EH1445SJTTS-11.2896MTR [ECLIPTEK]
CRYSTAL OSCILLATOR, CLOCK, 11.2896MHz, HCMOS/TTL OUTPUT, ROHS COMPLIANT, PLASTIC, J-LEADED, SMD, 4 PIN;
| 型号： | EH1445SJTTS-11.2896MTR |
| 厂家： | 
Ecliptek |
| 描述： | CRYSTAL OSCILLATOR, CLOCK, 11.2896MHz, HCMOS/TTL OUTPUT, ROHS COMPLIANT, PLASTIC, J-LEADED, SMD, 4 PIN 机械 输出元件 振荡器 |
| 文件： | 总6页 (文件大小：172K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
RoHS
EH1445SJTTS-11.2896M TR
EH14 45 SJ
T TS -11.2896M TR
Series
Packaging Options
RoHS Compliant 5.0V Plastic J-Lead SMD HCMOS/TTL
High Frequency Oscillator
Tape & Reel
Nominal Frequency
Frequency Tolerance/Stability
±50ppm Maximum
11.2896MHz
Pin 1 Connection
Tri-State (Disabled Output: High Impedance)
Package
Operating Temperature Range
0°C to +70°C
Duty Cycle
50 ±5(%)
ELECTRICAL SPECIFICATIONS
Nominal Frequency
11.2896MHz
Frequency Tolerance/Stability
±50ppm Maximum (Inclusive of all conditions: Calibration Tolerance at 25°C, Frequency Stability over the
Operating Temperature Range, Supply Voltage Change, Output Load Change, 1st Year Aging at 25°C,
Shock, and Vibration)
Aging at 25°C
±5ppm/year Maximum
Operating Temperature Range
Supply Voltage
0°C to +70°C
5.0Vdc ±10%
Input Current
50mA Maximum (No Load)
Output Voltage Logic High (Voh)
Output Voltage Logic Low (Vol)
Rise/Fall Time
2.4Vdc Minimum with TTL Load, Vdd-0.4Vdc Minimum with HCMOS Load, IOH = -16mA
0.4Vdc Maximum with TTL Load, 0.5Vdc Maximum with HCMOS Load, IOL = +16mA
6nSec Maximum (Measured at 0.8Vdc to 2.0Vdc with TTL Load; Measured at 20% to 80% of waveform
with HCMOS Load)
Duty Cycle
50 ±5(%) (Measured at 50% of waveform with TTL Load or with HCMOS Load)
10TTL Load or 50pF HCMOS Load Maximum
CMOS
Load Drive Capability
Output Logic Type
Pin 1 Connection
Tri-State (Disabled Output: High Impedance)
Tri-State Input Voltage (Vih and Vil)
+2.2Vdc Minimum to enable output, +0.8Vdc Maximum to disable output (High Impedance), No Connect to
enable output.
Absolute Clock Jitter
±250pSec Maximum, ±100pSec Typical
±50pSec Maximum, ±30pSec Typical
10mSec Maximum
One Sigma Clock Period Jitter
Start Up Time
Storage Temperature Range
-55°C to +125°C
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
ESD Susceptibility
MIL-STD-883, Method 3015, Class 1, HBM: 1500V
MIL-STD-883, Method 1014, Condition A (Internal Crystal Only)
UL94-V0
Fine Leak Test
Flammability
Gross Leak Test
Mechanical Shock
Moisture Resistance
Resistance to Soldering Heat
Resistance to Solvents
Solderability
MIL-STD-883, Method 1014, Condition C (Internal Crystal Only)
MIL-STD-202, Method 213, Condition C
MIL-STD-883, Method 1004
MIL-STD-202, Method 210, Condition K
MIL-STD-202, Method 215
MIL-STD-883, Method 2003
Temperature Cycling
Vibration
MIL-STD-883, Method 1010, Condtion B
MIL-STD-883, Method 2007, Condition A
www.ecliptek.com | Specification Subject to Change Without Notice | Rev E 3/12/2011 | Page 1 of 6
EH1445SJTTS-11.2896M TR
MECHANICAL DIMENSIONS (all dimensions in millimeters)
PIN CONNECTION
1
Tri-State (High
Impedance)
5.080
0.25 MIN
±0.203
2
3
4
Ground
Output
4
3
9.8
MAX
7.620
±0.203
MARKING
ORIENTATION
Supply Voltage
LINE MARKING
1
2
1
2
3
ECLIPTEK
11.289M
4.7
MAX
14.0
MAX
0.510 ±0.203
XXXXXX
XXXXXX=Ecliptek
Manufacturing Identifier
Suggested Solder Pad Layout
All Dimensions in Millimeters
1.27 (X4)
3.0 (X4)
Solder Land
(X4)
5.8
3.81
All Tolerances are ±0.1
www.ecliptek.com | Specification Subject to Change Without Notice | Rev E 3/12/2011 | Page 2 of 6
EH1445SJTTS-11.2896M TR
OUTPUT WAVEFORM & TIMING DIAGRAM
VIH
VIL
VOH
80% or 2.0VDC
OUTPUT DISABLE
(HIGH IMPEDANCE
STATE)
50% or 1.4VDC
20% or 0.8VDC
VOL
tPLZ
tPZL
Fall
Time
Rise
Time
TW
T
Duty Cycle (%) = TW/T x 100
Test Circuit for TTL Output
RL Value
(Ohms)
Output Load
Drive Capability
CL Value
(pF)
390
780
15
15
6
10TTL
5TTL
Frequency
Counter
1100
2000
2200
2TTL
Oscilloscope
15
3
10LSTTL
1TTL
Table 1: RL Resistance Value and CL Capacitance
Value Vs. Output Load Drive Capability
Probe
Supply
Voltage
(Note 2)
RL
(Note 4)
(VDD
)
Output
_
+
Current
Meter
+
+
+
Power
Supply
0.01µF
(Note 1)
Power
Supply
_
Voltage
Meter
0.1µF
(Note 1)
CL
(Note 3)
Ground
_
_
No Connect
or Tri-State
Note 1: An external 0.1µF low frequency tantalum bypass capacitor in parallel with a 0.01µF high frequency
ceramic bypass capacitor close to the package ground and VDD pin is required.
Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth
(>300MHz) passive probe is recommended.
Note 3: Capacitance value CL includes sum of all probe and fixture capacitance.
Note 4: Resistance value RL is shown in Table 1. See applicable specification sheet for 'Load Drive Capability'.
Note 5: All diodes are MMBD7000, MMBD914, or equivalent.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev E 3/12/2011 | Page 3 of 6
EH1445SJTTS-11.2896M TR
Test Circuit for CMOS Output
Frequency
Counter
Oscilloscope
Probe
(Note 2)
Supply
Voltage
(VDD
)
Output
_
+
Current
Meter
+
+
Power
Supply
0.01µF
(Note 1)
Voltage
Meter
0.1µF
(Note 1)
CL
(Note 3)
Ground
_
_
No Connect
or Tri-State
Note 1: An external 0.1µF low frequency tantalum bypass capacitor in parallel with a 0.01µF high frequency
ceramic bypass capacitor close to the package ground and VDD pin is required.
Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth
(>300MHz) passive probe is recommended.
Note 3: Capacitance value CL includes sum of all probe and fixture capacitance.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev E 3/12/2011 | Page 4 of 6
EH1445SJTTS-11.2896M TR
Tape & Reel Dimensions
Quantity Per Reel: 1,000 units
4.0 ±0.2
2.0 ±0.1
1.5 +1.0/-0.0
0.3 ±0.1
11.5 ±0.1
24.0 ±0.3
A0*
10.75 ±0.10
12.0 ±0.1
B0*
K0*
*Compliant to EIA 481A
1.5 MIN
30.4 MAX
DIA 40 MIN
Access Hole at
Slot Location
360 MAX
DIA 50 MIN
2.5 MIN Width
10.0 MIN Depth
Tape slot in Core
for Tape Start
DIA 20.2 MIN
DIA 13.0 ±0.2
24.4 +2.0/-0.0
www.ecliptek.com | Specification Subject to Change Without Notice | Rev E 3/12/2011 | Page 5 of 6
EH1445SJTTS-11.2896M TR
Recommended Solder Reflow Methods
Critical Zone
TL to TP
TP
Ramp-up
Ramp-down
TL
TS Max
TS Min
tL
tP
tSPreheat
t 25°C to Peak
Time (t)
Low Temperature Infrared/Convection 240°C
TS MAX to TL (Ramp-up Rate)
5°C/second Maximum
Preheat
- Temperature Minimum (TS MIN)
- Temperature Typical (TS TYP)
- Temperature Maximum (TS MAX)
- Time (tS MIN)
N/A
150°C
N/A
60 - 120 Seconds
Ramp-up Rate (TL to TP)
5°C/second Maximum
Time Maintained Above:
- Temperature (TL)
- Time (tL)
150°C
200 Seconds Maximum
Peak Temperature (TP)
240°C Maximum
Target Peak Temperature (TP Target)
Time within 5°C of actual peak (tp)
Ramp-down Rate
240°C Maximum 1 Time / 230°C Maximum 2 Times
10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time
5°C/second Maximum
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
N/A
Level 1
Low Temperature Manual Soldering
185°C Maximum for 10 seconds Maximum, 2 times Maximum.
High Temperature Manual Soldering
260°C Maximum for 5 seconds Maximum, 2 times Maximum.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev E 3/12/2011 | Page 6 of 6
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