EH3500TS-75.001M [ECLIPTEK]

CMOS, Quartz Crystal Clock Oscillators XO (SPXO) HCMOS/TTL (CMOS) 5.0Vdc 4 Pad 3.2mm x 5.0mm Ceramic Surface Mount (SMD) Quartz Crystal Clock Oscillators XO (SPXO) HCMOS/TTL (CMOS) 5.0Vdc 4 Pad 3.2mm x 5.0mm Ceramic Surface Mount (SMD);


型号：	EH3500TS-75.001M
厂家：	Ecliptek
描述：	CMOS, Quartz Crystal Clock Oscillators XO (SPXO) HCMOS/TTL (CMOS) 5.0Vdc 4 Pad 3.2mm x 5.0mm Ceramic Surface Mount (SMD) Quartz Crystal Clock Oscillators XO (SPXO) HCMOS/TTL (CMOS) 5.0Vdc 4 Pad 3.2mm x 5.0mm Ceramic Surface Mount (SMD) 石英晶振
文件：	总10页 (文件大小：954K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Ecliptek | EH35 Series Oscillator

http://www.ecliptek.com/oscillators/EH35/

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EH35 Series Oscillator

Quartz Crystal Clock Oscillators XO (SPXO) HCMOS/TTL (CMOS) 5.0Vdc 4 Pad 3.2mm x 5.0mm Ceramic Surface Mount (SMD)

2011/65 +

168 SVHC

2015/863

Revision F 02/27/2015

Electrical Specifications

Nominal Frequency

1.000MHz to 155.520MHz

Some frequencies within this range may not be available.

Frequency Tolerance/Stability

(Inclusive of all conditions: Calibration Tolerance at 25°C, Frequency

Stability over the Operating Temperature Range, Supply Voltage

Change, Output Load Change, First Year Aging at 25°C, Shock, and

Vibration)

±100ppm Maximum

±50ppm Maximum

±25ppm Maximum

±20ppm Maximum

Aging at 25°C

±5ppm/year Maximum

Operating Temperature Range

0°C to +70°C

-40°C to +85°C

Supply Voltage

Input Current

5.0V

±10%

No Load

50mA Maximum

Output Voltage Logic High (V

)

= -16mA

2.4V

Minimum with TTL Load

Minimum with HCMOS Load

-0.4V

Output Voltage Logic Low (V

Duty Cycle

)

= +16mA

0.4V

0.5V

Maximum with TTL Load

Maximum with HCMOS Load

50 ±10(%) Measured at 1.4V

with TTL Load or at 50% of waveform

with HCMOS Load from 1MHz to 70MHz. Measured at 50% of

waveform above 70MHz.

50 ±5(%) Measured at 50% of waveform.

Rise Time/Fall Time

Load Drive Capability

Measured over 0.8V

waveform with HCMOS load.

6nSec Maximum from 1MHz to 70MHz

4nSec Maximum from 70.000001MHz to 155.520MHz

to 2.0V

with TTL load or from 20% to 80% of

10 TTL Load or 50pF HCMOS Load Maximum from 1MHz to 70MHz

5 TTL Load or 15pF HCMOS Load Maximum from 70.000001MHz to

155.520MHz

Output Logic Type

Pin 1 Connection

CMOS

Tri-State (Disabled Output: High Impedance)

Tri-State Input Voltage (Vih and Vil)

Absolute Clock Jitter

+2.2V

+0.8V

Minimum or No Connect to Enable Output

Maximum to Disable Output (High Impedance)

±250pSec Maximum, ±100pSec Typical

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One Sigma Clock Period Jitter

Start Up Time

±50pSec Maximum, ±30pSec Typical

10mSec Maximum

Storage Temperature

-55°C to +125°C

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Mechanical Dimensions

All Dimensions in Millimeters

Pin 1: Tri-State

Pin 2: Case Ground

Pin 3: Output

Pin 4: Supply Voltage

Marking Specifications

Line 1:

E XXXXXX

E = Ecliptek Designator

XXXXXX = Nominal Frequency in MHz (5 Digits + Decimal)

Line 2:

XXXXX

XXXXX = Ecliptek Manufacturing Identifier

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Environmental and Mechanical Specifications

Fine Leak Test

MIL-STD-883, Method 1014, Condition A

MIL-STD-883, Method 1014, Condition C

MIL-STD-202, Method 213, Condition C

MIL-STD-202, Method 210

Gross Leak Test

Mechanical Shock

Resistance to Soldering Heat

Resistance to Solvents

Solderability

MIL-STD-202, Method 215

MIL-STD-883, Method 2003

Temperature Cycling

Vibration

MIL-STD-883, Method 1010

MIL-STD-883, Method 2007, Condition A

40°C/W (degrees Celsius per Watt)

14°C/W (degrees Celsius per Watt)

Thermal Resistance (θ

)

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Tape & Reel Dimensions

1000 pieces per reel

Compliant to EIA-481

All Dimensions in Millimeters

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Test Circuit for TTL Output

Note 1: An external 0.1µF low frequency tantalum bypass capacitor in parallel with a 0.01µF high frequency ceramic bypass

capacitor close to the package ground and V pin is required.

Note 2: A low capacitance (<12pF), 10X attentuation factor, high impedance (>10Mohms), and high bandwidth (>300MHz)

passive probe is recommended.

Note 3: Capacitance value C includes sum of all probe and fixture capacitance.

Note 4: Resistance value R is shown in Table 1. See applicable specification sheet for â€˜Load Drive Capabilityâ€™.

Note 5: All diodes are MMBD7000, MMBD914, or equivalent.

Test Circuit for CMOS Output

Note 1: An external 0.1µF low frequency tantalum bypass capacitor in parallel with a 0.01µF high frequency ceramic bypass

capacitor close to the package ground and V

pin is required.

Note 2: A low capacitance (<12pF), 10X attentuation factor, high impedance (>10Mohms), and high bandwidth (>300MHz)

passive probe is recommended.

Note 3: Capacitance value C includes sum of all probe and fixture capacitance.

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Recommended Solder Pad Dimensions

Tolerances = ±0.1

All Dimensions in Millimeters

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Solder Reflow Profile

High Temperature Infrared/Convection

Note: Temperatures shown are applied to body of

device.

MAX to T (Ramp-up Rate)

3°C/Second Maximum

Preheat

- Temperature Minimum (T MIN)

150°C

- Temperature Typical (T TYP)

175°C

- Temperature Maximum (T MAX)

200°C

- Time (t )

60 - 180 Seconds

3°C/Second Maximum

Ramp-up Rate (T to T )

Time Maintained Above:

- Temperature (T )

217°C

- Time (t )

60 - 150 Seconds

260°C Maximum for 10 Seconds Maximum

250°C +0/-5°C

Peak Temperature (T )

Target Peak Temperature (T Target)

Time within 5°C of actual peak (t )

20 - 40 Seconds

Ramp-down Rate

6°C/Second Maximum

8 Minutes Maximum

Level 1

Time 25°C to Peak Temperature (t)

Moisture Sensitivity Level

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Low Temperature Infrared/Convection

Note: Temperatures shown are applied to body of

device.

MAX to T (Ramp-up Rate)

5°C/Second Maximum

Preheat

- Temperature Minimum (T MIN)

N/A

- Temperature Typical (T TYP)

150°C

- Temperature Maximum (T MAX)

N/A

- Time (t )

60 - 120 Seconds

5°C/Second Maximum

Ramp-up Rate (T to T )

Time Maintained Above:

- Temperature (T )

150°C

- Time (t )

200 Seconds Maximum

Peak Temperature (T )

240°C Maximum

Target Peak Temperature (T Target)

240°C Maximum 2 Times / 230°C Maximum 1 Time

10 Seconds Maximum 2 Times / 80 Seconds Maximum 1 Time

Time within 5°C of actual peak (t )

Ramp-down Rate

5°C/second Maximum

Time 25°C to Peak Temperature (t)

Moisture Sensitivity Level

N/A

Level 1

High Temperature Manual Soldering

Note: Temperatures listed are applied to body of device.

260°C Maximum for 5 Seconds Maximum, 2 times Maximum.

Low Temperature Manual Soldering

Note: Temperatures listed are applied to body of device.

185°C Maximum for 10 Seconds Maximum, 2 times Maximum.

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1 - Build A Part Number

2 - Next Page

Select the parameters that meet your requirements and then click

Access these Part Number specific

resources and tools

Frequency in Megahertz (1 to 155.520):

Some frequencies within this range may not be

available

Frequency Tolerance/Stability:

Operating Temperature Range:

Duty Cycle:

Packaging Options:

Part Numbering Guide

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