EH2520ETTTS-29.498928MTR [ECLIPTEK]

CRYSTAL OSCILLATOR, CLOCK, CMOS OUTPUT;


型号：	EH2520ETTTS-29.498928MTR
厂家：	Ecliptek
描述：	CRYSTAL OSCILLATOR, CLOCK, CMOS OUTPUT 输出元件
文件：	总10页 (文件大小：935K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Ecliptek | EH25 Series Oscillator

http://www.ecliptek.com/oscillators/EH25/

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EH25 Series Oscillator

Quartz Crystal Clock Oscillators XO (SPXO) HCMOS/TTL (CMOS) 5.0Vdc 4 Pad 5.0mm x 7.0mm Ceramic Surface Mount (SMD)

2011/65 +

168 SVHC

2015/863

Revision G 06/08/2012

Electrical Specifications

Nominal Frequency

1.000MHz to 155.520MHz

Some frequencies within this range may not be available.

Frequency Tolerance/Stability

(Inclusive of all conditions: Calibration Tolerance at 25°C, Frequency

Stability over the Operating Temperature Range, Supply Voltage

Change, Output Load Change, First Year Aging at 25°C, Shock, and

Vibration)

±100ppm Maximum

±50ppm Maximum

±25ppm Maximum

±20ppm Maximum

Aging at 25°C

±5ppm/year Maximum

Operating Temperature Range

0°C to +70°C

-40°C to +85°C

Supply Voltage

Input Current

5.0V

±10%

No Load

50mA Maximum

Output Voltage Logic High (V

)

= -16mA

2.4V

Load

Minimum with TTL Load, V -0.4V

Minimum with HCMOS

Output Voltage Logic Low (V

Duty Cycle

)

= +16mA

0.4V

Maximum with TTL Load, 0.5V

Maximum with HCMOS Load

50 ±10(%) Measured at 1.4V

with TTL Load or at 50% of waveform

with HCMOS Load from 1MHz to 70MHz Measured at 50% of waveform

above 70MHz

50 ±5(%) Measured at 50% of waveform

Rise Time/Fall Time

Load Drive Capability

Measured at 0.8V

to 2.0V with TTL Load; Masured at 20% to 80%

of waveform with HCMOS Load

6nSec Maximum from 1MHz to 70MHz

4nSec Maximum from 70.000001MHz to 155.520MHz

10 TTL Load or 50pF HCMOS Load Maximum from 1MHz to 70MHz

5 TTL Load or 15pF HCMOS Load Maximum from 70.000001MHz to

155.520MHz

Output Logic Type

Pin 1 Connection

CMOS

Tri-State (High Impedance)

Tri-State Input Voltage (Vih and Vil)

+2.2V

Minimum to Enable Output, +0.8V

Maximum to Disable

Output (High Impedance), No Connect to Enable Output

Absolute Clock Jitter

±250pSec Maximum, ±100pSec Typical

One Sigma Clock Period Jitter

±50pSec Maximum, ±30pSec Typical

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Start Up Time

10mSec Maximum

-55°C to +125°C

Storage Temperature

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Mechanical Dimensions

All Dimensions in Millimeters

Pin 1: Tri-State

Pin 2: Case/Ground

Pin 3: Output

Pin 4: Supply Voltage

Marking Specifications

Line 1:

Line 2:

ECLIPTEK

XXXXXXM

XXXXXX = Nominal Frequency (5 Digits + Decimal)

M = Frequency unit of measure (MHz)

Line 3:

XXXXX

XXXXX = Ecliptek Manufacturing Identifier

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Environmental and Mechanical Specifications

ESD Susceptibility

Fine Leak Test

MIL-STD-883, Method 3015, Class 1, HBM:1500V

MIL-STD-883, Method 1014, Condition A

UL94-V0

Flammability

Gross Leak Test

MIL-STD-883, Method 1014, Condition C

MIL-STD-883, Method 2002, Condition B

MIL-STD-883, Method 1004

Mechanical Shock

Moisture Resistance

Moisture Sensitivity

Resistance to Soldering Heat

Resistance to Solvents

Solderability

J-STD-020, MSL 1

MIL-STD-202, Method 210, Condition K

MIL-STD-202, Method 215

MIL-STD-883, Method 2003

Temperature Cycling

Vibration

MIL-STD-883, Method 1010, Condition B

MIL-STD-883, Method 2007, Condition A

42°C/W (degrees Celsius per Watt)

Thermal Resistance (θ

)

15°C/W (degrees Celsius per Watt)

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Tape & Reel Dimensions

1000 pieces per reel

Compliant to EIA-481

All Dimensions in Millimeters

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Test Circuit for TTL Output

Note 1: An external 0.1µF low frequency tantalum bypass capacitor in parallel with a 0.01µF high frequency ceramic bypass

capacitor close to the package ground and V pin is required.

Note 2: A low capacitance (<12pF), 10X attentuation factor, high impedance (>10Mohms), and high bandwidth (>300MHz)

passive probe is recommended.

Note 3: Capacitance value C includes sum of all probe and fixture capacitance.

Note 4: Resistance value R is shown in Table 1. See applicable specification sheet for â€˜Load Drive Capabilityâ€™.

Note 5: All diodes are MMBD7000, MMBD914, or equivalent.

Test Circuit for CMOS Output

Note 1: An external 0.1µF low frequency tantalum bypass capacitor in parallel with a 0.01µF high frequency ceramic bypass

capacitor close to the package ground and V

pin is required.

Note 2: A low capacitance (<12pF), 10X attentuation factor, high impedance (>10Mohms), and high bandwidth (>300MHz)

passive probe is recommended.

Note 3: Capacitance value C includes sum of all probe and fixture capacitance.

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Recommended Solder Pad Dimensions

Tolerances = ±0.1

All Dimensions in Millimeters

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Solder Reflow Profile

High Temperature Infrared/Convection

Note: Temperatures shown are applied to body of

device.

MAX to T (Ramp-up Rate)

3°C/Second Maximum

Preheat

- Temperature Minimum (T MIN)

150°C

- Temperature Typical (T TYP)

175°C

- Temperature Maximum (T MAX)

200°C

- Time (t )

60 - 180 Seconds

3°C/Second Maximum

Ramp-up Rate (T to T )

Time Maintained Above:

- Temperature (T )

217°C

- Time (t )

60 - 150 Seconds

260°C Maximum for 10 Seconds Maximum

250°C +0/-5°C

Peak Temperature (T )

Target Peak Temperature (T Target)

Time within 5°C of actual peak (t )

20 - 40 Seconds

Ramp-down Rate

6°C/Second Maximum

8 Minutes Maximum

Level 1

Time 25°C to Peak Temperature (t)

Moisture Sensitivity Level

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Low Temperature Infrared/Convection

Note: Temperatures shown are applied to body of

device.

MAX to T (Ramp-up Rate)

5°C/Second Maximum

Preheat

- Temperature Minimum (T MIN)

N/A

- Temperature Typical (T TYP)

150°C

- Temperature Maximum (T MAX)

N/A

- Time (t )

60 - 120 Seconds

5°C/Second Maximum

Ramp-up Rate (T to T )

Time Maintained Above:

- Temperature (T )

150°C

- Time (t )

200 Seconds Maximum

Peak Temperature (T )

240°C Maximum

Target Peak Temperature (T Target)

240°C Maximum 2 Times / 230°C Maximum 1 Time

10 Seconds Maximum 2 Times / 80 Seconds Maximum 1 Time

Time within 5°C of actual peak (t )

Ramp-down Rate

5°C/second Maximum

Time 25°C to Peak Temperature (t)

Moisture Sensitivity Level

N/A

Level 1

High Temperature Manual Soldering

Note: Temperatures listed are applied to body of device.

260°C Maximum for 5 Seconds Maximum, 2 times Maximum.

Low Temperature Manual Soldering

Note: Temperatures listed are applied to body of device.

185°C Maximum for 10 Seconds Maximum, 2 times Maximum.

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1 - Build A Part Number

2 - Next Page

Select the parameters that meet your requirements and then click

Access these Part Number specific

resources and tools

Frequency in Megahertz (1 to 155.520):

Some frequencies within this range may not be

available

Frequency Tolerance/Stability:

Operating Temperature Range:

Duty Cycle:

Packaging Options:

Part Numbering Guide

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