EH4645TS-18.432MTR [ECLIPTEK]

CRYSTAL OSCILLATOR, CLOCK, 18.432MHz, LVCMOS OUTPUT, ROHS COMPLIANT, CERAMIC, SMD, 4 PIN;


型号：	EH4645TS-18.432MTR
厂家：	Ecliptek
描述：	CRYSTAL OSCILLATOR, CLOCK, 18.432MHz, LVCMOS OUTPUT, ROHS COMPLIANT, CERAMIC, SMD, 4 PIN 机械输出元件振荡器
文件：	总6页 (文件大小：253K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

RoHS

EH4645TS-18.432M TR

EH46 45

TS -18.432M TR

Series

Packaging Options

RoHS Compliant (Pb-free) 3.3V 4 Pad 2.5mm x 3.2mm

Ceramic SMD LVCMOS Oscillator

Tape & Reel

Nominal Frequency

Frequency Tolerance/Stability

±50ppm Maximum

18.432MHz

Pin 1 Connection

Tri-State (High Impedance)

Operating Temperature Range

0°C to +70°C

Duty Cycle

50 ±10(%)

ELECTRICAL SPECIFICATIONS

Nominal Frequency

18.432MHz

Frequency Tolerance/Stability

±50ppm Maximum (Inclusive of all conditions: Calibration Tolerance at 25°C, Frequency Stability over the

Operating Temperature Range, Supply Voltage Change, Output Load Change, First Year Aging at 25°,

260°C Reflow, Shock, and Vibration)

Aging at 25°C

±5ppm/Year Maximum

Operating Temperature Range

Supply Voltage

0°C to +70°C

3.3Vdc ±5%

Input Current

10mA Maximum (No Load)

90% of Vdd Minimum (IOH = -8mA)

10% of Vdd Maximum (IOL = +8mA)

6nSec Maximum (Measured at 20% to 80% of waveform)

50 ±10(%) (Measured at 50% of waveform)

30pF Maximum

Output Voltage Logic High (Voh)

Output Voltage Logic Low (Vol)

Rise/Fall Time

Duty Cycle

Load Drive Capability

Output Logic Type

CMOS

Pin 1 Connection

Tri-State (High Impedance)

Tri-State Input Voltage (Vih and Vil)

90% of Vdd Minimum or No Connect to Enable Output, 10% of Vdd Maximum to Disable Output (High

Impedance)

Standby Current

10µA Maximum (Pin 1 = Ground)

±100pSec Maximum

10mSec Maximum

Absolute Clock Jitter

Start Up Time

Storage Temperature Range

-55°C to +125°C

ENVIRONMENTAL & MECHANICAL SPECIFICATIONS

ESD Susceptibility

MIL-STD-883, Method 3015, Class 1, HBM: 1500Vdc

MIL-STD-883, Method 1014, Condition A

UL94-V0

Fine Leak Test

Flammability

Gross Leak Test

Mechanical Shock

Moisture Resistance

Moisture Sensitivity

Resistance to Soldering Heat

Resistance to Solvents

Solderability

MIL-STD-883, Method 1014, Condition C

MIL-STD-883, Method 2002, Condition B

MIL-STD-883, Method 1004

J-STD-020, MSL 1

MIL-STD-202, Method 210, Condition K

MIL-STD-202, Method 215

MIL-STD-883, Method 2003

Temperature Cycling

Vibration

MIL-STD-883, Method 1010, Condition B

MIL-STD-883, Method 2007, Condition A

www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 8/14/2010 | Page 1 of 6

EH4645TS-18.432M TR

MECHANICAL DIMENSIONS (all dimensions in millimeters)

PIN CONNECTION

Tri-State

1.05

2.50

±0.15

Case Ground

Output

0.75 ±0.10 (X4)

±0.15

Supply Voltage

LINE MARKING

EPO

1.20

±0.10

3.20

±0.15

1.00

±0.10

XXXXX

XXXXX=Ecliptek

Manufacturing Identifier

1.00

±0.10

Suggested Solder Pad Layout

All Dimensions in Millimeters

0.95 (X4)

1.20 (X4)

Solder Land

(X4)

1.00

0.80

All Tolerances are ±0.1

www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 8/14/2010 | Page 2 of 6

EH4645TS-18.432M TR

OUTPUT WAVEFORM & TIMING DIAGRAM

VIH

VIL

VOH

80% of Waveform

OUTPUT DISABLE

(HIGH IMPEDANCE

STATE)

50% of Waveform

20% of Waveform

VOL

tPLZ

tPZL

Fall

Time

Rise

Time

Duty Cycle (%) = TW/T x 100

Test Circuit for CMOS Output

Frequency

Counter

Oscilloscope

Probe

(Note 2)

Supply

Voltage

(V_DD

)

Output

Current

Meter

Power

Supply

0.01µF

(Note 1)

Voltage

Meter

0.1µF

(Note 1)

C_L

(Note 3)

Ground

Tri-State

Note 1: An external 0.01µF ceramic bypass capacitor in parallel with a 0.1µF high frequency

ceramic bypass capacitor close (less than 2mm) to the package ground and supply voltage

pin is required.

Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth

(>300MHz) passive probe is recommended.

Note 3: Capacitance value C_Lincludes sum of all probe and fixture capacitance.

www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 8/14/2010 | Page 3 of 6

EH4645TS-18.432M TR

Tape & Reel Dimensions

Quantity Per Reel: 1,000 units

4.00 ±0.10

2.00 ±0.05

1.5 +0.1/-0.0

0.60 MAX

5.5 ±0.10

12.00 ±0.30

4.75 ±0.10

B0*

4.00 ±0.10

A0*

K0*

*Compliant to EIA 481A

1.5 MIN

18.4 MAX

DIA 40 MIN

Access Hole at

Slot Location

180 MAX

DIA 50 MIN

2.5 MIN Width

10.0 MIN Depth

Tape slot in Core

for Tape Start

DIA 20.2 MIN

DIA 13.0 ±0.2

12.4 +2.0/-0.0

www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 8/14/2010 | Page 4 of 6

EH4645TS-18.432M TR

Recommended Solder Reflow Methods

Critical Zone

T_Lto T_P

T_P

Ramp-up

Ramp-down

T_L

T_SMax

T_SMin

t_L

t_P

t_SPreheat

t 25°C to Peak

Time (t)

High Temperature Infrared/Convection

TS MAX to TL (Ramp-up Rate)

3°C/second Maximum

Preheat

- Temperature Minimum (TS MIN)

- Temperature Typical (TS TYP)

- Temperature Maximum (TS MAX)

- Time (tS MIN)

150°C

175°C

200°C

60 - 180 Seconds

Ramp-up Rate (TL to TP)

3°C/second Maximum

Time Maintained Above:

- Temperature (TL)

- Time (tL)

217°C

60 - 150 Seconds

Peak Temperature (TP)

260°C Maximum for 10 Seconds Maximum

250°C +0/-5°C

Target Peak Temperature (TP Target)

Time within 5°C of actual peak (tp)

Ramp-down Rate

20 - 40 seconds

6°C/second Maximum

8 minutes Maximum

Level 1

Time 25°C to Peak Temperature (t)

Moisture Sensitivity Level

www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 8/14/2010 | Page 5 of 6

EH4645TS-18.432M TR

Recommended Solder Reflow Methods

Critical Zone

T_Lto T_P

T_P

Ramp-up

Ramp-down

T_L

T_SMax

T_SMin

t_L

t_P

t_SPreheat

t 25°C to Peak

Time (t)

Low Temperature Infrared/Convection 240°C

TS MAX to TL (Ramp-up Rate)

5°C/second Maximum

Preheat

- Temperature Minimum (TS MIN)

- Temperature Typical (TS TYP)

- Temperature Maximum (TS MAX)

- Time (tS MIN)

N/A

150°C

N/A

60 - 120 Seconds

Ramp-up Rate (TL to TP)

5°C/second Maximum

Time Maintained Above:

- Temperature (TL)

- Time (tL)

150°C

200 Seconds Maximum

Peak Temperature (TP)

240°C Maximum

Target Peak Temperature (TP Target)

Time within 5°C of actual peak (tp)

Ramp-down Rate

240°C Maximum 1 Time / 230°C Maximum 2 Times

10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time

5°C/second Maximum

Time 25°C to Peak Temperature (t)

Moisture Sensitivity Level

N/A

Level 1

Low Temperature Manual Soldering

185°C Maximum for 10 seconds Maximum, 2 times Maximum.

High Temperature Manual Soldering

260°C Maximum for 5 seconds Maximum, 2 times Maximum.

www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 8/14/2010 | Page 6 of 6

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