EMDS13D2H-50.000MTR [ECLIPTEK]

CRYSTAL OSCILLATOR, CLOCK, 50MHz, LVDS OUTPUT, ROHS COMPLIANT, PLASTIC, SMD, 6 PIN;


型号：	EMDS13D2H-50.000MTR
厂家：	Ecliptek
描述：	CRYSTAL OSCILLATOR, CLOCK, 50MHz, LVDS OUTPUT, ROHS COMPLIANT, PLASTIC, SMD, 6 PIN 机械输出元件振荡器
文件：	总6页 (文件大小：276K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

RoHS

EMDS13D2H-50.000M TR

EMDS13 D 2 H -50.000M TR

Series

Packaging Options

RoHS Compliant (Pb-free) 3.3V 6 Pad 5mm x 7mm

Plastic SMD LVDS MEMS Oscillator

Tape & Reel

Nominal Frequency

Frequency Tolerance/Stability

±50ppm Maximum over 0°C to +70°C

50.000MHz

Logic Control / Additional Output

Output Enable (OE) and Complementary Output

Duty Cycle

50 ±5(%)

ELECTRICAL SPECIFICATIONS

Nominal Frequency

50.000MHz

Frequency Tolerance/Stability

±50ppm Maximum over 0°C to +70°C (Inclusive of all conditions: Calibration Tolerance at 25°C, Frequency

Stability over the Operating Temperature Range, Supply Voltage Change, Output Load Change, 1st Year

Aging at 25°C, Reflow, Shock, and Vibration)

Aging at 25°C

±1ppm First Year Maximum

Supply Voltage

+3.3Vdc ±0.3Vdc

Input Current

80mA Maximum (Excluding Load Termination Current)

1.425Vdc Typical

Output Voltage Logic High (Voh)

Output Voltage Logic Low (Vol)

Differential Output Voltage (Vod)

Offset Voltage (Vos)

1.075Vdc Typical

247mVdc Minimum, 350mVdc Typical, 454mVdc Maximum

1.125V Minimum, 1.250V Typical, 1.375V Maximum

225pSec Typical, 325pSec Maximum (Measured over 20% to 80% of waveform)

50mVdc Maximum

Rise/Fall Time

Differential Output Error (dVod)

Duty Cycle

50 ±5(%) (Measured at 50% of waveform)

50mVdc Maximum

Offset Error (dVos)

Load Drive Capability

Output Logic Type

100 Ohms Between Output and Complementary Output

LVDS

Logic Control / Additional Output

Output Control Input Voltage

Output Enable (OE) and Complementary Output

Vih of 70% of Vcc Minimum or No Connect to Enable Output and Complementary Output, Vil of 30% of Vcc

Maximum to Disable Output and Complementary Output (High Impedance)

Output Enable Current

Period Jitter (Deterministic)

Period Jitter (Random)

Period Jitter (RMS)

75mA Maximum (OE) Without Load

0.2pSec Typical

2.0pSec Typical

1.8pSec Typical, 2.5pSec Maximum

25pSec Typical, 30pSec Maximum

2.1pSec Typical

Period Jitter (pk-pk)

RMS Phase Jitter (Fj = 637kHz to

10MHz; Random)

RMS Phase Jitter (Fj = 1MHz to

20MHz; Random)

1.7pSec Typical

1.5pSec Typical

RMS Phase Jitter (Fj = 1.875MHz to

20MHz; Random)

Start Up Time

10mSec Maximum

-55°C to +125°C

Storage Temperature Range

ENVIRONMENTAL & MECHANICAL SPECIFICATIONS

ESD Susceptibility

MIL-STD-883, Method 3015, Class 2, HBM 2000V

Flammability

UL94-V0

Mechanical Shock

MIL-STD-883, Method 2002, Condition G, 30,000G

MIL-STD-883, Method 1004

Moisture Resistance

Moisture Sensitivity Level

Resistance to Soldering Heat

Resistance to Solvents

Solderability

J-STD-020, MSL 1

MIL-STD-202, Method 210, Condition K

MIL-STD-202, Method 215

MIL-STD-883, Method 2003 (Six I/O Pads on bottom of package only)

MIL-STD-883, Method 1010, Condition B

Temperature Cycling

www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 8/13/2010 | Page 1 of 6

EMDS13D2H-50.000M TR

ENVIRONMENTAL & MECHANICAL SPECIFICATIONS

Thermal Shock

MIL-STD-883, Method 1011, Condition B

Vibration

MIL-STD-883, Method 2007, Condition A, 20G

MECHANICAL DIMENSIONS (all dimensions in millimeters)

PIN CONNECTION

0.85

±0.15

1.20 ±0.10 (x4)

1.47

Output Enable (OE)

5.00

±0.15

No Connect

0.08

MAX

Case Ground

Output

Complementary Output

Supply Voltage

7.00

±0.15

5.08

±0.10

2.30

LINE MARKING

XXXX or XXXXX

XXXX or XXXXX=Ecliptek

Manufacturing Lot Code

2.54 TYP

2.60

±0.15

1.40

±0.10 (x4)

Note A: Center paddle is connected

internally to oscillator ground (Pad 3).

Suggested Solder Pad Layout

All Dimensions in Millimeters

1.80 (X6)

2.00 (X6)

0.54 (X4)

Solder Land

2.39 (X3)

(X6)

All Tolerances are ±0.1

www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 8/13/2010 | Page 2 of 6

EMDS13D2H-50.000M TR

OUTPUT WAVEFORM & TIMING DIAGRAM

VIH

VIL

VOH

HIGH IMPEDANCE

STATE

VOS

VOL

VOD

80%

HIGH IMPEDANCE

STATE

VOp-p

20%

tPLZ

tPZL

Fall

Time

Rise

Time

Duty Cycle (%) = TW/T x 100

Test Circuit for Tri-State and Complementary Output

Frequency

Counter

Oscilloscope

Probe 2

(Note 2)

Probe 1

(Note 2)

Supply

Voltage

(V_DD

)

100 Ohms

Current

Meter

Output

Complementary

Output

0.1µF

(Note 1)

0.01µF

(Note 1)

Switch

Ground

Power

Supply

Voltage

Meter

Power

Supply

Tri-State

Connect

Note 1: An external 0.01µF ceramic bypass capacitor in parallel with a 0.1µF high frequency ceramic bypass capacitor close (less than 2mm)

to the package ground and supply voltage pin is required.

Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth (>500MHz) passive probe is

recommended.

Note 3: Test circuit PCB traces need to be designed for a characteristic line impedance of 50 ohms.

www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 8/13/2010 | Page 3 of 6

EMDS13D2H-50.000M TR

Tape & Reel Dimensions

Quantity Per Reel: 1,000 units

4.0 ±0.2

2.0 ±0.2

DIA 1.5 ±0.1

0.30 ±0.05

7.5 ±0.2

16.0 ±0.3

A0*

6.75 ±0.20

8.0 ±0.2

B0*

K0*

*Compliant to EIA 481A

1.5 MIN

22.4 MAX

DIA 40 MIN

Access Hole at

Slot Location

180 MAX

DIA 50 MIN

2.5 MIN Width

10.0 MIN Depth

Tape slot in Core

for Tape Start

DIA 20.2 MIN

DIA 13.0 ±0.2

16.4 +2.0/-0

www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 8/13/2010 | Page 4 of 6

EMDS13D2H-50.000M TR

Recommended Solder Reflow Methods

Critical Zone

T_Lto T_P

T_P

Ramp-up

Ramp-down

T_L

T_SMax

T_SMin

t_L

t_P

t_SPreheat

t 25°C to Peak

Time (t)

High Temperature Infrared/Convection

TS MAX to TL (Ramp-up Rate)

3°C/second Maximum

Preheat

- Temperature Minimum (TS MIN)

- Temperature Typical (TS TYP)

- Temperature Maximum (TS MAX)

- Time (tS MIN)

150°C

175°C

200°C

60 - 180 Seconds

Ramp-up Rate (TL to TP)

3°C/second Maximum

Time Maintained Above:

- Temperature (TL)

- Time (tL)

217°C

60 - 150 Seconds

Peak Temperature (TP)

260°C Maximum for 10 Seconds Maximum

250°C +0/-5°C

Target Peak Temperature (TP Target)

Time within 5°C of actual peak (tp)

Ramp-down Rate

20 - 40 seconds

6°C/second Maximum

8 minutes Maximum

Level 1

Time 25°C to Peak Temperature (t)

Moisture Sensitivity Level

www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 8/13/2010 | Page 5 of 6

EMDS13D2H-50.000M TR

Recommended Solder Reflow Methods

Critical Zone

T_Lto T_P

T_P

Ramp-up

Ramp-down

T_L

T_SMax

T_SMin

t_L

t_P

t_SPreheat

t 25°C to Peak

Time (t)

Low Temperature Infrared/Convection 240°C

TS MAX to TL (Ramp-up Rate)

5°C/second Maximum

Preheat

- Temperature Minimum (TS MIN)

- Temperature Typical (TS TYP)

- Temperature Maximum (TS MAX)

- Time (tS MIN)

N/A

150°C

N/A

60 - 120 Seconds

Ramp-up Rate (TL to TP)

5°C/second Maximum

Time Maintained Above:

- Temperature (TL)

- Time (tL)

150°C

200 Seconds Maximum

Peak Temperature (TP)

240°C Maximum

Target Peak Temperature (TP Target)

Time within 5°C of actual peak (tp)

Ramp-down Rate

240°C Maximum 1 Time / 230°C Maximum 2 Times

10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time

5°C/second Maximum

Time 25°C to Peak Temperature (t)

Moisture Sensitivity Level

N/A

Level 1

Low Temperature Manual Soldering

185°C Maximum for 10 seconds Maximum, 2 times Maximum.

High Temperature Manual Soldering

260°C Maximum for 5 seconds Maximum, 2 times Maximum.

www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 8/13/2010 | Page 6 of 6

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