EH2900ETTS-49.150M [ECLIPTEK]

CMOS, Quartz Crystal Clock Oscillators XO (SPXO) LVCMOS (CMOS) 1.8Vdc 4 Pad 5.0mm x 7.0mm Ceramic Surface Mount (SMD) Quartz Crystal Clock Oscillators XO (SPXO) LVCMOS (CMOS) 1.8Vdc 4 Pad 5.0mm x 7.0mm Ceramic Surface Mount (SMD);
EH2900ETTS-49.150M
型号: EH2900ETTS-49.150M
厂家: Ecliptek    Ecliptek
描述:

CMOS, Quartz Crystal Clock Oscillators XO (SPXO) LVCMOS (CMOS) 1.8Vdc 4 Pad 5.0mm x 7.0mm Ceramic Surface Mount (SMD) Quartz Crystal Clock Oscillators XO (SPXO) LVCMOS (CMOS) 1.8Vdc 4 Pad 5.0mm x 7.0mm Ceramic Surface Mount (SMD)

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Ecliptek | EH29 Series Oscillator  
http://www.ecliptek.com/oscillators/EH29/  
Log On | 714-433-1200 | Email Customer Support  
Home  
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EH29 Series Oscillator  
Quartz Crystal Clock Oscillators XO (SPXO) LVCMOS (CMOS) 1.8Vdc 4 Pad 5.0mm x 7.0mm Ceramic Surface Mount (SMD)  
2011/65 +  
168 SVHC  
2015/863  
Revision E 06/08/2012  
ectrical Specifications  
Nominal Frequency  
1.000MHz to 200.000MHz  
Some frequencies within this range may not be available.  
requency Tolerance/Stability  
(Inclusive of all conditions: Calibration Tolerance at 25°C, Frequency  
Stability over the Operating Temperature Range, Supply Voltage  
Change, Output Load Change, First Year Aging at 25°C, 260°C Reflow,  
Shock, and Vibration)  
±100ppm Maximum  
±50ppm Maximum  
±25ppm Maximum  
±20ppm Maximum  
ging at 25°C  
±5ppm/year Maximum  
Operating Temperature Range  
0°C to +70°C  
-40°C to +85°C  
upply Voltage  
nput Current  
1.8V  
±5%  
DC  
No Load  
3.5mA Maximum over Nominal Frequency of 1MHz to 25MHz  
4mA Maximum over Nominal Frequency of 25.000001MHz to 75MHz  
5mA Maximum over Nominal Frequency of 75.000001MHz to 100MHz  
8mA Maximum over Nominal Frequency of 100.000001MHz to 200MHz  
Output Voltage Logic High (V  
)
OH  
I
= -8mA  
OH  
90% of V  
Minimum  
Maximum  
DD  
Output Voltage Logic Low (V  
uty Cycle  
)
I
= +8mA  
OL  
OL  
10% of V  
DD  
Measured at 50% of Waveform  
50 ±10(%)  
50 ±5(%)  
ise Time/Fall Time  
Measured at 20% to 80% of Waveform  
6nSec Maximum from 1MHz to 50MHz  
4nSec Maximum from 50.000001MHz to 75MHz  
2nSec Maximum from 75.000001MHz to 200MHz  
oad Drive Capability  
Output Logic Type  
in 1 Connection  
15pF Maximum  
CMOS  
Tri-State (High Impedance)  
ri-State Input Voltage (Vih and Vil)  
90% of V  
10% of V  
Minimum or No Connect to Enable Output  
Maximum to Disable Output (High Impedance)  
DD  
DD  
tandby Current  
MS Phase Jitter  
10µA Maximum (Pin 1 = Ground)  
Fj=12kHz to 20MHz  
20pSec Typical, 30pSec Maximum  
1 of 10  
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eriod Jitter (RMS)  
eriod Jitter (pk-pk)  
tart Up Time  
15pSec Typical  
100pSec Typical, 200pSec Maximum  
10mSec Maximum  
torage Temperature  
-55°C to +125°C  
2 of 10  
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echanical Dimensions  
Dimensions in Millimeters  
1: Tri-State  
2: Case/Ground  
3: Output  
4: Supply Voltage  
arking Specifications  
e 1:  
e 2:  
ECLIPTEK  
XXXXXXM  
XXXXXX = Nominal Frequency (5 Digits + Decimal)  
M = Frequency unit of measure (MHz)  
e 3:  
XXXXX  
XXXXX = Ecliptek Manufacturing Identifier  
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vironmental and Mechanical Specifications  
D Susceptibility  
e Leak Test  
MIL-STD-883, Method 3015, Class 1, HBM:1500V  
MIL-STD-883, Method 1014, Condition A  
UL94-V0  
mmability  
oss Leak Test  
MIL-STD-883, Method 1014, Condition C  
MIL-STD-883, Method 2002, Condition B  
MIL-STD-883, Method 1004  
chanical Shock  
isture Resistance  
isture Sensitivity  
sistance to Soldering Heat  
sistance to Solvents  
lderability  
J-STD-020, MSL 1  
MIL-STD-202, Method 210, Condition K  
MIL-STD-202, Method 215  
MIL-STD-883, Method 2003  
mperature Cycling  
bration  
MIL-STD-883, Method 1010, Condition B  
MIL-STD-883, Method 2007, Condition A  
42°C/W (degrees Celsius per Watt)  
ermal Resistance (θ  
ermal Resistance (θ  
)
)
JA  
JC  
15°C/W (degrees Celsius per Watt)  
4 of 10  
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pe & Reel Dimensions  
00 pieces per reel  
mpliant to EIA-481  
Dimensions in Millimeters  
5 of 10  
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st Circuit for CMOS Output  
te 1: An external 0.01µF ceramic bypass capacitor in parallel with a 0.1µF high frequency ceramic bypass capacitor close  
ss than 2mm) to the package ground and supply voltage pin is required.  
te 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth (>300MHz)  
ssive probe is recommended.  
te 3: Capacitance value C includes sum of all probe and fixture capacitance.  
L
6 of 10  
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commended Solder Pad Dimensions  
erances = ±0.1  
Dimensions in Millimeters  
7 of 10  
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lder Reflow Profile  
h Temperature Infrared/Convection  
te: Temperatures shown are applied to body of  
vice.  
MAX to T (Ramp-up Rate)  
3°C/Second Maximum  
L
eheat  
Temperature Minimum (T MIN)  
150°C  
S
Temperature Typical (T TYP)  
175°C  
S
Temperature Maximum (T MAX)  
200°C  
S
Time (t )  
60 - 180 Seconds  
3°C/Second Maximum  
S
mp-up Rate (T to T )  
L
P
me Maintained Above:  
Temperature (T )  
217°C  
L
Time (t )  
60 - 150 Seconds  
260°C Maximum for 10 Seconds Maximum  
250°C +0/-5°C  
L
ak Temperature (T )  
P
rget Peak Temperature (T Target)  
P
me within 5°C of actual peak (t )  
P
20 - 40 Seconds  
mp-down Rate  
6°C/Second Maximum  
8 Minutes Maximum  
Level 1  
me 25°C to Peak Temperature (t)  
oisture Sensitivity Level  
8 of 10  
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w Temperature Infrared/Convection  
te: Temperatures shown are applied to body of  
vice.  
MAX to T (Ramp-up Rate)  
5°C/Second Maximum  
L
eheat  
Temperature Minimum (T MIN)  
N/A  
S
Temperature Typical (T TYP)  
150°C  
S
Temperature Maximum (T MAX)  
N/A  
S
Time (t )  
60 - 120 Seconds  
5°C/Second Maximum  
S
mp-up Rate (T to T )  
L
P
me Maintained Above:  
Temperature (T )  
150°C  
L
Time (t )  
200 Seconds Maximum  
L
ak Temperature (T )  
240°C Maximum  
P
rget Peak Temperature (T Target)  
240°C Maximum 2 Times / 230°C Maximum 1 Time  
10 Seconds Maximum 2 Times / 80 Seconds Maximum 1 Time  
P
me within 5°C of actual peak (t )  
P
mp-down Rate  
5°C/second Maximum  
me 25°C to Peak Temperature (t)  
oisture Sensitivity Level  
N/A  
Level 1  
h Temperature Manual Soldering  
te: Temperatures listed are applied to body of device.  
0°C Maximum for 5 Seconds Maximum, 2 times Maximum.  
w Temperature Manual Soldering  
te: Temperatures listed are applied to body of device.  
5°C Maximum for 10 Seconds Maximum, 2 times Maximum.  
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- Build A Part Number  
2 - Next Page  
Select the parameters that meet your requirements and then click  
Next  
Access these Part Number specific  
resources and tools  
Frequency in Megahertz (1 to 200):  
Some frequencies within this range may not be  
available  
Frequency Tolerance/Stability:  
Operating Temperature Range:  
Duty Cycle:  
Packaging Options:  
rt Numbering Guide  
TOOLS  
PRODUCT  
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