EH1445SJETTTS-2.248438M [ECLIPTEK]

CMOS, Quartz Crystal Clock Oscillators XO (SPXO) HCMOS/TTL (CMOS) 5.0Vdc J-Lead 9.8mm x 14.0mm Plastic Surface Mount (SMD) Quartz Crystal Clock Oscillators XO (SPXO) HCMOS/TTL (CMOS) 5.0Vdc J-Lead 9.8mm x 14.0mm Plastic Surface Mount (SMD);


型号：	EH1445SJETTTS-2.248438M
厂家：	Ecliptek
描述：	CMOS, Quartz Crystal Clock Oscillators XO (SPXO) HCMOS/TTL (CMOS) 5.0Vdc J-Lead 9.8mm x 14.0mm Plastic Surface Mount (SMD) Quartz Crystal Clock Oscillators XO (SPXO) HCMOS/TTL (CMOS) 5.0Vdc J-Lead 9.8mm x 14.0mm Plastic Surface Mount (SMD) 石英晶振
文件：	总10页 (文件大小：936K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Ecliptek | EH14 Series Oscillator

http://www.ecliptek.com/oscillators/EH14/

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EH14 Series Oscillator

Quartz Crystal Clock Oscillators XO (SPXO) HCMOS/TTL (CMOS) 5.0Vdc J-Lead 9.8mm x 14.0mm Plastic Surface Mount (SMD)

2011/65 +

168 SVHC

2015/863

Revision F 08/14/2012

Electrical Specifications

Nominal Frequency

1.000MHz to 155.520MHz

Some frequencies within this range may not be available.

Frequency

(Inclusive of all conditions: Calibration Tolerance at 25°C, Frequency Stability over the

Tolerance/Stability

Operating Temperature Range, Supply Voltage Change, Output Load Change, First Year

Aging at 25°C, Shock, and Vibration)

±100ppm Maximum

±50ppm Maximum

±25ppm Maximum

±20ppm Maximum

Operating Temperature

Range

0°C to +70°C

-40°C to +85°C

Supply Voltage (V

Input Current

)

5.0V

±10%

No Load

50mA Maximum

Output Voltage Logic

High (V

2.4V

0.4V

Minimum with TTL Load, V -0.4V

Minimum with HCMOS Load, IOH = -16mA

)

Output Voltage Logic

Low (V

Maximum with TTL Load, 0.5V

Maximum with HCMOS Load, IOL = +16mA

)

Duty Cycle

50 ±10(%)(Measured at 1.4V

with TTL Load or 50% of waveform with HCMOS Load

over Nominal Frequency of 1MHz to 70MHz; Measured at 50% of waveform over Nominal

Frequency of 70.000001MHz to 155.52MHz)

50 ±5(%) (Measured at 50% of waveform with TTL Load or with HCMOS Load)

Rise Time/Fall Time

Load Drive Capability

Measured at 0.8V

to 2.0V

with TTL Load; Measured at 20% to 80% of waveform

with HCMOS Load

6nSec Maximum over Nominal Frequency of 1MHz to 70MHz

4nSec Maximum over Nominal Frequency of 70.000001MHz to 155.52MHz

10TTL Load or 50pF HCMOS Load Maximum over Nominal Frequency of 1MHz to 70MHz

5TTL Load or 15pF HCMOS Load Maximum over Nominal Frequency of 70.000001MHz to

155.52MHz

Output Logic Type

Pin 1 Connection

CMOS

TTL

Tri-State (Disabled Output: High Impedance)

Tri-State Input Voltage

(Vih and Vil)

+2.2V

Minimum to enable output, +0.8V Maximum to disable output (High

Impedance), No Connect to enable output.

±250pSec Maximum, ±100pSec Typical

±50pSec Maximum, ±30pSec Typical

Absolute Clock Jitter

One Sigma Clock Period

Jitter

Aging (at 25°C)

±5ppm/year Maximum

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Storage Temperature

Range

-55°C to +125°C

10mSec Maximum

Start Up Time

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Mechanical Dimensions

All Dimensions in Millimeters

Pin 1: Tri-State (High Impedance)

Pin 2: Ground

Pin 3: Output

Pin 4: Supply Voltage

Marking Specifications

Line 1:

Line 2:

ECLIPTEK

XXXXXXM

XXXXXX = Nominal Frequency (5 Digits + Decimal)

M = Frequency unit of measure (MHz)

Line 3:

XXXXX

XXXXX = Ecliptek Manufacturing Identifier

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Environmental and Mechanical Specifications

ESD Susceptibility:

Fine Leak Test:

MIL-STD-883, Method 3015, Class 1, HBM:1500V

MIL-STD-883, Method 1014, Condition A (Internal Crystal Only)

UL94-V0

Flammability:

Gross Leak Test:

MIL-STD-883, Method 1014, Condition C (Internal Crystal Only)

MIL-STD-202, Method 213, Condition C

MIL-STD-883, Method 1004

Mechanical Shock:

Moisture Resistance:

Resistance to Soldering Heat:

Resistance to Solvents:

Solderability:

MIL-STD-202, Method 210, Condition K

MIL-STD-202, Method 215

MIL-STD-883, Method 2003

Temperature Cycling:

Vibration:

MIL-STD-883, Method 1010, Condition B

MIL-STD-883, Method 2007, Condition A

81°C/W (degrees Celsius per Watt)

Thermal Resistance (θ ):

31°C/W (degrees Celsius per Watt)

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Tape & Reel Dimensions

1000 pieces per reel

Compliant to EIA-481

All Dimensions in Millimeters

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TTL Test Circuit

Note 1: An external 0.1µF low frequency tantalum bypass capacitor in parallel with a 0.01µF high frequency ceramic bypass

capacitor close to the package ground and V pin is required.

Note 2: A low input capacitance (<12pF), 10X Attentuation Factor, High Impedance (>10Mohms), and High bandwidth

(>300MHz) passive probe is recommended.

Note 3: Capacitance value C includes sum of all probe and fixture capacitance.

Note 4: Resistance value R is shown in Table I. See applicable specification sheet for â€˜Load Drive Capabilityâ€™.

Note 5: All diodes are MMBD7000, MMBD914, or equivalent.

CMOS Test Circuit

Note 1: An external 0.1µF low frequency tantalum bypass capacitor in parallel with a 0.01µF high frequency ceramic bypass

capacitor close to the package ground pin is required.

Note 2: A low input capacitance (<12pF), 10X Attentuation Factor, High Impedance (>10Mohms), and High bandwidth

(>300MHz) passive probe is recommended.

Note 3: Capacitance value includes sum of all probe and fixture capacitance. See applicable specification sheet for ‘Load

Drive Capability’.

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Recommended Solder Pad Dimensions

Tolerances = ±0.1

All Dimensions in Millimeters

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Solder Reflow Profile

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Low Temperature Infrared/Convection

Note: Temperatures shown are applied to body of device.

MAX to T (Ramp-up Rate)

5°C/second Maximum

Preheat

- Temperature Minimum (T MIN)

N/A

- Temperature Typical (T TYP)

150°C

- Temperature Maximum (T MAX)

N/A

- Time (t )

60 - 120 Seconds

5°C/second Maximum

Ramp-up Rate (T to T )

Time Maintained Above:

- Temperature (T )

150°C

- Time (t )

200 Seconds Maximum

Peak Temperature (T )

240°C Maximum

Target Peak Temperature (T Target)

240°C Maximum 2 Times / 230°C Maximum 1 Time

10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time

Time within 5°C of actual peak (t )

Ramp-down Rate

5°C/second Maximum

Time 25°C to Peak Temperature (t)

Moisture Sensitivity Level

N/A

Level 1

High Temperature Manual Soldering

Note: Temperatures listed are applied to body of device.

260°C Maximum for 5 seconds Maximum, 2 times Maximum.

Low Temperature Manual Soldering

Note: Temperatures listed are applied to body of device.

185°C Maximum for 10 seconds Maximum, 2 times Maximum.

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2 - Next Page

Select the parameters that meet your requirements and then click

Access these Part Number specific

resources and tools

Frequency in Megahertz (1 to 155.52):

Some frequencies within this range may not be

available

Frequency Tolerance/Stability:

Operating Temperature Range:

Duty Cycle:

Packaging Options:

Part Numbering Guide

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