

2000

2200

2TTL

Oscilloscope

10LSTTL

1TTL

Table 1: R_LResistance Value and C_LCapacitance

Value Vs. Output Load Drive Capability

Probe

Supply

Voltage

(Note 2)

R_L

(Note 4)

(V_DD

)

Output

Current

Meter

Power

Supply

0.01µF

(Note 1)

Power

Supply

Voltage

Meter

0.1µF

(Note 1)

C_L

(Note 3)

Ground

No Connect

or Tri-State

Note 1: An external 0.1µF low frequency tantalum bypass capacitor in parallel with a 0.01µF high frequency

ceramic bypass capacitor close to the package ground and V_DDpin is required.

Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth

(>300MHz) passive probe is recommended.

Note 3: Capacitance value C_Lincludes sum of all probe and fixture capacitance.

Note 4: Resistance value R_Lis shown in Table 1. See applicable specification sheet for 'Load Drive Capability'.

Note 5: All diodes are MMBD7000, MMBD914, or equivalent.

www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 3/11/2011 | Page 3 of 7

EH1125TTS-11.0592M

Test Circuit for CMOS Output

Frequency

Counter

Oscilloscope

Probe

(Note 2)

Supply

Voltage

(V_DD

)

Output

Current

Meter

Power

Supply

0.01µF

(Note 1)

Voltage

Meter

0.1µF

(Note 1)

C_L

(Note 3)

Ground

No Connect

or Tri-State

Note 1: An external 0.1µF low frequency tantalum bypass capacitor in parallel with a 0.01µF high frequency

ceramic bypass capacitor close to the package ground and V_DDpin is required.

Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth

(>300MHz) passive probe is recommended.

Note 3: Capacitance value C_Lincludes sum of all probe and fixture capacitance.

www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 3/11/2011 | Page 4 of 7

EH1125TTS-11.0592M

Recommended Solder Reflow Methods

Critical Zone

T_Lto T_P

T_P

Ramp-up

Ramp-down

T_L

T_SMax

T_SMin

t_L

t_P

t_SPreheat

t 25°C to Peak

Time (t)

High Temperature Solder Bath (Wave Solder)

TS MAX to TL (Ramp-up Rate)

3°C/second Maximum

Preheat

- Temperature Minimum (TS MIN)

- Temperature Typical (TS TYP)

- Temperature Maximum (TS MAX)

- Time (tS MIN)

150°C

175°C

200°C

60 - 180 Seconds

Ramp-up Rate (TL to TP)

3°C/second Maximum

Time Maintained Above:

- Temperature (TL)

- Time (tL)

217°C

60 - 150 Seconds

Peak Temperature (TP)

260°C Maximum for 10 Seconds Maximum

250°C +0/-5°C

Target Peak Temperature (TP Target)

Time within 5°C of actual peak (tp)

Ramp-down Rate

20 - 40 seconds

6°C/second Maximum

8 minutes Maximum

Level 1

Temperatures shown are applied to back of PCB board and device leads

only. Do not use this method for product with the Gull Wing option.

Time 25°C to Peak Temperature (t)

Moisture Sensitivity Level

Additional Notes

www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 3/11/2011 | Page 5 of 7

EH1125TTS-11.0592M

Recommended Solder Reflow Methods

Critical Zone

T_Lto T_P

T_P

Ramp-up

Ramp-down

T_L

T_SMax

T_SMin

t_L

t_P

t_SPreheat

t 25°C to Peak

Time (t)

Low Temperature Infrared/Convection 185°C

TS MAX to TL (Ramp-up Rate)

5°C/second Maximum

Preheat

- Temperature Minimum (TS MIN)

- Temperature Typical (TS TYP)

- Temperature Maximum (TS MAX)

- Time (tS MIN)

N/A

150°C

N/A

60 - 120 Seconds

Ramp-up Rate (TL to TP)

5°C/second Maximum

Time Maintained Above:

- Temperature (TL)

- Time (tL)

150°C

200 Seconds Maximum

Peak Temperature (TP)

185°C Maximum

185°C Maximum 2 Times

10 seconds Maximum 2 Times

5°C/second Maximum

N/A

Target Peak Temperature (TP Target)

Time within 5°C of actual peak (tp)

Ramp-down Rate

Time 25°C to Peak Temperature (t)

Moisture Sensitivity Level

Additional Notes

Level 1

Temperatures shown are applied to body of device. Use this method only

for product with the Gull Wing option.

www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 3/11/2011 | Page 6 of 7

EH1125TTS-11.0592M

Recommended Solder Reflow Methods

Critical Zone

T_Lto T_P

T_P

Ramp-up

Ramp-down

T_L

T_SMax

T_SMin

t_L

t_P

t_SPreheat

t 25°C to Peak

Time (t)

Low Temperature Solder Bath (Wave Solder)

TS MAX to TL (Ramp-up Rate)

5°C/second Maximum

Preheat

- Temperature Minimum (TS MIN)

- Temperature Typical (TS TYP)

- Temperature Maximum (TS MAX)

- Time (tS MIN)

N/A

150°C

N/A

30 - 60 Seconds

Ramp-up Rate (TL to TP)

5°C/second Maximum

Time Maintained Above:

- Temperature (TL)

- Time (tL)

150°C

200 Seconds Maximum

Peak Temperature (TP)

245°C Maximum

Target Peak Temperature (TP Target)

Time within 5°C of actual peak (tp)

Ramp-down Rate

245°C Maximum 1 Time / 235°C Maximum 2 Times

5 seconds Maximum 1 Time / 15 seconds Maximum 2 Times

5°C/second Maximum

Time 25°C to Peak Temperature (t)

Moisture Sensitivity Level

Additional Notes

N/A

Level 1

Temperatures shown are applied to back of PCB board and device leads

only. Do not use this method for product with the Gull Wing option.

Low Temperature Manual Soldering

185°C Maximum for 10 seconds Maximum, 2 times Maximum. (Temperatures listed are applied to device leads only.

This method can be utilized with both Gull Wing and Non-Gull Wing devices.)

High Temperature Manual Soldering

260°C Maximum for 5 seconds Maximum, 2 times Maximum. (Temperatures listed are applied to device leads only. This

method can be utilized with both Gull Wing and Non-Gull Wing devices.)

www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 3/11/2011 | Page 7 of 7

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