EH3725ETTTS-14.8345MTR [ECLIPTEK]

CRYSTAL OSCILLATOR, CLOCK, CMOS OUTPUT;


型号：	EH3725ETTTS-14.8345MTR
厂家：	Ecliptek
描述：	CRYSTAL OSCILLATOR, CLOCK, CMOS OUTPUT 输出元件
文件：	总10页 (文件大小：795K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Ecliptek | EH37 Series Oscillator

http://www.ecliptek.com/oscillators/EH37/

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EH37 Series Oscillator

Quartz Crystal Clock Oscillators XO (SPXO) LVCMOS (CMOS) 2.5Vdc 4 Pad 3.2mm x 5.0mm Ceramic Surface Mount (SMD)

2011/65 +

168 SVHC

2015/863

Revision E 03/12/2015

Electrical Specifications

Nominal Frequency

1.000MHz to 200.000MHz

Some frequencies within this range may not be available.

Frequency

(Inclusive of all conditions: Calibration Tolerance at 25°C, Frequency Stability over the

Tolerance/Stability

Operating Temperature Range, Supply Voltage Change, Output Load Change, First Year

Aging at 25°C, Shock, and Vibration)

±100ppm Maximum

±50ppm Maximum

±25ppm Maximum

±20ppm Maximum

Operating Temperature

Range

0°C to +70°C

-40°C to +85°C

Aging at 25°C

Supply Voltage

±5ppm/year Maximum

2.5V

±5%

Input Current (No

Load)

6mA Maximum over Nominal Frequency of 1.000MHz to 25.000MHz

7mA Maximum over Nominal Frequency of 25.000001MHz to 75.000MHz

8mA Maximum over Nominal Frequency of 75.000001MHz to 100.000MHz

9mA Maximum over Nominal Frequency of 100.000001MHz to 200.000MHz

Output Voltage Logic

= -8mA

High (V

)

90% of V

Minimum

Maximum

Output Voltage Logic

Low (V

= +8mA

10% of V

)

Duty Cycle

Measured at 50% of Waveform

50 ±10(%)

50 ±5(%)

Rise Time/Fall Time

Measured at 20% to 80% of Waveform

6nSec Maximum from 1.000MHz to 50.000MHz

4nSec Maximum from 50.000001MHz to 75.000MHz

2nSec Maximum from 75.000001MHz to 200.000MHz

Load Drive Capability

Output Logic Type

Pin 1 Connection

15pF Maximum

CMOS

Tri-State (High Impedance)

Tri-State Input Voltage

90% of V

10% of V

Minimum or No Connection to Enable Output

Maximum to Disable Output (High Impedance)

Standby Current

RMS Phase Jitter

10µA Maximum (Pin 1 = Ground)

Fj=12kHz to 20MHz

20pSec Typical, 30pSec Maximum

Period Jitter (RMS)

13pSec Typical

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Period Jitter (pk-pk)

Start Up Time

85pSec Typical, 100pSec Maximum

10mSec Maximum

Storage Temperature

-55°C to +125°C

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Mechanical Dimensions

All Dimensions in Millimeters

Pin 1: Tri-State

Pin 2: Case Ground

Pin 3: Output

Pin 4: Supply Voltage

Marking Specifications

Line 1:

EXXXXXX

E = Ecliptek Designator

XXXXXX = Nominal Frequency in MHz (5 Digits + Decimal)

Line 2:

XXXXX

XXXXX = Ecliptek Manufacturing Identifier

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Environmental and Mechanical Specifications

ESD Susceptibility

Fine Leak Test

MIL-STD-883, Method 3015, Class 1, HBM:1500V

MIL-STD-883, Method 1014, Condition A

UL94-V0

Flammability

Gross Leak Test

MIL-STD-883, Method 1014, Condition C

MIL-STD-883, Method 2002, Condition B

MIL-STD-883, Method 1004

Mechanical Shock

Moisture Resistance

Moisture Sensitivity

Resistance to Soldering Heat

Resistance to Solvents

Solderability

J-STD-020, MSL 1

MIL-STD-202, Method 210, Condition K

MIL-STD-202, Method 215

MIL-STD-883, Method 2003

Temperature Cycling

Vibration

MIL-STD-883, Method 1010, Condition B

MIL-STD-883, Method 2007, Condition A

40°C/W (degrees Celsius per Watt)

Thermal Resistance (θ

)

14°C/W (degrees Celsius per Watt)

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Tape & Reel Dimensions

1000 pieces per reel

Compliant to EIA-481

All Dimensions in Millimeters

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CMOS Test Circuit

Note 1: An external 0.1µF low frequency tantalum bypass capacitor in parallel with a 0.01µF high frequency ceramic bypass

capacitor close to the package ground and supply voltage pin is required.

Note 2: A low input capacitance (<12pF), 10X Attentuation Factor, High Impedance (>10Mohms), and High bandwidth

(>300MHz) passive probe is recommended.

Note 3: Capacitance value (C ) includes sum of all probe and fixture capacitance. See applicable specification sheet for

‘Load Drive Capability’.

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Recommended Solder Pad Dimensions

Tolerances = ±0.1

All Dimensions in Millimeters

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Solder Reflow Profile

High Temperature Infrared/Convection

Note: Temperatures shown are applied to body of

device.

MAX to T (Ramp-up Rate)

3°C/Second Maximum

Preheat

- Temperature Minimum (T MIN)

150°C

- Temperature Typical (T TYP)

175°C

- Temperature Maximum (T MAX)

200°C

- Time (t )

60 - 180 Seconds

3°C/Second Maximum

Ramp-up Rate (T to T )

Time Maintained Above:

- Temperature (T )

217°C

- Time (t )

60 - 150 Seconds

260°C Maximum for 10 Seconds Maximum

250°C +0/-5°C

Peak Temperature (T )

Target Peak Temperature (T Target)

Time within 5°C of actual peak (t )

20 - 40 Seconds

Ramp-down Rate

6°C/Second Maximum

8 Minutes Maximum

Level 1

Time 25°C to Peak Temperature (t)

Moisture Sensitivity Level

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Low Temperature Infrared/Convection

Note: Temperatures shown are applied to body of

device.

MAX to T (Ramp-up Rate)

5°C/Second Maximum

Preheat

- Temperature Minimum (T MIN)

N/A

- Temperature Typical (T TYP)

150°C

- Temperature Maximum (T MAX)

N/A

- Time (t )

60 - 120 Seconds

5°C/Second Maximum

Ramp-up Rate (T to T )

Time Maintained Above:

- Temperature (T )

150°C

- Time (t )

200 Seconds Maximum

Peak Temperature (T )

240°C Maximum

Target Peak Temperature (T Target)

240°C Maximum 2 Times / 230°C Maximum 1 Time

10 Seconds Maximum 2 Times / 80 Seconds Maximum 1 Time

Time within 5°C of actual peak (t )

Ramp-down Rate

5°C/Second Maximum

Time 25°C to Peak Temperature (t)

Moisture Sensitivity Level

N/A

Level 1

High Temperature Manual Soldering

Note: Temperatures listed are applied to body of device.

260°C Maximum for 5 Seconds Maximum, 2 times Maximum.

Low Temperature Manual Soldering

Note: Temperatures listed are applied to body of device.

185°C Maximum for 10 Seconds Maximum, 2 times Maximum.

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1 - Build A Part Number

2 - Next Page

Select the parameters that meet your requirements and then click

Access these Part Number specific

resources and tools

Frequency in Megahertz (1 to 200):

Some frequencies within this range may not be

available

Frequency Tolerance/Stability:

Operating Temperature Range:

Duty Cycle:

Packaging Options:

Part Numbering Guide

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