EH3720TTS-16.666M TR [ECLIPTEK]

OSCILLATORS 20PPM 0+70 2.5V 4 16.666MHZ TS CMOS 5.0X3.2 4PAD SMD;


型号：	EH3720TTS-16.666M TR
厂家：	Ecliptek
描述：	OSCILLATORS 20PPM 0+70 2.5V 4 16.666MHZ TS CMOS 5.0X3.2 4PAD SMD
文件：	总5页 (文件大小：165K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

RoHS

EH3720TTS-16.666M

EH37 20

T TS -16.666M

Series

Nominal Frequency

16.666MHz

RoHS Compliant (Pb-free) 2.5V 4 Pad 3.2mm x 5mm

Ceramic SMD LVCMOS Oscillator

Pin 1 Connection

Tri-State (High Impedance)

Frequency Tolerance/Stability

±20ppm Maximum

Duty Cycle

50 ±5(%)

Operating Temperature Range

0°C to +70°C

ELECTRICAL SPECIFICATIONS

Nominal Frequency

16.666MHz

Frequency Tolerance/Stability

±20ppm Maximum (Inclusive of all conditions: Calibration Tolerance at 25°C, Frequency Stability over the

Operating Temperature Range, Supply Voltage Change, Output Load Change, First Year Aging at 25°,

260°C Reflow, Shock, and Vibration)

Aging at 25°C

±5ppm/Year Maximum

Operating Temperature Range

Supply Voltage

0°C to +70°C

2.5Vdc ±5%

Input Current

6mA Maximum (No Load)

90% of Vdd Minimum (IOH = -8mA)

10% of Vdd Maximum (IOL = +8mA)

6nSec Maximum (Measured at 20% to 80% of waveform)

50 ±5(%) (Measured at 50% of waveform)

15pF Maximum

Output Voltage Logic High (Voh)

Output Voltage Logic Low (Vol)

Rise/Fall Time

Duty Cycle

Load Drive Capability

Output Logic Type

CMOS

Pin 1 Connection

Tri-State (High Impedance)

Tri-State Input Voltage (Vih and Vil)

90% of Vdd Minimum or No Connect to Enable Output, 10% of Vdd Maximum to Disable Output (High

Impedance)

Standby Current

10µA Maximum (Pin 1 = Ground)

±100pSec Maximum

10mSec Maximum

Absolute Clock Jitter

Start Up Time

Storage Temperature Range

-55°C to +125°C

ENVIRONMENTAL & MECHANICAL SPECIFICATIONS

ESD Susceptibility

MIL-STD-883, Method 3015, Class 1, HBM: 1500V

MIL-STD-883, Method 1014, Condition A

UL94-V0

Fine Leak Test

Flammability

Gross Leak Test

Mechanical Shock

Moisture Resistance

Moisture Sensitivity

Resistance to Soldering Heat

Resistance to Solvents

Solderability

MIL-STD-883, Method 1014, Condition C

MIL-STD-883, Method 2002, Condition B

MIL-STD-883, Method 1004

J-STD-020, MSL 1

MIL-STD-202, Method 210, Condition K

MIL-STD-202, Method 215

MIL-STD-883, Method 2003

Temperature Cycling

Vibration

MIL-STD-883, Method 1010, Condition B

MIL-STD-883, Method 2007, Condition A

www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/16/2010 | Page 1 of 5

EH3720TTS-16.666M

MECHANICAL DIMENSIONS (all dimensions in millimeters)

PIN CONNECTION

Tri-State

Case Ground

Output

1.20 ±0.20

3.20

1.00 ±0.20 (x4)

±0.20

Supply Voltage

LINE MARKING

EPO

XXXXX

XXXXX=Ecliptek

Manufacturing Identifier

5.00

±0.20

2.54

±0.15

1.20

±0.20

(x4)

2.20

±0.15

1.3

MAX

Suggested Solder Pad Layout

All Dimensions in Millimeters

1.2 (X4)

1.4 (X4)

Solder Land

(X4)

1.14

1.0

All Tolerances are ±0.1

www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/16/2010 | Page 2 of 5

EH3720TTS-16.666M

OUTPUT WAVEFORM & TIMING DIAGRAM

VIH

VIL

VOH

80% of Waveform

OUTPUT DISABLE

(HIGH IMPEDANCE

STATE)

50% of Waveform

20% of Waveform

VOL

tPLZ

tPZL

Fall

Time

Rise

Time

Duty Cycle (%) = TW/T x 100

Test Circuit for CMOS Output

Frequency

Counter

Oscilloscope

Probe

(Note 2)

Supply

Voltage

(V_DD

)

Output

Current

Meter

Power

Supply

0.01µF

(Note 1)

Voltage

Meter

0.1µF

(Note 1)

C_L

(Note 3)

Ground

Tri-State

Note 1: An external 0.1µF low frequency tantalum bypass capacitor in parallel with a 0.01µF high frequency

ceramic bypass capacitor close to the package ground and V_DDpin is required.

Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth

(>300MHz) passive probe is recommended.

Note 3: Capacitance value C_Lincludes sum of all probe and fixture capacitance.

www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/16/2010 | Page 3 of 5

EH3720TTS-16.666M

Recommended Solder Reflow Methods

Critical Zone

T_Lto T_P

T_P

Ramp-up

Ramp-down

T_L

T_SMax

T_SMin

t_L

t_P

t_SPreheat

t 25°C to Peak

Time (t)

High Temperature Infrared/Convection

TS MAX to TL (Ramp-up Rate)

3°C/second Maximum

Preheat

- Temperature Minimum (TS MIN)

- Temperature Typical (TS TYP)

- Temperature Maximum (TS MAX)

- Time (tS MIN)

150°C

175°C

200°C

60 - 180 Seconds

Ramp-up Rate (TL to TP)

3°C/second Maximum

Time Maintained Above:

- Temperature (TL)

- Time (tL)

217°C

60 - 150 Seconds

Peak Temperature (TP)

260°C Maximum for 10 Seconds Maximum

250°C +0/-5°C

Target Peak Temperature (TP Target)

Time within 5°C of actual peak (tp)

Ramp-down Rate

20 - 40 seconds

6°C/second Maximum

8 minutes Maximum

Level 1

Time 25°C to Peak Temperature (t)

Moisture Sensitivity Level

www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/16/2010 | Page 4 of 5

EH3720TTS-16.666M

Recommended Solder Reflow Methods

Critical Zone

T_Lto T_P

T_P

Ramp-up

Ramp-down

T_L

T_SMax

T_SMin

t_L

t_P

t_SPreheat

t 25°C to Peak

Time (t)

Low Temperature Infrared/Convection 240°C

TS MAX to TL (Ramp-up Rate)

5°C/second Maximum

Preheat

- Temperature Minimum (TS MIN)

- Temperature Typical (TS TYP)

- Temperature Maximum (TS MAX)

- Time (tS MIN)

N/A

150°C

N/A

60 - 120 Seconds

Ramp-up Rate (TL to TP)

5°C/second Maximum

Time Maintained Above:

- Temperature (TL)

- Time (tL)

150°C

200 Seconds Maximum

Peak Temperature (TP)

240°C Maximum

Target Peak Temperature (TP Target)

Time within 5°C of actual peak (tp)

Ramp-down Rate

240°C Maximum 1 Time / 230°C Maximum 2 Times

10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time

5°C/second Maximum

Time 25°C to Peak Temperature (t)

Moisture Sensitivity Level

N/A

Level 1

Low Temperature Manual Soldering

185°C Maximum for 10 seconds Maximum, 2 times Maximum.

High Temperature Manual Soldering

260°C Maximum for 5 seconds Maximum, 2 times Maximum.

www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/16/2010 | Page 5 of 5

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